Flexible and Printed Electronics最新文献

Dry printing fully functional eco-friendly and disposable transient papertronics 干式印刷全功能环保型一次性瞬态纸张电子元件

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-08-29 DOI: 10.1088/2058-8585/ad70c5

Adib Taba, Aarsh Patel, Masoud Mahjouri-Samani

{"title":"Dry printing fully functional eco-friendly and disposable transient papertronics","authors":"Adib Taba, Aarsh Patel, Masoud Mahjouri-Samani","doi":"10.1088/2058-8585/ad70c5","DOIUrl":"https://doi.org/10.1088/2058-8585/ad70c5","url":null,"abstract":"The demand for flexible printed electronics is growing fast, especially with the move toward the Internet of Things. These printed electrons are usually designed for short-term use, after which they are disposed of. The polymeric substrates used in printed electronics comprise the biggest portion of their non-biodegradable E-waste after their disposal. This paper demonstrates the feasibility of printing fully functional transient electronics on flexible, water-soluble, and biodegradable paper substrates using the dry printing approach. The <italic toggle=\"yes\">in-situ</italic> generation and real-time sintering of silver nanoparticles at room temperature enables the fabrication of complex circuits on such water-soluble papers. A layout similar to an Arduino pro mini board is printed on both sides of a paper substrate with electrical interconnects. Various electrical components are then directly mounted to fabricate a complete, working paper Arduino circuit. Cyclic bending tests demonstrate the mechanical durability and reliability of printed paper circuits under repeated bending stress. The process uniquely achieves robust and complex printed electronics without thermal damage, and the water solubility tests successfully show rapid dissolution of the paper devices in water. Furthermore, the components detached during dissolution are collected and reused, demonstrating the recyclability of the process. Overall, this transformative manufacturing method establishes key technical capabilities to produce next-generation sustainable, green electronics and sensors using renewable materials.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":"9 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142188686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Flexible intracortical probes for stable neural recording: from the perspective of structure 用于稳定神经记录的灵活皮层内探针：从结构的角度看问题

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-08-29 DOI: 10.1088/2058-8585/ad71dc

Suhao Wang, Qianqian Jiang, Jizhou Song

引用次数: 0

End-of-life options for printed electronics in municipal solid waste streams: a review of the challenges, opportunities, and sustainability implications 城市固体废物流中印刷电子产品的报废选择：对挑战、机遇和可持续性影响的审查

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-08-27 DOI: 10.1088/2058-8585/ad699b

Mohammad Naji Nassajfar, Mariam Abdulkareem, Mika Horttanainen

引用次数: 0

Transparent and flexible fish-tail shaped antenna for ultra-wideband MIMO systems 用于超宽带多输入多输出系统的透明柔性鱼尾形天线

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-08-14 DOI: 10.1088/2058-8585/ad6883

Shilin Lian, Haoyuan Sun, Hua Zhang, Dan Zhang, Tian Liu, Zhejun Jin, Yu Zheng

引用次数: 0

Recent advances in encapsulation strategies for flexible transient electronics 柔性瞬态电子封装策略的最新进展

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-08-14 DOI: 10.1088/2058-8585/ad6a6c

Won Bae Han, Suk-Won Hwang, Woon-Hong Yeo

引用次数: 0

Effects of transparent conducting electrodes and hole transport layers on the performance of MAPbI3 solar cells fabricated on PET substrates 透明导电电极和空穴传输层对 PET 基底上制造的 MAPbI3 太阳能电池性能的影响

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-07-09 DOI: 10.1088/2058-8585/ad5d01

