IEEE Journal on Emerging and Selected Topics in Circuits and Systems最新文献

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Guest Editorial: Integrated Devices, Circuits, and Systems for the 6G Era 特邀社论:面向 6G 时代的集成器件、电路和系统
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-03-13 DOI: 10.1109/JETCAS.2024.3367094
Xi Zhu;Roberto Gómez-García;Chun-Hsing Li;Bryan Schwitter
{"title":"Guest Editorial: Integrated Devices, Circuits, and Systems for the 6G Era","authors":"Xi Zhu;Roberto Gómez-García;Chun-Hsing Li;Bryan Schwitter","doi":"10.1109/JETCAS.2024.3367094","DOIUrl":"https://doi.org/10.1109/JETCAS.2024.3367094","url":null,"abstract":"This Special Issue of the IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) is dedicated to demonstrating the latest research progress on integrated devices, circuits and systems for the 6G Era. As 5G rolls out worldwide, teams of visionary experts are developing roadmaps and revolutionary applications for the next-generation wireless network: 6G. Indeed, the 6G mobile networks will establish new standards to fulfill the unreachable performance required by the current 5G networks. It is anticipated that 6G technology will be capable of supporting extremely high-performance connectivity with massive numbers of connected devices.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"3-6"},"PeriodicalIF":4.6,"publicationDate":"2024-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10472160","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140123316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Journal on Emerging and Selected Topics in Circuits and Systems information for authors 供作者参考的《IEEE 电路与系统新兴选题期刊
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-03-13 DOI: 10.1109/JETCAS.2024.3364893
{"title":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems information for authors","authors":"","doi":"10.1109/JETCAS.2024.3364893","DOIUrl":"https://doi.org/10.1109/JETCAS.2024.3364893","url":null,"abstract":"","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"142-142"},"PeriodicalIF":4.6,"publicationDate":"2024-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10472161","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140123405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enhancing Context Models for Point Cloud Geometry Compression With Context Feature Residuals and Multi-Loss 利用上下文特征残差和多重损失增强用于点云几何压缩的上下文模型
IF 3.7 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-02-20 DOI: 10.1109/JETCAS.2024.3367729
Chang Sun;Hui Yuan;Shuai Li;Xin Lu;Raouf Hamzaoui
{"title":"Enhancing Context Models for Point Cloud Geometry Compression With Context Feature Residuals and Multi-Loss","authors":"Chang Sun;Hui Yuan;Shuai Li;Xin Lu;Raouf Hamzaoui","doi":"10.1109/JETCAS.2024.3367729","DOIUrl":"10.1109/JETCAS.2024.3367729","url":null,"abstract":"In point cloud geometry compression, context models usually use the one-hot encoding of node occupancy as the label, and the cross-entropy between the one-hot encoding and the probability distribution predicted by the context model as the loss function. However, this approach has two main weaknesses. First, the differences between contexts of different nodes are not significant, making it difficult for the context model to accurately predict the probability distribution of node occupancy. Second, as the one-hot encoding is not the actual probability distribution of node occupancy, the cross-entropy loss function is inaccurate. To address these problems, we propose a general structure that can enhance existing context models. We introduce the context feature residuals into the context model to amplify the differences between contexts. We also add a multi-layer perception branch, that uses the mean squared error between its output and node occupancy as a loss function to provide accurate gradients in backpropagation. We validate our method by showing that it can improve the performance of an octree-based model (OctAttention) and a voxel-based model (VoxelDNN) on the object point cloud datasets MPEG 8i and MVUB, as well as the LiDAR point cloud dataset SemanticKITTI.