Enabling Next-Generation MicroLED Displays Through ACF-Based Bonding Solutions

Q4 Engineering

Information Display Pub Date : 2025-09-23 DOI:10.1002/msid.1608

Hiroki Ozeki, Reiji Tsukao, Yasumasa Shin

引用次数: 0

Abstract

Novel particle-arrayed anisotropic conductive film enables reliable, low-temperature bonding on ultra-small pads, addressing key manufacturing challenges.

Abstract Image

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通过基于acf的键合解决方案实现下一代MicroLED显示屏

新型颗粒阵列各向异性导电膜可在超小型焊盘上实现可靠的低温粘合，解决了关键的制造挑战。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Information Display Engineering-Electrical and Electronic Engineering

CiteScore

1.40

自引率

0.00%

发文量

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