Chinese Journal of Electronics最新文献_第7页

A Wideband Composite 2D Beam-Steering Loop Magnetoelectric Dipole Array Antenna with Enhanced Switching Resolution and Reduced Mutual Coupling 一种增强开关分辨率和减小互耦的宽带复合二维波束导向环磁电偶极子阵列天线

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.338

Wei Zheng;Junhong Wang;Yunjie Geng;Jiwei Lian

{"title":"A Wideband Composite 2D Beam-Steering Loop Magnetoelectric Dipole Array Antenna with Enhanced Switching Resolution and Reduced Mutual Coupling","authors":"Wei Zheng;Junhong Wang;Yunjie Geng;Jiwei Lian","doi":"10.23919/cje.2025.00.338","DOIUrl":"https://doi.org/10.23919/cje.2025.00.338","url":null,"abstract":"In this paper, a wideband composite two-dimensional (2D) beam steering loop magnetoelectric dipole array antenna with enhanced switching resolution and reduced mutual coupling is proposed, analyzed and measured. The enhancement of beam-switching resolution is achieved through the spatial transformation and integration of the multi-port beam-steering elements. Specifically, the proposed eight-beam magnetoelectric (ME) dipole array is constructed by integrating two ME dipole arrays, where each array can generate four beams in different azimuthal directions. Furthermore, a characterization method is proposed in this paper for considering the coupling relationship between multi-port integrated antenna arrays. The slotted ground structure is adopted to reduce the mutual coupling. The design guidelines and parameter analysis of the proposed antenna are provided, and the antenna is fabricated and measured. The measured results show that the peak gain of proposed antenna is 8.02 dBi, the overlapped bandwidth for all eight beam states is 29.9% (4.52 GHz to 6.11 GHz) and an angular resolution of 45° for 2D beam switching. By feeding each port respectively, the proposed antenna can realize 2D wideband beam switching with an angular resolution of 45°. The proposed antenna possesses advantages in low-cost, wideband eight-beam switching capability and easy processing, thereby providing a promising candidate for wideband wireless beam-steering applications.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1689-1700"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685226","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Analysis of Thermal Stress Reliability of Inter-connect Structures in Stacked SiP Modules Under Thermal Cycling Loading 热循环载荷下堆叠SiP模块互连结构热应力可靠性分析

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.485

Wenchao Tian;Dehan Wang;Liangchen Bai;Wenbin Li

{"title":"Analysis of Thermal Stress Reliability of Inter-connect Structures in Stacked SiP Modules Under Thermal Cycling Loading","authors":"Wenchao Tian;Dehan Wang;Liangchen Bai;Wenbin Li","doi":"10.23919/cje.2025.00.485","DOIUrl":"https://doi.org/10.23919/cje.2025.00.485","url":null,"abstract":"With the rapidly growing demand for high density integrated circuits, advanced packaging technologies such as chip stacking and heterogeneous integration have become mainstream. However, reliability issues related to interconnect structures under thermal cycling loads have become increasingly prominent. This study systematically investigates the structural deformation of internal interconnects in stacked SiP modules caused by thermomechanical stress under temperature cycling conditions, with a specific focus on fatigue failure induced by thermal loads. Stress strain analyses are performed on both the upper and lower layers of bumps and the through silicon via (TSV) array to identify critical failure locations and predict thermal fatigue life. The results indicate that deformation is most severe at the corners of the stacked SiP module throughout the temperature cycling process, and these corner regions are also the most prone to failure for both bumps and TSVs. The bottom layer bumps experience higher stress than the top layer bumps and are thus more likely to suffer thermal fatigue failure. The critical failure nodes for the bumps are located at the contact interface between the upper surface of the corner bumps and the lower surface of the redistribution layer (RDL), with a predicted thermal fatigue life of 4.63 × 104 cycles. For the TSV structures, the maximum equivalent stress of 226.41 MPa occurs at the corners of the interposer at the bottom of the stacked SiP module, corresponding to a predicted thermal fatigue life of 5.45 × 106 cycles. In addition, increasing the bump height, reducing the bump pitch, and using SAC405 solder with a higher silver content are found to effectively enhance the thermal reliability of the bumps.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1642-1651"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685228","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909438","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Space-Filling Curve-Based Fractional Fourier Feature Transformation for Oriented Object Detection in Optical and SAR Remote Sensing Imagery 基于空间填充曲线的分数傅里叶特征变换在光学和SAR遥感图像定向目标检测中的应用

