Laser-Assisted Bonding for MicroLED Modules in Head-Up Display Applications

Q4 Engineering

Information Display Pub Date : 2025-09-23 DOI:10.1002/msid.1607

Wenya Tian, Yiran Wu, Yuanhao Sun, Peilin Zhang, Yatong Qiao, Ming Chen

引用次数: 0

Abstract

The microLED mass transfer process is a critical step in display manufacturing. Laser-assisted eutectic bonding significantly improves photoelectric efficiency, accelerating microLED display commercialization.

Abstract Image

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平视显示应用中微led模组的激光辅助键合

微led传质过程是显示屏制造的关键步骤。激光辅助共晶键合显著提高了光电效率，加速了微led显示屏的商业化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Information Display Engineering-Electrical and Electronic Engineering

CiteScore

1.40

自引率

0.00%

发文量

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