2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)最新文献_第4页

Reliability of UHF RFID tags in humid environments 超高频RFID标签在潮湿环境中的可靠性

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507074

K. Saarinen, L. Frisk

{"title":"Reliability of UHF RFID tags in humid environments","authors":"K. Saarinen, L. Frisk","doi":"10.1109/EPTC.2012.6507074","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507074","url":null,"abstract":"Radio frequency identification (RFID) is an emerging technology in the field of identification and security. With RFID tags it is possible to identify objects individually and reliably using radio waves. However, due to numerous applications, RFID tags are exposed to various environmental conditions which may impair their reliability. Long-term reliability is generally studied using accelerated environmental tests. In earlier studies a combination of high humidity and high temperature has been found to be very harmful to RFID tags. Consequently, in this study failure times and mechanisms between three accelerated humidity tests were compared to find a test which is most suitable for RFID tags. A passive ultra high frequency (UHF) RFID tag with a polyethylene terephthalate (PET) substrate was tested using two constant humidity tests and a humidity cycling test. According to this study, the selection of test conditions for reliability studies in humid environments should be carefully considered. PET substrate is susceptible to hydrolysis when a combination of high humidity and high temperature is present. Consequently, a standard 85°C/85% test is very harsh for RFID tags with PET substrate. On the other hand if a cycling test is used instead of a constant test to acclerate the test, the failure mechanism may alter. Therefore it is important to investigate the effects of changing humidity, but a constant humidity test cannot be directly replaced by the faster humidity cycling test due to the different stresses caused by the tests.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"212 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132195559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Development of new TSV structure composing of intermetallic compounds 新型TSV结构金属间化合物组成的研究进展

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507108

Daquan Yu, Xiaoyang Liu, R. He, X. Jing, Chongshen Song, Fengwei Dai, Yu Sun, L. Wan

{"title":"Development of new TSV structure composing of intermetallic compounds","authors":"Daquan Yu, Xiaoyang Liu, R. He, X. Jing, Chongshen Song, Fengwei Dai, Yu Sun, L. Wan","doi":"10.1109/EPTC.2012.6507108","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507108","url":null,"abstract":"TSV was regarded as the core technology enabling 3D IC integration. For volume production, the requirement of low-cost TSV fabrication process was a big challenge. In order to find a fast filling method, new Cu plating solutions are desirable and some new filling method using solder, Cu cored solder ball were studied. A new TSV structure composed of intermetallic compounds (IMCs) was proposed in present paper and the manufacturing process was introduced. To form such a TSV structure, it needs to fill liquid solder into the vias and accelerate the inter-diffusion of solder and metal on the sidewall of the vias by annealing. The feasibility of the formation of IMC TSVs was studied using SnPb solder. The solder was filled into the vias in which partial annular Cu layer was plated. Successful voids free filling with thin protrusion of solder material on the top of the vias was achieved. Finite element analysis (FEA) of TSV filling with Cu, solder and Sn-based IMC were carried out and the results showed that the IMC filled TSVs can get comparable or even lower stress depending on the CTE of the IMCs. According to present results, it can be concluded that the IMC TSVs have the following merits: fast and low cost forming process, good high temperature stability and the lower stress.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134030634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Roll-to-roll (R2R) hot embossing for structuring 3D microstructures on polymer films 卷对卷(R2R)热压成型用于聚合物薄膜上的三维微结构

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507146

X. Shan, M. B. Mohahidin, A. Lu

引用次数: 2

Study on creep fatigue behaviour of soft solders die attach for power package applications 电源封装用软焊料接头蠕变疲劳性能研究

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507055

Dandong Ge, F. Che, Yik Siong Tay, S. L. Gan, M. Yazid

{"title":"Study on creep fatigue behaviour of soft solders die attach for power package applications","authors":"Dandong Ge, F. Che, Yik Siong Tay, S. L. Gan, M. Yazid","doi":"10.1109/EPTC.2012.6507055","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507055","url":null,"abstract":"Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties and outstanding robustness against delamination compared to traditional epoxy die attach. However, the creep-fatigue failure is one typical failure mechanism for solder material under thermal cycling. So it is essential to to understand the solder failure due to soft solder creep fatigue behavior. In this work, tensile creep tests for two soft solders, solder A and B, have been conducted at various temperatures and stress levels using a Dynamic Mechanical Analyzer (DMA). Creep constitutive models were developed and the material constants of the model were determined based on experimental results for both solders. The creep constitutive models were implemented in finite element analysis (FEA) to investigate the creep behavior of solder in the power packages for the evaluation of package reliability. Results show that solder A has better creep resistance than solder B, which indicates that the package with using solder A should have higher creep fatigue reliability than package with using solder B when subjected to thermal cycling. The storage modulus, liquidus temperature/solidus temperature for two types of solders were also measured by DMA and Differential Scanning Calorimetry (DSC), respectively.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"186 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132044299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Design and implementation of magnetically coupled current probe for monitoring simultaneous switching current in package 用于监测封装中同步开关电流的磁耦合电流探头的设计与实现