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.240

Qi Ming;Liuqian Wang;Juan Fang;Yifan Xiao;Zhixin Guo;Xudong Zhao

{"title":"Space-Filling Curve-Based Fractional Fourier Feature Transformation for Oriented Object Detection in Optical and SAR Remote Sensing Imagery","authors":"Qi Ming;Liuqian Wang;Juan Fang;Yifan Xiao;Zhixin Guo;Xudong Zhao","doi":"10.23919/cje.2025.00.240","DOIUrl":"https://doi.org/10.23919/cje.2025.00.240","url":null,"abstract":"In recent years, oriented object detection in remote sensing images has received increasing attention due to its wide range of application scenarios. However, in complex scenes, object features are often hard to distinguish, making accurate object detection in this case still a challenging task. In this paper, we propose a space-filling curve-based fractional fourier feature transformation detector (SF3Det) to achieve high-precision oriented object detection in remote sensing images. First, we propose a fractional fourier transform based multi-domain features extraction module. By utilizing amplitude and phase information, the module can provide discriminative and enhanced features. Then, we adopt a locality-preserving feature serialization method for regional proposals in two-stage detectors. Specifically, object features are unfolded along a space-filling curve to obtain feature sequences with local correlation, which helps optimize model convergence and provides efficient local semantic cues for subsequent prediction. Finally, we apply a joint consistency-aware loss to dynamically adjust the optimization of classification and regression losses, consistently improving the performance of both tasks. Extensive experiments on optical remote sensing datasets and synthetic aperture radar image datasets demonstrate the superiority of SF3Det. Our method achieves mAPs of 90.6%, 79.92%, 89.90%, and 80.40% on the HRSC2016, DOTA, SSDD, and HRSID datasets, respectively.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1380-1392"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685232","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Contrastive Learning for Improved Image-Text Alignment in Hyperspectral Change Detection 高光谱变化检测中改进图像-文本对齐的对比学习

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.538

Lanxin Wu;Jiangtao Peng;Bing Yang;Weiwei Sun;Xinran Luo;Wenhui Hou

引用次数: 0

Integration of Artificial Intelligence with Real-Time IoT Based Distributed Edge-Cloud Frameworks: Applications, Challenges, and Solutions 人工智能与基于实时物联网的分布式边缘云框架的集成：应用、挑战和解决方案

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.347

Muhammad Amir Khan;Mona A. Alkhattabi;Syed Faisal Abbas Shah;Muzammil Ahmad Khan;Tehseen Mazhar;Abdul Khader Jilani Saudagar;Ateeq Ur Rehman;Habib Hamam

{"title":"Integration of Artificial Intelligence with Real-Time IoT Based Distributed Edge-Cloud Frameworks: Applications, Challenges, and Solutions","authors":"Muhammad Amir Khan;Mona A. Alkhattabi;Syed Faisal Abbas Shah;Muzammil Ahmad Khan;Tehseen Mazhar;Abdul Khader Jilani Saudagar;Ateeq Ur Rehman;Habib Hamam","doi":"10.23919/cje.2025.00.347","DOIUrl":"https://doi.org/10.23919/cje.2025.00.347","url":null,"abstract":"This systematic literature review investigates the convergence of artificial intelligence (AI) and real-time Internet of things (IoT) systems within a distributed computing environment. Covering research from 2021 to 2025, the study highlights how AI-enabled real-time IoT systems enhance intelligent, latency-sensitive applications across various domains, including healthcare, smart cities, industrial automation, agriculture, and public safety. The review focuses on the use of the main technologies such as federated learning, reinforcement learning, tiny machine learning, transfer learning, anomaly detection, and self-supervised learning, to overcome challenges related to latency, resource constraints, data heterogeneity, interoperability, scalability, and security. This article also highlights the main challenges and solutions to those challenges with the different methods and techniques. By presenting taxonomy tables, use case analyses, and cross-domain comparisons, the paper outlines different solutions that enable dependable and scalable AI-IoT integration. Furthermore, it explores the emerging role of future technologies, sixth-generation, digital twins, and the metaverse in transforming edge AI infrastructures for secure, efficient, and real-time decision-making. The findings provide a roadmap for researchers and practitioners to design robust, intelligent, and context-aware distributed systems for next-generation applications","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1714-1727"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685233","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Towards Reliable Multimodal Intelligence via Uncertainty-Aware Inference 基于不确定性感知推理的可靠多模态智能