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 2","pages":"224-234"},"PeriodicalIF":3.7,"publicationDate":"2024-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Metamaterial-Enabled Ultrawideband mmWave Antenna-in-Package Using Heterogeneously-Integrated Silicon IPD and HDI-PCB for B5G/ 6G Applications 利用异质集成硅 IPD 和 HDI-PCB 封装超宽带毫米波天线,实现 B5G/6G 应用
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-24 DOI: 10.1109/JETCAS.2024.3358222
Neda Khiabani;Ching-Wen Chiang;Nai-Chen Liu;Pai-Yen Chen;Yen-Cheng Kuan;Chung-Tse Michael Wu
{"title":"Metamaterial-Enabled Ultrawideband mmWave Antenna-in-Package Using Heterogeneously-Integrated Silicon IPD and HDI-PCB for B5G/ 6G Applications","authors":"Neda Khiabani;Ching-Wen Chiang;Nai-Chen Liu;Pai-Yen Chen;Yen-Cheng Kuan;Chung-Tse Michael Wu","doi":"10.1109/JETCAS.2024.3358222","DOIUrl":"10.1109/JETCAS.2024.3358222","url":null,"abstract":"This work presents the design, creation, and testing of ultrawideband millimeter-wave (mmWave) antennas with a tightly coupled array (TCA) configuration. These antennas are made using metamaterial (MTM) designs and advanced high-density interconnect (HDI) antenna-in-package (AiP) technologies, ideal for beyond-5G (B5G) and 6G networks. The main elements of the MTM antenna array are constructed with silicon-based integrated passive device (IPD) technology and are flip-chip bonded to a multi-layered HDI-PCB that includes a resistive frequency selective surface (FSS). These array antennas are differentially fed through a coax-via system. The study presents two types of \u0000<inline-formula> <tex-math>$5times 5$ </tex-math></inline-formula>\u0000 finite arrays: a metal-insulator-metal (MIM) capacitor-based MTM bowtie array with a differential Voltage Standing Wave Ratio (VSWR) \u0000<inline-formula> <tex-math>$le3.5$ </tex-math></inline-formula>\u0000, operating from 16.2 to 100 GHz (excluding 18.26–18.68 GHz and 60.8–61.13 GHz), and an interdigital capacitor-based MTM bowtie array functioning from 18.85 to 100 GHz (excluding 41.52–42.25 GHz). Experimental validation of these prototypes confirms their performance, aligning well with simulated results in terms of bandwidth and radiation characteristics.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"7-18"},"PeriodicalIF":4.6,"publicationDate":"2024-01-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 299–315-GHz Dual-Band Radiator Array With Cascaded Transmission Line-Based Feedback Network for Phase Noise Improvement 基于级联传输线反馈网络的 299-315-GHz 双频辐射器阵列,用于改善相位噪声
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-23 DOI: 10.1109/JETCAS.2024.3357612
Meng Yang;Chi Zhang;Liang Wu;Quan Xue
{"title":"A 299–315-GHz Dual-Band Radiator Array With Cascaded Transmission Line-Based Feedback Network for Phase Noise Improvement","authors":"Meng Yang;Chi Zhang;Liang Wu;Quan Xue","doi":"10.1109/JETCAS.2024.3357612","DOIUrl":"10.1109/JETCAS.2024.3357612","url":null,"abstract":"This paper presents a THz radiator array integrating two elements, each of which consists of two fundamental oscillators operating at half of the output frequency, a push-push frequency doubler and an on- chip square-shaped loop antenna. To improve the phase noise for the fundamental oscillators, a feedback network containing a long cascaded transmission line featuring high frequency selectivity is proposed. Then, the signal power is extracted through the use of a compact coupled line to drive the doubler, thereby making the integration of a