Bishal Bhandari, Justin C Bonner, Robert T Piper, Julia W P Hsu

{"title":"Effects of transparent conducting electrodes and hole transport layers on the performance of MAPbI3 solar cells fabricated on PET substrates","authors":"Bishal Bhandari, Justin C Bonner, Robert T Piper, Julia W P Hsu","doi":"10.1088/2058-8585/ad5d01","DOIUrl":"https://doi.org/10.1088/2058-8585/ad5d01","url":null,"abstract":"This study investigates how the performance of perovskite solar cells (PSCs) made on polyethylene terephthalate (PET) substrates depends on transparent conducting electrodes (TCEs) and hole transport layers (HTLs). We fabricated PSCs using commercially available PET/TCEs and compared their performance with PSCs manufactured on Glass/indium tin oxide (ITO) substrates. Poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) with varying levels of acidity and NiO nanoparticles were used as HTLs. The current density-voltage characteristics of PSCs made on PET/TCEs were found to be significantly lower when highly acidic PEDOT:PSS was used as the HTL. However, this was not observed for PSCs made on Glass/ITO. To investigate the interaction between HTL and TCE, atomic force microscopy was carried out after dipping the TCEs in PEDOT:PSS solutions of different acidity. X-ray photoelectron spectroscopy measurements further revealed differences in the chemical composition between ITO film on PET vs. on glass. Our results indicate that the performance of PSCs depends both on the TCE substrates and HTLs, which can be explained by their chemical interaction.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":"86 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141566755","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Flexible self-powered triboelectric nanogenerator sensor for wind speed measurement driven by moving trains 用于移动列车驱动的风速测量的灵活自供电三电纳米发电机传感器

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-07-09 DOI: 10.1088/2058-8585/ad5c7c

Wentao Dong, Bo Huang, Kaiqi Sheng and Xiao Cheng

{"title":"Flexible self-powered triboelectric nanogenerator sensor for wind speed measurement driven by moving trains","authors":"Wentao Dong, Bo Huang, Kaiqi Sheng and Xiao Cheng","doi":"10.1088/2058-8585/ad5c7c","DOIUrl":"https://doi.org/10.1088/2058-8585/ad5c7c","url":null,"abstract":"Flexible self-powered sensors have been extensively applied to the Internet of Things, structural health monitoring (SHM), and intelligent transportation. It would be more demanding for the power supply to these sensors during the long-term maintenance of the rail transit system. The wind pressure/velocity generated by high-speed trains poses a substantial threat to safety of human, and new sensors without an external power supply should be developed to monitor wind pressure/velocity in the trackside. Flexible self-powered wind triboelectric nanogenerator (W-TENG) sensor with a single-electrode mode based on conductive hydrogel is designed to wind pressure/velocity monitoring without power supply by harvesting wind energy. It is devoted the relationship between the output voltage of the sensors and the wind pressure/velocity driven by high-speed trains. Material selection and structural design methods are adopted to enhance the energy harvesting efficiency and sensing accuracy of self-powered W-TENG sensors. Open-circuit current of 2.8 μA and open-circuit voltage of 12 V are achieved, and the output voltage signal has the linear relationship with trackside wind pressure/velocity. Field tests are implemented to evaluate the performance of self-powered W-TENG sensors in wind pressure/velocity measurement caused by moving trains, providing an idea to SHM application in intelligent transmit systems.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":"14 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141566754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Flexo-printed polymer waveguides for integration in electro-optical circuit boards 用于集成到光电电路板中的柔性印刷聚合物波导

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-07-03 DOI: 10.1088/2058-8585/ad5c7b

Andreas Evertz, Jonathan Pleuß, Birger Reitz and Ludger Overmeyer

{"title":"Flexo-printed polymer waveguides for integration in electro-optical circuit boards","authors":"Andreas Evertz, Jonathan Pleuß, Birger Reitz and Ludger Overmeyer","doi":"10.1088/2058-8585/ad5c7b","DOIUrl":"https://doi.org/10.1088/2058-8585/ad5c7b","url":null,"abstract":"Electro-optical circuit boards (EOCBs) offer great potential for short-ranged data transmission in highly electro-magnetic inflicted environments. Finding a cost-efficient way to manufacture EOCB only using additive printing processes could establish, increase, and secure data transmission in PCB systems. Flexo printing is an efficient manufacturing process that combines high contour resolution and layout flexibility to create optical waveguides. Previous research has shown that printing waveguides on a polymethylmethacrylate substrate can enable optical data transmission for up to 20 cm. However, a thermo-resistant polyimide (PI) substrate is needed to integrate printed waveguides into PCB. Since PI does not meet optical demands, waveguide cores must be separated by printed optical cladding. This research aims to investigate the additive printing process, which stacks various polymers to achieve waveguides that are ready for integration. Further, the integration in PCB is validated according to functional testing of the optical structures. An entire manufacturing process for printed EOCB is presented, which enables the investigation of optical coupling processes in upcoming research.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":"39 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141552844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC 喷墨打印低温共烧陶瓷：定制 LTCC 的工艺开发