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.215

Tianxiang Gong;Shiqi Gao;Qi Song;Qingyun Sun;Haoyi Zhou;Jianxin Li

{"title":"Towards Reliable Multimodal Intelligence via Uncertainty-Aware Inference","authors":"Tianxiang Gong;Shiqi Gao;Qi Song;Qingyun Sun;Haoyi Zhou;Jianxin Li","doi":"10.23919/cje.2025.00.215","DOIUrl":"https://doi.org/10.23919/cje.2025.00.215","url":null,"abstract":"Large vision-language models (LVLMs) offer transformative potential for multimodal reasoning in intelligent transportation systems. However, their deployment in safety-critical scenarios is hindered by overconfident predictions, computationally intensive uncertainty estimation, and unreliable confidence calibration. Existing methods, such as semantic entropy and Monte Carlo dropout, require multiple forward passes, rendering them impractical for billion-scale models. Moreover, current cross-modal retrieval approaches often neglect uncertainty in vision-language alignment. To address these challenges, we introduce a unified framework comprising three key innovations: Uncertainty-aware quadruple multimodal contrastive learning with constraints and self-penalization (UQUEST), an uncertainty-aware retrieval module that combines learnable query-based aleatoric uncertainty with dual decoders to enhance both retrieval and generation; vsion-language fast layer-wise uncertainty estimation (VL-FLUE), a layer-wise uncertainty estimation technique that exploits transformer redundancy for efficient single-pass inference; and vision-language adaptive temperature scling, a context-aware calibration method based on adaptive temperature scaling. Extensive evaluations on Microsoft common objects in context, Flickr30K, and DrivingVQA demonstrate notable gains: UQUEST enhances retrieval-augmented generation performance, while VL-FLUE reduces inference cost and improves calibration quality. This framework advances the reliability and efficiency of uncertainty quantification, paving the way for trustworthy LVLM deployment in real-time transportation applications.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1477-1492"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11684960","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909460","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Task Scheduling for Heterogeneous Hardware Co-Inference in IoT-Edge-Cloud Continuum 物联网边缘云连续体中异构硬件协同推理的任务调度

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.324

Hwei-Ming Chung;Tingting Yuan;Yang Chen;Xiaoliang Wang;Kanye Ye Wang;Jiansong Zhang;Jin Zhao;Kai Li;Xiaoming Fu

{"title":"Task Scheduling for Heterogeneous Hardware Co-Inference in IoT-Edge-Cloud Continuum","authors":"Hwei-Ming Chung;Tingting Yuan;Yang Chen;Xiaoliang Wang;Kanye Ye Wang;Jiansong Zhang;Jin Zhao;Kai Li;Xiaoming Fu","doi":"10.23919/cje.2025.00.324","DOIUrl":"https://doi.org/10.23919/cje.2025.00.324","url":null,"abstract":"The rapid growth of artificial intelligence (AI)-driven Internet of things (IoT) applications demands efficient execution of heterogeneous tasks across IoT devices, edge nodes, and cloud servers. Modern system-on-chip (SoC) edge platforms integrate central processing units (CPUs) and neural processing units (NPUs) with distinct operator support and performance characteristics, creating new challenges for task scheduling that traditional homogeneous models fail to address. This paper proposes a hardware-aware scheduling framework that explicitly accounts for intra-device heterogeneity, operator compatibility constraints, and energy-latency trade-offs in the IoT-edge-cloud continuum. A priority-based numerical heuristic algorithm is developed to assign tasks across CPUs, NPUs, and cloud graphics processing unit (GPU) resources by evaluating real-time execution and energy costs. Experiments on real SoC devices, combined with extended large-scale simulations, demonstrate the effectiveness of the proposed method. Results reveal that the proposed approach reduces end-to-end latency by approximately 10%–25% compared with representative baselines, while achieving 40%–60% lower energy consumption. These results highlight the novelty and practical impact of leveraging heterogeneous SoC architectures for efficient and adaptive AI inference in modern IoT deployments.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1790-1801"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685256","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Performance Enhancement of Hybrid Modes-Based Wide-Angle Scanning Phased Array with Broadened Bandwidth and Reduced Coupling 宽带宽、低耦合的混合模式广角扫描相控阵性能增强研究

