采用远程封装和测试场所的DRAM晶圆厂快速良率学习方法。

The 17th Annual SEMI/IEEE ASMC 2006 Conference Pub Date : 2006-05-22 DOI:10.1109/ASMC.2006.1638748

R. Trahan, W. Hill, R. Chapman, A. Bicho, N. Gumaer, M. Gomes

{"title":"采用远程封装和测试场所的DRAM晶圆厂快速良率学习方法。","authors":"R. Trahan, W. Hill, R. Chapman, A. Bicho, N. Gumaer, M. Gomes","doi":"10.1109/ASMC.2006.1638748","DOIUrl":null,"url":null,"abstract":"In this paper, we describe the issues and solutions for overcoming the distance between a DRAM wafer fab facility and a remote packaging and test site. Fast cycle time of experimental feedback allow for accelerated yield learning and volume ramping","PeriodicalId":407645,"journal":{"name":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","volume":"116 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Methods for Fast Yield Learning in A DRAM Wafer Fab using a Remote Packaging and Test Site.\",\"authors\":\"R. Trahan, W. Hill, R. Chapman, A. Bicho, N. Gumaer, M. Gomes\",\"doi\":\"10.1109/ASMC.2006.1638748\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we describe the issues and solutions for overcoming the distance between a DRAM wafer fab facility and a remote packaging and test site. Fast cycle time of experimental feedback allow for accelerated yield learning and volume ramping\",\"PeriodicalId\":407645,\"journal\":{\"name\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"volume\":\"116 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2006.1638748\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2006.1638748","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在本文中，我们描述了克服DRAM晶圆厂设施与远程封装和测试站点之间距离的问题和解决方案。实验反馈的快速周期时间允许加速产量学习和体积上升

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Methods for Fast Yield Learning in A DRAM Wafer Fab using a Remote Packaging and Test Site.

In this paper, we describe the issues and solutions for overcoming the distance between a DRAM wafer fab facility and a remote packaging and test site. Fast cycle time of experimental feedback allow for accelerated yield learning and volume ramping

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

The 17th Annual SEMI/IEEE ASMC 2006 Conference

自引率

0.00%

发文量