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Holistic Cycle Time Analysis and Improvement Project within a 200mm Lithography I-line Production Area 200mm光刻i线生产区域整体周期时间分析及改进项目
The 17th Annual SEMI/IEEE ASMC 2006 Conference Pub Date : 2006-05-22 DOI: 10.1109/ASMC.2006.1638736
T. Zarbock, F. Lehmann, J. Fellendorf
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引用次数: 0
Methods for Fast Yield Learning in A DRAM Wafer Fab using a Remote Packaging and Test Site. 采用远程封装和测试场所的DRAM晶圆厂快速良率学习方法。
The 17th Annual SEMI/IEEE ASMC 2006 Conference Pub Date : 2006-05-22 DOI: 10.1109/ASMC.2006.1638748
R. Trahan, W. Hill, R. Chapman, A. Bicho, N. Gumaer, M. Gomes
{"title":"Methods for Fast Yield Learning in A DRAM Wafer Fab using a Remote Packaging and Test Site.","authors":"R. Trahan, W. Hill, R. Chapman, A. Bicho, N. Gumaer, M. Gomes","doi":"10.1109/ASMC.2006.1638748","DOIUrl":"https://doi.org/10.1109/ASMC.2006.1638748","url":null,"abstract":"In this paper, we describe the issues and solutions for overcoming the distance between a DRAM wafer fab facility and a remote packaging and test site. Fast cycle time of experimental feedback allow for accelerated yield learning and volume ramping","PeriodicalId":407645,"journal":{"name":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","volume":"116 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123650642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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