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.360

Jinshuai Hu;Youfeng Cheng;Yemin Zang;Cheng Liao

{"title":"Performance Enhancement of Hybrid Modes-Based Wide-Angle Scanning Phased Array with Broadened Bandwidth and Reduced Coupling","authors":"Jinshuai Hu;Youfeng Cheng;Yemin Zang;Cheng Liao","doi":"10.23919/cje.2025.00.360","DOIUrl":"https://doi.org/10.23919/cje.2025.00.360","url":null,"abstract":"This paper presents a simple but efficient solution to broaden the impedance bandwidth, suppress the mutual coupling (MC), and extend the scanning range of a single-layer microstrip patch phased array. By simultaneously exciting and adjusting the electric fields (E-fields) of the transverse magnetic (TM)<inf>10</inf> and TM<inf>20</inf> modes, dual resonances are supported to enhance the impedance bandwidth, and weak fields are generated on coupled patches to achieve the MC reduction. Furthermore, the radiation fields of the TM<inf>10</inf> and TM<inf>20</inf> modes are combined inherently within the impedance band to achieve the wide-beam pattern. The proposed solution can also be applied to a linear phased array in which the above three functions are integrated for wideband wide-angle scan. A fabricated prototype of the phased array is measured for performance validation. Measured results confirm that the designed array can achieve its scanning range of ±60° with good impedance matching and high inter-port isolation across the −10 dB active reflection band from 5.56 to 5.98 GHz (7.3%).","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1652-1659"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685207","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909440","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Mixed-Order Tetrahedral Spectral Element Method for Nonlinear Electro-Thermal Bidirectional Coupling in Semiconductor Devices 半导体器件中非线性电热双向耦合的混合阶四面体谱元法

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.366

Qiqiang Liu;Jiahui Zhou;Dawei Wang;Absalom EL-Shamir Ezugwu;Wensheng Zhao

{"title":"A Mixed-Order Tetrahedral Spectral Element Method for Nonlinear Electro-Thermal Bidirectional Coupling in Semiconductor Devices","authors":"Qiqiang Liu;Jiahui Zhou;Dawei Wang;Absalom EL-Shamir Ezugwu;Wensheng Zhao","doi":"10.23919/cje.2025.00.366","DOIUrl":"https://doi.org/10.23919/cje.2025.00.366","url":null,"abstract":"A mixed-order tetrahedral spectral element method (TSEM) is implemented for nonlinear electro-thermal bidirectional coupling simulation of semiconductor devices. This method combines the high-order accuracy of the spectral method with the strong geometric adaptability of the finite element method. And it can alleviate the burden of multi-scale computation by using different interpolation orders based on the same mesh in different physical fields, and improves the accuracy and convergence of solving strongly nonlinear problems by increasing the interpolation order. In addition, the TSEM constructs system matrix equations directly through Warp&Blend node-optimized Vandermonde and differentiation matrices, improving the efficiency, generality, and flexibility of the multiphysics preprocessing. Then, we apply this method to study temperature-dependent effects in semiconductor devices, fully considering temperature-dependent drift and diffusion current terms. This provides a robust solution to the growing simulation and design challenges posed by the continuously increasing power density. Compared with the commercial software, several numerical experiments are conducted to demonstrate the superior stability, convergence, and efficiency of the proposed algorithm.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1577-1588"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685227","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Key Data Cross-Domain Flow Security Protection System 关键数据跨域流量安全保护系统

IF 4.5 4区计算机科学

Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI: 10.23919/cje.2025.00.436

Boshen Shan;Xiaodong Zuo;Chen Guo;Chong Guo

{"title":"Key Data Cross-Domain Flow Security Protection System","authors":"Boshen Shan;Xiaodong Zuo;Chen Guo;Chong Guo","doi":"10.23919/cje.2025.00.436","DOIUrl":"https://doi.org/10.23919/cje.2025.00.436","url":null,"abstract":"China has established a data classification and grading system, which requires accurate determination of data categories and levels as a prerequisite for all security management measures, such as cross-domain data flow protection, mandates implementing corresponding security safeguards for important and core data involved in cross-domain transfers, and achieves traceability and control over their data flow paths. However, existing technical solutions fail to meet national strategic needs for situational awareness of key data security and monitoring of unauthorized data exfiltration. To address this, this paper models specific scenarios of cross-domain data flow, defines the functions and security requirements of four participating entities—data owner, data user, certification authority, and cloud server—and designs the fundamental operational workflow of a cross-domain data secure protection system. The security protection scheme is concretely presented in algorithmic form. Furthermore, based on computational complexity theory, the paper defines the system's security under chosen-plaintext attacks by designing a semantic security indistinguishability game. The security of the proposed cross-domain data protection system is rigorously proven using mathematical derivations under the generalized decisional diffie-hellman exponent assumption. Simulation results reveal the main factors affecting the execution efficiency of different algorithms.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":"35 4","pages":"1701-1713"},"PeriodicalIF":4.5,"publicationDate":"2026-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11685254","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148909465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0