IEEE Design & Test最新文献

筛选
英文 中文
Calling Yourself Back 给自己回电话
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/mdat.2023.3291666
S. Davidson
{"title":"Calling Yourself Back","authors":"S. Davidson","doi":"10.1109/mdat.2023.3291666","DOIUrl":"https://doi.org/10.1109/mdat.2023.3291666","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"30 1","pages":"115"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80415584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The 2022 Symposium on Integrated Circuits and Systems Design (SBCCI 2022) 2022年集成电路与系统设计学术研讨会(SBCCI 2022)
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/mdat.2023.3292716
P. Pande
{"title":"The 2022 Symposium on Integrated Circuits and Systems Design (SBCCI 2022)","authors":"P. Pande","doi":"10.1109/mdat.2023.3292716","DOIUrl":"https://doi.org/10.1109/mdat.2023.3292716","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"55 1","pages":"4"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90776499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Design & Test Publication Information IEEE Design &测试发布信息
4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/mdat.2023.3293348
{"title":"IEEE Design & Test Publication Information","authors":"","doi":"10.1109/mdat.2023.3293348","DOIUrl":"https://doi.org/10.1109/mdat.2023.3293348","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135170454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Strange Loops in Design and Technology: 59th DAC Keynote Speech 设计与技术中的怪圈——第59届DAC主题演讲
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/MDAT.2023.3284295
G. De Micheli
{"title":"Strange Loops in Design and Technology: 59th DAC Keynote Speech","authors":"G. De Micheli","doi":"10.1109/MDAT.2023.3284295","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3284295","url":null,"abstract":"This keynote paper highlights the interaction between emerging technologies and software tools to enable the current evolution of electronic design automation systems.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"40 1","pages":"96-103"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45149491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Active and Passive Physical Attacks on Neural Network Accelerators 对神经网络加速器的主动和被动物理攻击
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/MDAT.2023.3253603
V. Meyers, Dennis R. E. Gnad, M. Tahoori
{"title":"Active and Passive Physical Attacks on Neural Network Accelerators","authors":"V. Meyers, Dennis R. E. Gnad, M. Tahoori","doi":"10.1109/MDAT.2023.3253603","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3253603","url":null,"abstract":"This article emphasizes the growing importance of studying defenses for physical attacks on neural network accelerators, and describes approaches based on side-channel attacks and fault-injection attacks.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"40 1","pages":"70-85"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43773815","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Integrating Machine-Learning Probes in FPGA CAD: Why and How? 在FPGA CAD中集成机器学习探针:为什么以及如何?
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/MDAT.2023.3286334
T. Martin, C. Barnes, G. Grewal, S. Areibi
{"title":"Integrating Machine-Learning Probes in FPGA CAD: Why and How?","authors":"T. Martin, C. Barnes, G. Grewal, S. Areibi","doi":"10.1109/MDAT.2023.3286334","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3286334","url":null,"abstract":"This article discusses challenges posed by current designs and proposes the adoption of machine-learning probes in the FPGA design flow to improve performance.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"40 1","pages":"7-14"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62453536","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Postpandemic Conferences: The DATE 2023 Experience 大流行后会议:2023年的经验
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/mdat.2023.3287930
I. O’Connor, R. Wille, A. Pimentel, V. Bertacco
{"title":"Postpandemic Conferences: The DATE 2023 Experience","authors":"I. O’Connor, R. Wille, A. Pimentel, V. Bertacco","doi":"10.1109/mdat.2023.3287930","DOIUrl":"https://doi.org/10.1109/mdat.2023.3287930","url":null,"abstract":"Digital Object Identier 10.1109/MDAT.2023.3287930 Date of current version: 29 August 2023.  DATE is A leading international event providing unique networking opportunities. The conference brings together designers and design automation users, researchers, and vendors, as well as specialists in hardware and software design, testing, and manufacturing of electronic circuits and systems—from system-level hardware and software implementation down to integrated circuit design. Almost four years had passed since we closed the doors on the last in-person edition of the DATE conference. With three online editions due to COVID19 and in anticipation of a return to a full in-person format, the DATE Sponsors Committee felt that the conference needed to put interaction, as well as reinforcing and rebuilding links in the community, at the heart of the event. In this spirit, the postpandemic 2023 edition of DATE had a substantially reworked format intending for significant added value for in-person participation, with more focus on interaction and condensed down to three days. The intent was that, in this way, the community could actually do what DATE is for meeting, discussing, and exchanging the latest progress in design and design automation. The 26th DATE conference was held at the Flanders Meeting and Convention Center in Antwerp, Belgium, from 17 to 19 April 2023 and offered an exciting, wide-ranging technical program.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"34 1","pages":"104-112"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88854376","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Energy-Aware Nanoscale Design of Reversible Atomic Silicon Based on Miller Algorithm 基于Miller算法的能量感知可逆原子硅纳米级设计
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/MDAT.2023.3261800
Seyed-Sajad Ahmadpour, Nima Jafari Navimipour, Ali Nawaz Bahar, M. Mosleh, Senay Yalçin
{"title":"An Energy-Aware Nanoscale Design of Reversible Atomic Silicon Based on Miller Algorithm","authors":"Seyed-Sajad Ahmadpour, Nima Jafari Navimipour, Ali Nawaz Bahar, M. Mosleh, Senay Yalçin","doi":"10.1109/MDAT.2023.3261800","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3261800","url":null,"abstract":"Area overhead and energy consumption continue to dominate the scalability issues of modern digital circuits. In this context, atomic silicon and reversible logic have emerged as suitable alternatives to address both issues. In this article, the authors propose novel nano-scale circuit design with low area and energy overheads using the same. In particular, the authors propose a reversible gate with Miller algorithm and atomic silicon technology. This article is extremely relevant in today’s era, when the world is moving toward low area and low energy circuits for use in edge devices.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"40 1","pages":"62-69"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43983761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Seamless Thermal Optimization of Parallel Workloads 并行工作负载的无缝热优化
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/MDAT.2023.3286336
Sandro M. Marques, F. Rossi, M. C. Luizelli, A. C. S. Beck, A. Lorenzon
{"title":"Seamless Thermal Optimization of Parallel Workloads","authors":"Sandro M. Marques, F. Rossi, M. C. Luizelli, A. C. S. Beck, A. Lorenzon","doi":"10.1109/MDAT.2023.3286336","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3286336","url":null,"abstract":"This article proposes a framework for thread-throttling and core-frequency optimization. The framework titled TAURUS is dynamic and transparent to the end user.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":" ","pages":"34-41"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47894470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Sbcci 2022
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2023-10-01 DOI: 10.1109/mdat.2023.3291688
N. Roma, Bruno Zatt
{"title":"Sbcci 2022","authors":"N. Roma, Bruno Zatt","doi":"10.1109/mdat.2023.3291688","DOIUrl":"https://doi.org/10.1109/mdat.2023.3291688","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"79 1","pages":"5-6"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84971002","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信