Recent advances in encapsulation strategies for flexible transient electronics

IF 2.8 4区工程技术 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Flexible and Printed Electronics Pub Date : 2024-08-14 DOI:10.1088/2058-8585/ad6a6c

Won Bae Han, Suk-Won Hwang, Woon-Hong Yeo

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Abstract

Transient electronics, designed to dissolve, disintegrate, or degrade in a controlled manner after fulfilling their functions without remaining biologically and environmentally harmful byproducts, have emerged as a transformative paradigm with promising applications in temporary biomedical devices, eco-friendly electronics, and security applications. The success of this device development relies significantly on an effective encapsulation to protect their degradable active materials from environmental factors, such as biofluids and water, and secure reliable device functions throughout a desired lifespan. This review article provides an overview of recent advances in various encapsulation strategies for developing flexible, transient electronics. Details include materials selection, key characteristics, water-barrier capabilities, degradation mechanisms, and relevant applications, categorized into inorganic materials, synthetic/natural polymers, and hybrid composites. In addition, our insights into existing challenges and key perspectives for enhancing encapsulation performance are shared.

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柔性瞬态电子封装策略的最新进展

瞬态电子器件可在完成功能后以受控方式溶解、分解或降解，不会残留对生物和环境有害的副产品，已成为一种变革性范例，在临时生物医学设备、生态友好型电子器件和安全应用方面具有广阔的应用前景。这种装置开发的成功在很大程度上依赖于有效的封装，以保护其可降解活性材料免受生物流体和水等环境因素的影响，并确保装置在所需的使用寿命内发挥可靠的功能。这篇综述文章概述了用于开发柔性瞬态电子器件的各种封装策略的最新进展。详细内容包括材料选择、关键特性、防水能力、降解机制和相关应用，分为无机材料、合成/天然聚合物和混合复合材料。此外，还分享了我们对现有挑战的见解以及提高封装性能的主要观点。

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来源期刊

Flexible and Printed Electronics MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

4.80

自引率

9.70%

发文量

101

期刊介绍： Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications.