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2022 International Conference on Electronics Packaging (ICEP)最新文献

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Effect of Interfacial Chemistry on Electrical Reliability of Copper-filled Electrically Conductive Adhesives 界面化学对铜填充导电胶粘剂电可靠性的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795468
Daisuke Otajima, Yukari Matsunami, M. Inoue
{"title":"Effect of Interfacial Chemistry on Electrical Reliability of Copper-filled Electrically Conductive Adhesives","authors":"Daisuke Otajima, Yukari Matsunami, M. Inoue","doi":"10.23919/ICEP55381.2022.9795468","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795468","url":null,"abstract":"To investigate the effect of surface treatment agents on electrical resistivity in an 85°C/85%RH environment, copper (Cu) fillers surface-treated with oleic acid and triethanolamine were mixed with a resol-type phenolic resin to obtain the conductive adhesives. When the cured samples were exposed to 85°C/85%RH, the electrical resistivity increased significantly when oleic acid and triethanolamine were individually used for the surface treatment of the fillers. However, the increase in resistivity was greatly suppressed when these surfactants were simultaneously used for the surface treatment. This suggests that interfacial chemistry is a key for designing advanced Cu-filled adhesives.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133027942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Eu-doped GaN-Based Red LED for Next-Generation Micro-LED Displays 下一代微型LED显示用掺铕氮化镓红色LED
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795364
Y. Fujiwara, S. Ichikawa, D. Timmerman, J. Tatebayashi
{"title":"Eu-doped GaN-Based Red LED for Next-Generation Micro-LED Displays","authors":"Y. Fujiwara, S. Ichikawa, D. Timmerman, J. Tatebayashi","doi":"10.23919/ICEP55381.2022.9795364","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795364","url":null,"abstract":"A novel red LED using Eu-doped GaN is a promising component for next-generation micro-LED display with ultrasmall-size, full-color, and high-resolution. The LED exhibits narrow-band red emission and the wavelength is almost independent of ambient temperature and injected current. The size dependence of emission efficiency is negligibly small compared with conventional AlInGaP-based red LEDs. We also demonstrated monolithic integration of vertically stacked full-color LEDs on a sapphire substrate.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133555444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints SAC焊点喷墨印刷银垫的可焊性分析
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795503
Q. Jiang, N. Tu, J. Lo, S. R. Ricky Lee
{"title":"Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints","authors":"Q. Jiang, N. Tu, J. Lo, S. R. Ricky Lee","doi":"10.23919/ICEP55381.2022.9795503","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795503","url":null,"abstract":"Inkjet printing has been studied as one of the potential complements to conventional photolithography for low-cost and rapid prototyping. Different functional inks are directly patterned on the substrate to achieve the desired purpose. In this work, we investigated direct printing of the under-bump metallization (UBM) with a thermally curable particle-free silver ink and the solderability of such printed pads with SAC solder. As silver dissolves in the molten solder and forms intermetallic compounds (IMCs), the thickness of the printed metallization layer is critical for reliable solder joints. Both metallographic cross-sectional analysis and ball shear tests were conducted on samples after the reflow.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122231338","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Development of Wearable Measuring Technology for Deep-Body Temperature 可穿戴式深部体温测量技术的发展
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795584
Fukui Shoya, N. Hashimoto
{"title":"Development of Wearable Measuring Technology for Deep-Body Temperature","authors":"Fukui Shoya, N. Hashimoto","doi":"10.23919/ICEP55381.2022.9795584","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795584","url":null,"abstract":"Deep-body temperature is regarded as important ecological data, which, if measured using a compact, wearable thermometer, will be useful for early detection of heat stroke and physical condition management of infants. In this study, we developed a deep-body temperature measurement technique based on the non restraint and non invasive dual-heat-flux method and showed the possibility of realizing a compact and high-performance wearable deep-body thermometer.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129966501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer/Panel Level Packaging 扇形圆片/面板级封装的小间距电路图案检测能力研究
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795644
Feng Xue, Zhihua Zou, C. Reynolds, T. Wassick, Glenn Pomerantz, Anna Lucy Santos, Neil Tang, Alison Yu-Ting Lin, Jing-Sian Huang, M. Tsuriya
{"title":"Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer/Panel Level Packaging","authors":"Feng Xue, Zhihua Zou, C. Reynolds, T. Wassick, Glenn Pomerantz, Anna Lucy Santos, Neil Tang, Alison Yu-Ting Lin, Jing-Sian Huang, M. Tsuriya","doi":"10.23919/ICEP55381.2022.9795644","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795644","url":null,"abstract":"Test Vehicles (TVs) were developed to examine the high-volume manufacturing (HVM) readiness of AOI (Automated Optical Inspection) systems supporting the inspection of fine pitch advanced substrates designed for high bandwidth applications. This study demonstrated the capability of defect detections with current inspection systems. The wide variability of the data suggests that some improvements are desired in feature edge detections. Additionally, some of the AOI systems are capable of HVM inspection down to 4 um trace width/spaces with 1um level defects.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126583788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Advanced Under-Bump-Metal Scaling Solder Micro-Bump Interconnect Down to 10μm Pitch 先进的凸点下金属缩放焊料微凸点互连低至10μm间距
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795439