multi-element array more manageable. Furthermore, the strength of the coupling between the two adjacent oscillators within each element is designed properly, yielding dual-band operation to extend the frequency range. Fabricated in a 65-nm bulk CMOS process, the radiator chip assembled with a crystal slab and a silicon lens achieves output frequency ranging from 299.2 to 314.8 GHz. The measured peak effective isotropically radiated power (EIRP) and radiated power are 3.9 and −16.1 dBm, respectively, while consuming 93-mW DC power from a 1.4-V power supply. The phase noise measures −79.9 dBc/Hz at 1-MHz offset from 312 GHz, corresponding to a figure-of-merit (FoM) of 170.1 dBc/Hz. The core area of the chip is \u0000<inline-formula> <tex-math>$0.65times 0.21$ </tex-math></inline-formula>\u0000 mm2, excluding the pads.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"41-51"},"PeriodicalIF":4.6,"publicationDate":"2024-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Millimeter-Wave GaAs Ultra-Wideband Medium Power Amplifier and Broadband High-Power Power Amplifier for 5G/6G Applications 用于 5G/6G 应用的毫米波砷化镓超宽带中功率放大器和宽带大功率放大器
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-19 DOI: 10.1109/JETCAS.2024.3356010
Zi-Hao Fu;Ming-Xuan Li;Tzyh-Ghuang Ma;Chan-Shin Wu;Kun-You Lin
{"title":"Millimeter-Wave GaAs Ultra-Wideband Medium Power Amplifier and Broadband High-Power Power Amplifier for 5G/6G Applications","authors":"Zi-Hao Fu;Ming-Xuan Li;Tzyh-Ghuang Ma;Chan-Shin Wu;Kun-You Lin","doi":"10.1109/JETCAS.2024.3356010","DOIUrl":"10.1109/JETCAS.2024.3356010","url":null,"abstract":"This paper presents an ultra-wideband (UWB) medium power amplifier (MPA) and a broadband high-power power amplifier (HPA) operating at the 5G/6G frequency bands. By using \u0000<inline-formula> <tex-math>$0.15~mu text{m}$ </tex-math></inline-formula>\u0000 GaAs pseudomorphic high electron mobility transistor (pHEMT) technology process, the proposed UWB MPA delivers an average small-signal gain of 16.5 dB, a saturation output power (\u0000<inline-formula> <tex-math>$text{P}_{mathrm {sat}}$ </tex-math></inline-formula>\u0000) of 24 dBm, and a peak power-added efficiency (PAE) over 24% from 24 to 38 GHz with a chip area of \u0000<inline-formula> <tex-math>$2times1$ </tex-math></inline-formula>\u0000 mm2. The broadband HPA demonstrates a 17-dB average small-signal gain, 29-dBm \u0000<inline-formula> <tex-math>$text{P}_{mathrm {sat}}$ </tex-math></inline-formula>\u0000, and a PAE over 28% from 24 to 32 GHz with a \u0000<inline-formula> <tex-math>$2.4times1.1$ </tex-math></inline-formula>\u0000 mm2 chip size. The measurement results have demonstrated the great potential of the proposed PA for 5G/6G millimeter-wave applications.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"111-121"},"PeriodicalIF":4.6,"publicationDate":"2024-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 185-to-240 GHz SiGe Power Amplifier Using Non-Zero Base-Impedances for Power Gain and Output Power Optimizations 利用非零基极阻抗优化功率增益和输出功率的 185 至 240 GHz SiGe 功率放大器
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-16 DOI: 10.1109/JETCAS.2024.3355011
Xin Zhang;Nengxu Zhu;Fanyi Meng
{"title":"A 185-to-240 GHz SiGe Power Amplifier Using Non-Zero Base-Impedances for Power Gain and Output Power Optimizations","authors":"Xin Zhang;Nengxu Zhu;Fanyi Meng","doi":"10.1109/JETCAS.2024.3355011","DOIUrl":"10.1109/JETCAS.2024.3355011","url":null,"abstract":"It is commonly practiced in millimeter-wave and terahertz cascode amplifiers to enhance the power gain by shorting the base-impedance in the common-base transistor. However, it is found that the merit of high output power is not achieved simultaneously under the zero base-impedance scenarios. This paper theoretically analyzes the optimum designs by varying the