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-06-26 DOI: 10.1088/2058-8585/ad59b3

Jonas Jäger, Martin Ihle, Kerstin Gläser and André Zimmermann

{"title":"Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC","authors":"Jonas Jäger, Martin Ihle, Kerstin Gläser and André Zimmermann","doi":"10.1088/2058-8585/ad59b3","DOIUrl":"https://doi.org/10.1088/2058-8585/ad59b3","url":null,"abstract":"This paper investigates the utilization of digital printing technologies for the fabrication of low temperature co-fired ceramics (LTCC). LTCC offer great opportunities for applications such as antennas, sensors or actuators due to their outstanding properties like low dielectric loss, low permittivity, low coefficient of thermal expansion and at the same time high reliability in harsh environments (heat, humidity, and radiation). LTCC are multilayer circuits that are typically functionalized by screen-printing. This publication investigates the replacement of screen-printing by digital printing processes, such as inkjet and Aerosol Jet printing, to facilitate a more resource-friendly and customizable manufacturing of LTCC. The use of digital printing technologies not only streamlines small-scale productions and development processes but also offers the advantage of achieving miniaturization down to single-digit microns. In this publication, digital printing processes, filling of vias, lamination processes, co-firing at 850 °C and printing on fired LTCC were investigated. Three layers of nanoparticle silver ink were printed on green LTCC tape and 100% of the embedded printed structures were conductive after co-firing. Filling of vias with inkjet printing was investigated and the most important process parameters were found to be the clustering of vias, the amount of active nozzles and the substrate temperature. Printing on fired LTCC demonstrated high precision, and sintering at 600 °C achieved strong adhesion of printed structures to LTCC. These successful findings culminate in presenting a process chain for fully maskless structured, multilayer LTCC.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":"277 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141508886","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Flexible, self-healing, and degradable polymeric dielectrics cross-linked through metal–ligand for resistive memory device 通过金属配体交联的柔性、自愈合和可降解聚合物电介质用于电阻式存储器件

IF 3.1 4区工程技术

Flexible and Printed Electronics Pub Date : 2024-06-25 DOI: 10.1088/2058-8585/ad5028

Yu-Chi Chang, Yi-Yun Liang and Hao-Jung Liu

{"title":"Flexible, self-healing, and degradable polymeric dielectrics cross-linked through metal–ligand for resistive memory device","authors":"Yu-Chi Chang, Yi-Yun Liang and Hao-Jung Liu","doi":"10.1088/2058-8585/ad5028","DOIUrl":"https://doi.org/10.1088/2058-8585/ad5028","url":null,"abstract":"The ability to self-heal is a crucial feature in nature, where living organisms can repair themselves when subjected to minor injuries. With an increasing emphasis on environmental sustainability, the concept of biomimetic self-healing polymeric materials has emerged as a prominent trend, promising to significantly extend the lifespan and reliability of products. Studies have shown that one-third of proteins in living organisms require metal cofactors to function properly. It is known that protein-metal interactions can enhance the performance of certain biomaterials, and different choices of metals and ligands can create diverse material properties, influencing characteristics such as hardness, toughness, adhesion, and self-healing abilities. Gelatin is a natural polymer derived from the hydrolysis of collagen, and its unique amino acid structure has led to a wide range of applications. In this research, by introducing aluminum ions that form metal coordination complexes with the carboxyl groups in gelatin, an elastic network with self-healing properties was constructed. This gelatin-based material was utilized as an insulating layer in resistive switching devices. Furthermore, by employing a gelatin substrate of the same composition, the device demonstrated strong interfacial adhesion. The device based on the self-healing gelatin film exhibited excellent electrical performance and mechanical properties. Even after self-healing, it maintained a high ON/OFF ratio of up to 105 and a concentrated distribution of switching parameters. Supported by compelling physical and electrical evidence, this study showcases significant development opportunities for biomimetic materials in green electronic devices.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":"29 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141508887","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0