Takahiro Tanaka, Masaru Hatabe, Hironori Yamada, Zhaozhi Li, Y. Tomita
{"title":"Advanced Under-Bump-Metal Scaling Solder Micro-Bump Interconnect Down to 10μm Pitch","authors":"Takahiro Tanaka, Masaru Hatabe, Hironori Yamada, Zhaozhi Li, Y. Tomita","doi":"10.23919/ICEP55381.2022.9795439","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795439","url":null,"abstract":"Fe-Co alloy can inhibit intermetallic compound (IMC) growth during assembly process as alternative under bump metallization (UBM) to conventional UBM represented by Ni. Results on IMC growth study indicates Fe-Co UBM is scalable to solder bump first level interconnect (FLI) in 10 μm pitch.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121104063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating 烧结温度对无压烧结铜膏模剪强度的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795363
D. Ishikawa, T. Blank, H. Wurst, Felix Steiner, H. Nakako
{"title":"Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating","authors":"D. Ishikawa, T. Blank, H. Wurst, Felix Steiner, H. Nakako","doi":"10.23919/ICEP55381.2022.9795363","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795363","url":null,"abstract":"Die-bonding technology using Cu sinter pastes is an attractive and important joint method for power devices operating at higher temperatures. This paper describes the effect of sintering temperatures on die-shear strengths of non-pressure sintered copper (sCu) onto six different metal platings (Cu, Ni, Electroless Ni, Pd, Ag, and Au). The die-shear strengths of sCu on the metal plating under sintering temperatures (225-350 °C) in H2 gas were measured. As the sintering temperatures increased, the shear strengths on the Cu, Ni, and ENi plating increased, whereas those on the Pd, Ag, and Au plating decreased. By analyzing the element distribution on the bonding interfaces using SEM/EDX, it was found that the self- and non-diffusion couples (sCu:Cu, sCu:Ni, sCu:ENi) can keep the high shear strengths and the diffused couples (sCu:Pd, sCu:Ag, sCu:Au) can deteriorate the shear strengths.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122820530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Control of Mechanical and Electrical Properties of Stretchable Wires Printed with Conductive Pastes Composed of a Polyurethane-based Binder 聚氨酯基粘结剂组成的导电浆料印刷可拉伸导线的机械和电气性能控制
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795395
M. Inoue, Hikaru Watanabe
{"title":"Control of Mechanical and Electrical Properties of Stretchable Wires Printed with Conductive Pastes Composed of a Polyurethane-based Binder","authors":"M. Inoue, Hikaru Watanabe","doi":"10.23919/ICEP55381.2022.9795395","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795395","url":null,"abstract":"This paper discussed the effect of binder chemistry on electrical conductivity variation due to the tensile deformation of stretchable wires and electrodes printed with polyurethane-based electrically conductive pastes containing silver micro-flakes. Although their electrical conductivity usually showed a significant variation during uniaxial cyclic tensions, some polyurethane-based binders, including polyhydroxyurethane, effectively suppressed the electrical conductivity variation. The polyhydroxyurethane-based wires and electrodes' electrical conductivity was significantly stabilized by mixing a cross-linking agent into the binder. Binder chemistry is one of the critical factors in developing novel electrically conductive pastes for printing stretchable wires and electrodes.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123962999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Heat transfer performance of two-phase immersion cooling by breathing phenomena with different pore structures of lotus copper 不同孔结构莲花铜呼吸现象两相浸没冷却换热性能
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795624
M. Terada, K. Yuki, N. Unno, R. Kibushi, T. Ogushi, M. Murakami, T. Numata, T. Ide, H. Nomura
{"title":"Heat transfer performance of two-phase immersion cooling by breathing phenomena with different pore structures of lotus copper","authors":"M. Terada, K. Yuki, N. Unno, R. Kibushi, T. Ogushi, M. Murakami, T. Numata, T. Ide, H. Nomura","doi":"10.23919/ICEP55381.2022.9795624","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795624","url":null,"abstract":"The purpose of this study is to enhance the critical heat flux of two-phase immersion cooling in saturated pool boiling. A lotus copper is joined onto a grooved heat transfer surface to prevent the coalescence of generated bubbles. In this paper, we experimentally investigate the influence of the thicknesses of the lotus copper on the critical heat flux. The thicknesses are 1 mm and 3 mm. We achieve the critical heat flux of 492 W/cm2 in the case of thickness of 1 mm (the average pore size: 0.65 mm). On the other hand, the critical heat flux is 409 W/cm2 in the case of thickness of 3 mm (the average pore size: 0.77 mm). The cooling performance could be enhanced by reducing the thickness of the lotus copper by making it easier to supply much coolant by the breathing phenomenon.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127160970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Embedded Power GaN Components inside a PCB for space applications 用于空间应用的PCB内嵌入式功率GaN组件
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795593
T. Youssef, T. Löher, S. Azzopardi
{"title":"Embedded Power GaN Components inside a PCB for space applications","authors":"T. Youssef, T. Löher, S. Azzopardi","doi":"10.23919/ICEP55381.2022.9795593","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795593","url":null,"abstract":"This paper presents the embedding of prepackaged GaN-components for an application of power propulsion unit (PPU) for satellite applications. First embedding trials of the packages with only minor preconditioning resulted in massive failure of the modules in reflow-tests. These failures have been analyzed and understood thanks to finite elements simulations.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126688842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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