base-impedances for power gain and output power level enhancement. In addition, numerically results are given to prove that non-zero base-impedances are key parameters towards gain and output power enhancements. Thus, each stages of the power amplifier must contain different and optimized base-impedances, based on their power gain and output power targets. To validate the design theory, a 220 GHz power amplifier is designed and fabricated in a 0.13-\u0000<inline-formula> <tex-math>$mu text{m}$ </tex-math></inline-formula>\u0000 SiGe technology. The measurement reveals that the amplifier achieves operation bandwidth of 185 to 240 GHz, power gain of 25 dB, and output \u0000<inline-formula> <tex-math>$P_{mathrm {1dB}}/P_{mathrm {SAT}}$ </tex-math></inline-formula>\u0000 of 7.3/9.5 dBm. It consumes 310~324 mW dc power and occupies a core area of 0.09 mm2.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"67-74"},"PeriodicalIF":4.6,"publicationDate":"2024-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Broadband Millimeter-Wave GaAs Dual-Function Switching Attenuators With Low Insertion Loss and Large Attenuation Range 具有低插入损耗和大衰减范围的宽带毫米波砷化镓双功能开关衰减器
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-16 DOI: 10.1109/JETCAS.2024.3354778
Yutong Wang;Bo Li;Feng Lin;Houjun Sun;Hongjiang Wu;Chunliang Xu;Yuan Fang;Zhiqiang Li
{"title":"Broadband Millimeter-Wave GaAs Dual-Function Switching Attenuators With Low Insertion Loss and Large Attenuation Range","authors":"Yutong Wang;Bo Li;Feng Lin;Houjun Sun;Hongjiang Wu;Chunliang Xu;Yuan Fang;Zhiqiang Li","doi":"10.1109/JETCAS.2024.3354778","DOIUrl":"10.1109/JETCAS.2024.3354778","url":null,"abstract":"This paper presents millimeter-wave (mmW) wide-band dual-function switching attenuator chips based on gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT). The broadband attenuator chips integrate the function of absorption single-pole-single-throw (SPST) switch by using balanced architecture. By analyzing the effects of transistor size and parasitic couplings from bias lines on mmW attenuator chips, the attenuation range is further improved. Based on the 90-nm GaAs pHEMT process, a 26~80 GHz attenuator chip I and a 40~110 GHz attenuator chip II were designed and measured, with chip sizes of \u0000<inline-formula> <tex-math>$1.65ast 0.85$ </tex-math></inline-formula>\u0000mm2 and \u0000<inline-formula> <tex-math>$1.30ast 0.80$ </tex-math></inline-formula>\u0000mm2, respectively. In the operating frequency band, the measured insertion losses (IL) of chips I and II are less than 2.8 dB and 2.2 dB, respectively, with the return losses (RL) of better than 12.4 dB and 11.6 dB. At the center frequency, the measured attenuation ranges of Chip I and II are \u0000<inline-formula> <tex-math>$1.4sim 34.4$ </tex-math></inline-formula>\u0000 dB and \u0000<inline-formula> <tex-math>$1.1sim 30.9$ </tex-math></inline-formula>\u0000 dB, respectively, and the 1dB compressed input power (\u0000<inline-formula> <tex-math>$IP_{mathrm {1dB}})$ </tex-math></inline-formula>\u0000 of both chips are greater than 21 dBm. To the best of authors’ knowledge, this is the first wide-band mmW GaAs pHEMT attenuator chip integrated with absorption SPST switching function.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"100-110"},"PeriodicalIF":4.6,"publicationDate":"2024-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of Broadband Doherty Power Amplifier Based on Single Loop Load Modulation Network 基于单回路负载调制网络的宽带 Doherty 功率放大器设计
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-15 DOI: 10.1109/JETCAS.2024.3354503
Ge Bai;Zhijiang Dai;Jingsong Wang;Cheng Bi;Weimin Shi;Jingzhou Pang;Mingyu Li
