Flexible intracortical probes for stable neural recording: from the perspective of structure

IF 2.8 4区 工程技术 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Suhao Wang, Qianqian Jiang, Jizhou Song
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引用次数: 0

Abstract

Electrical neural interfaces provide direct communication pathways between living brain tissue and engineered devices to understand brain function. However, conventional neural probes have remained limited in providing stable, long-lasting recordings because of large mechanical and structural mismatches with respect to brain tissue. The development of flexible probes provides a promising approach to tackle these challenges. In this review, various structural designs of flexible intracortical probes for promoting long-term neural integration, including thin film filament and mesh probe structures that provide similar geometric and mechanical properties to brain tissue and self-deployable probe structure that enables moving the functional sensors away from the insertion trauma, are summarized, highlighting the important role of structural design in improving the long-term recording stability of neural probes.
用于稳定神经记录的灵活皮层内探针:从结构的角度看问题
电气神经接口提供了活体脑组织与工程设备之间的直接通信途径,以了解大脑功能。然而,传统的神经探针在提供稳定、持久的记录方面仍然受到限制,因为它们与脑组织之间存在较大的机械和结构不匹配。柔性探针的开发为应对这些挑战提供了一种前景广阔的方法。在这篇综述中,总结了促进长期神经整合的皮质内柔性探针的各种结构设计,包括与脑组织具有相似几何和机械特性的薄膜丝状和网状探针结构,以及可将功能传感器从插入创面移开的自部署探针结构,强调了结构设计在提高神经探针长期记录稳定性方面的重要作用。
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来源期刊
Flexible and Printed Electronics
Flexible and Printed Electronics MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.80
自引率
9.70%
发文量
101
期刊介绍: Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications.
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