Advanced Under-Bump-Metal Scaling Solder Micro-Bump Interconnect Down to 10μm Pitch

2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI:10.23919/ICEP55381.2022.9795439

Takahiro Tanaka, Masaru Hatabe, Hironori Yamada, Zhaozhi Li, Y. Tomita

引用次数: 0

Abstract

Fe-Co alloy can inhibit intermetallic compound (IMC) growth during assembly process as alternative under bump metallization (UBM) to conventional UBM represented by Ni. Results on IMC growth study indicates Fe-Co UBM is scalable to solder bump first level interconnect (FLI) in 10 μm pitch.

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先进的凸点下金属缩放焊料微凸点互连低至10μm间距

Fe-Co合金可以作为碰撞金属化(UBM)的替代材料，在组装过程中抑制金属间化合物(IMC)的生长。IMC生长研究结果表明，Fe-Co UBM可扩展到10 μm间距的凸点一级互连(FLI)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2022 International Conference on Electronics Packaging (ICEP)

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