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507060

Changhyun Cho, Jonghyun Cho, Jonghoon J. Kim, Joungho Kim, J. Pak

引用次数: 0

Substrateless sensor packaging using wafer level fan-out technology 采用晶圆级扇出技术的无衬底传感器封装

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507124

M. Briindel, U. Scholz, F. Haag, E. Graf, T. Braun, K. Becker

引用次数: 5

Vacuum based wafer level encapsulation (WLE) of MEMS using physical vapor deposition (PVD) 基于物理气相沉积(PVD)的MEMS真空晶圆级封装(WLE)

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507104

B. Soon, Navab Singh, J. Tsai, Chengkuo Lee

引用次数: 2

LED thermal management of an automotive electronic control module with display 带显示屏的汽车电子控制模块的LED热管理

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507187

S. Sushanth Kumar, Satishchandra C Warn, Roland Lee

{"title":"LED thermal management of an automotive electronic control module with display","authors":"S. Sushanth Kumar, Satishchandra C Warn, Roland Lee","doi":"10.1109/EPTC.2012.6507187","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507187","url":null,"abstract":"In automobiles, an ECM (Electronic Control Module) is used for controlling internal ambient temperature of vehicles to enhance comfort level of passengers. It typically contains a display module to show various operational modes such as cooling air temperature, ON/OFF for blower, AC, de-fogger etc. The display module uses LEDs as source of illumination. Adequate illumination requires packaging of several LEDs m a compact/constrained space. Also LEDs must operate at very high ambient temperature of 85°C that leads to significant thermal management challenges. This paper describes parametric studies using various thermal management techniques such as heat spreader, increased PCB copper layer thickness, increased copper pad size for LED, high conductive plastic back cover along with pedestals, thermal via for LEDs and vent holes for the enclosure; to bring down LED temperatures within its safe operating limit. LEDs are modeled in detail (using contact resistance between the die and lead frame) in order to improve the accuracy of junction temperature prediction. A combination of thermal management solutions/techniques are used to mitigate heat from LEDs with significant bearing on cost competitiveness.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123194311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

High-temperature endurable encapsulation material 耐高温封装材料

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507052

V. Chidambaram, Ho Beng Yeung, C. Sing, Daniel Rhee Min Woo

{"title":"High-temperature endurable encapsulation material","authors":"V. Chidambaram, Ho Beng Yeung, C. Sing, Daniel Rhee Min Woo","doi":"10.1109/EPTC.2012.6507052","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507052","url":null,"abstract":"The accomplishment of fully functional high-pressure high-temperature (HPHT) well is possible only, when the packaging and interconnections in the well logging equipments can survive at higher temperatures. Currently, there are numerous choices for substrate materials and interconnection materials. However, there are hardly any encapsulation materials that can endure at 300°C. Thus, the limiting factor for the evaluation and monitoring of HPHT wells is; the availability of high-temperature endurable encapsulation material. In this paper, the endurability of three prospective candidates for high-temperature encapsulation have been characterized and reported. The three prospective candidates are benzocyclobutene (BCB), ceramic filled cyanate ester and quartz filled cyanate ester. The high-temperature endurability has been evaluated in this work by high-temperature storage at 300°C up to 500 hours. Adhesion strength of these prospective candidates with the alumina ceramic substrate and the Si die was verified by room shear testing and hot shear testing. It has been determined that the quartz filled cyanate ester could comply with the minimum indispensable requirement for this application, when sandwiched between alumina ceramic substrates, despite the loss of strength during long-term thermal aging at 300°C. The material degradation has been studied in this work, using thermo-gravimetric analysis.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131273785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Wire bond and molding factors influencing bare Cu wire surface conditions 影响裸铜线表面状况的线材粘结和成型因素

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI: 10.1109/EPTC.2012.6507134

Chan Wai Kok, Tham Veng Leong, W. Yong

引用次数: 0