利用异质集成硅 IPD 和 HDI-PCB 封装超宽带毫米波天线，实现 B5G/6G 应用

IF 3.7 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-01-24 DOI:10.1109/JETCAS.2024.3358222

Neda Khiabani;Ching-Wen Chiang;Nai-Chen Liu;Pai-Yen Chen;Yen-Cheng Kuan;Chung-Tse Michael Wu

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引用次数: 0

摘要

本研究介绍了具有紧密耦合阵列（TCA）配置的超宽带毫米波（mmWave）天线的设计、创建和测试。这些天线采用超材料 (MTM) 设计和先进的高密度互连 (HDI) 封装天线 (AiP) 技术制造，是超 5G (B5G) 和 6G 网络的理想选择。MTM 天线阵列的主要元件采用硅基集成无源器件 (IPD) 技术制造，并通过倒装芯片粘合到包括电阻频率选择表面 (FSS) 的多层 HDI-PCB 上。这些阵列天线通过同轴馈电系统进行差分馈电。该研究介绍了两种类型的 5 美元/次 5 元有限阵列：一种是基于金属-绝缘体-金属（MIM）电容器的 MTM 弓形阵列，其差分电压驻波比（VSWR）为 3.5 美元/次，工作频率为 16.2 至 100 GHz（不包括 18.26 至 18.68 GHz 和 60.8 至 61.13 GHz）；另一种是基于数字间电容器的 MTM 弓形阵列，工作频率为 18.85 至 100 GHz（不包括 41.52 至 42.25 GHz）。这些原型的实验验证证实了它们的性能，在带宽和辐射特性方面与模拟结果十分吻合。

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Metamaterial-Enabled Ultrawideband mmWave Antenna-in-Package Using Heterogeneously-Integrated Silicon IPD and HDI-PCB for B5G/ 6G Applications

This work presents the design, creation, and testing of ultrawideband millimeter-wave (mmWave) antennas with a tightly coupled array (TCA) configuration. These antennas are made using metamaterial (MTM) designs and advanced high-density interconnect (HDI) antenna-in-package (AiP) technologies, ideal for beyond-5G (B5G) and 6G networks. The main elements of the MTM antenna array are constructed with silicon-based integrated passive device (IPD) technology and are flip-chip bonded to a multi-layered HDI-PCB that includes a resistive frequency selective surface (FSS). These array antennas are differentially fed through a coax-via system. The study presents two types of

$5\times 5$

finite arrays: a metal-insulator-metal (MIM) capacitor-based MTM bowtie array with a differential Voltage Standing Wave Ratio (VSWR)

$\le3.5$

, operating from 16.2 to 100 GHz (excluding 18.26–18.68 GHz and 60.8–61.13 GHz), and an interdigital capacitor-based MTM bowtie array functioning from 18.85 to 100 GHz (excluding 41.52–42.25 GHz). Experimental validation of these prototypes confirms their performance, aligning well with simulated results in terms of bandwidth and radiation characteristics.

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来源期刊

IEEE Journal on Emerging and Selected Topics in Circuits and Systems ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

8.50

自引率

2.20%

发文量

期刊介绍： The IEEE Journal on Emerging and Selected Topics in Circuits and Systems is published quarterly and solicits, with particular emphasis on emerging areas, special issues on topics that cover the entire scope of the IEEE Circuits and Systems (CAS) Society, namely the theory, analysis, design, tools, and implementation of circuits and systems, spanning their theoretical foundations, applications, and architectures for signal and information processing.