{"title":"Design of Broadband Doherty Power Amplifier Based on Single Loop Load Modulation Network","authors":"Ge Bai;Zhijiang Dai;Jingsong Wang;Cheng Bi;Weimin Shi;Jingzhou Pang;Mingyu Li","doi":"10.1109/JETCAS.2024.3354503","DOIUrl":"10.1109/JETCAS.2024.3354503","url":null,"abstract":"This paper proposes a Doherty power amplifier (DPA) architecture with potential for wideband and high efficiency, denoted as single-loop load matching network DPA (SL-LMN). The conventional single combination node network is replaced by an SL-LMN, which adds a new current combination node. This architecture can bring new circuit design freedom, which expands the operating bandwidth of the load modulation network. Using the same prototype topology, the working mechanism of SL-LMN DPA is further illustrated based on three sets of comparative designs. To prove this theory, a broadband asymmetric DPA (ADPA) functioning over 1.9-2.9 GHz is developed and fabricated using two asymmetric GaN transistors. Under continuous wave excitation, the observed data indicates that the drain efficiency of this ADPA is 42.1%-68.9% at saturation and 45.5%-58.5% at 8 dB back-off, respectively. The ADPA has a maximum output power and saturated gain of 44–46 dBm and 6.8-10.9 dB, respectively.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"122-132"},"PeriodicalIF":4.6,"publicationDate":"2024-01-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 39 GHz Doherty-Like Power Amplifier With 22dBm Output Power and 21% Power-Added Efficiency at 6dB Power Back-Off 在 6dB 功率衰减时输出功率为 22dBm 且功率附加效率为 21% 的 39 GHz 类多赫蒂功率放大器
IF 4.6 2区 工程技术
IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-08 DOI: 10.1109/JETCAS.2024.3351075
Lang Chen;Lisheng Chen;Depeng Sun;Yichuang Sun;Yulin Pan;Xi Zhu
{"title":"A 39 GHz Doherty-Like Power Amplifier With 22dBm Output Power and 21% Power-Added Efficiency at 6dB Power Back-Off","authors":"Lang Chen;Lisheng Chen;Depeng Sun;Yichuang Sun;Yulin Pan;Xi Zhu","doi":"10.1109/JETCAS.2024.3351075","DOIUrl":"10.1109/JETCAS.2024.3351075","url":null,"abstract":"The design of a Doherty-like power amplifier for millimetre-wave (mm-wave) applications is presented in this work. The designed power amplifier employs a novel symmetrical load-modulated balanced amplifier (S-LMBA) architecture. This design is advantageous in minimizing the undesired impedance interaction often encountered in the classic LMBA approach. Such interactions are typically due to the use of a non-\u0000<inline-formula> <tex-math>$50~Omega $ </tex-math></inline-formula>\u0000 load at the isolation port of the output quadrature coupler. Moreover, magnitude and phase control networks are carefully designed to generate the specific magnitude and phase information for the designed S-LMBA. To demonstrate the proposed ideas, the S-LMBA is fabricated in a 45-nm CMOS SOI technology. At 39 GHz, a 22.1 dBm saturated output power (\u0000<inline-formula> <tex-math>$text{P}_{mathrm {sat}}$ </tex-math></inline-formula>\u0000) with a maximum power-added efficiency (PAE) of 25.7% is achieved. In addition, 1.68 times drain efficiency enhancement is obtained over an ideal Class-B operation, when the designed S-LMBA is operated at 6 dB power back-off. An average output power of 13.1 dBm with a PAE of 14.4% at an error vector magnitude (EVM\u0000<inline-formula> <tex-math>$_{mathrm {rms}}$ </tex-math></inline-formula>\u0000) above -22.5 dB and adjacent channel power ratio (ACPR) of -23 dBc is also achieved, when a 200 MHz single carrier 64-quadrature-amplitude-modulation (QAM) signal is used. Including all testing pads, the footprint of the designed S-LMBA is only 1.56 mm2.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"14 1","pages":"88-99"},"PeriodicalIF":4.6,"publicationDate":"2024-01-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139949280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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