Feng Xue, Zhihua Zou, C. Reynolds, T. Wassick, Glenn Pomerantz, Anna Lucy Santos, Neil Tang, Alison Yu-Ting Lin, Jing-Sian Huang, M. Tsuriya
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Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer/Panel Level Packaging
Test Vehicles (TVs) were developed to examine the high-volume manufacturing (HVM) readiness of AOI (Automated Optical Inspection) systems supporting the inspection of fine pitch advanced substrates designed for high bandwidth applications. This study demonstrated the capability of defect detections with current inspection systems. The wide variability of the data suggests that some improvements are desired in feature edge detections. Additionally, some of the AOI systems are capable of HVM inspection down to 4 um trace width/spaces with 1um level defects.
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