Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.最新文献_第3页

Optimising the wave soldering process for lead free solders 优化无铅焊料的波峰焊工艺

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452331

S. Stoyanov, C. Bailey, N. Saxena, S. Adams

引用次数: 0

Design for green electronics, a great potential is still ahead 对于绿色电子产品的设计，巨大的潜力仍在前方

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452308

Li Ying, N. de Caluwe, A. Stevels

引用次数: 2

Effect of laser input energy on wetting areas of solder and formation of intermetallic compounds at Sn-3.5Ag-0.75Cu/Au right-angled joint interface 激光输入能量对Sn-3.5Ag-0.75Cu/Au直角连接界面钎料润湿面积及金属间化合物形成的影响

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452344

W. Liu, Chunqing Wang, Mingyu Li, Li Ling

{"title":"Effect of laser input energy on wetting areas of solder and formation of intermetallic compounds at Sn-3.5Ag-0.75Cu/Au right-angled joint interface","authors":"W. Liu, Chunqing Wang, Mingyu Li, Li Ling","doi":"10.1109/AGEC.2005.1452344","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452344","url":null,"abstract":"This paper presents the effect of laser input energy on the wetting areas of solder on pads after first laser reflow, and the formation of IMC (intermetallic compounds) at Sn3.5Ag-0.75Cu/Au right-angled joint interface during second laser reflow. The results showed that the wetting areas of solder on pads were getting larger with the increase of laser input energy. AuSnx IMC were observed at the interface of solder and the pad finished with 4 /spl mu/m Au/0.1 /spl mu/m Ta after second laser reflow, the amount and distribution of IMC was strongly affected by laser input energy. In addition, when the laser input energy was increased, the diffusion of copper at the interface of solder and the pad made of Cu plated with 3 /spl mu/m Au was getting larger, and the AuSnx IMC layers could not be well distinguished as the interface between solder and the pad finished with 4 /spl mu/m Au/0.1 /spl mu/m Ta, which may be caused by the increased diffusion of Cu and formation of Cu/sub x/Sn/sub y/ or Cu/sub x/Au/sub y/Sn/sub z/ IMC in the condition of high energy input.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127809255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Effects of Bi & Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy Bi和Ni添加剂对Sn-Zn-Cu无铅合金组织和润湿性能的影响

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452324

H.P. Xie, D.Q. Yu, L. Wang

{"title":"Effects of Bi & Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy","authors":"H.P. Xie, D.Q. Yu, L. Wang","doi":"10.1109/AGEC.2005.1452324","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452324","url":null,"abstract":"The microstructures and melting behaviors of (Sn-9Zn)-2Cu (SZC) lead-free solder with 3%Bi and various amount of Ni additions were studied in the experiment. The wetting properties and the interfacial reaction of these alloys soldering on a Cu substrate were also examined. The results indicated that the addition of 3% Bi could decrease the melting point and Ni would refine the microstructures and the rod-shape Cu/sub 5/Zn/sub 8/ phase changed into square-shape (Cu, Ni)/sub 5/Zn/sub 8/ phase. By using mildly active rosin (RMA) flux, the wetting angle of Sn-9Zn was 89/spl deg/ while that of SZC-3Bi-1Ni was 42/spl deg/. The improvement on wettability was due to the addition of the interface tension depressant Bi element and the formation of the (Cu, Ni)/sub 5/Zn/sub 8/ compound in the solder which refrained the oxidation of Zn atoms at the surface of the liquid solder. The lower surface tension lead to the better wettability. In addition, the interfacial phase of the solder/Cu joint was typically planar Cu/sub 5/Zn/sub 8/, which decreased from 4 /spl mu/m for SZC to 3 /spl mu/m in the SZC-3Bi-1Ni alloy.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127915740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Implementing WEEE in Denmark - has extended producer responsibility been the outcome? 在丹麦实施报废电子电气设备——延长生产者责任的结果是什么?

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452317

C. Braun, K. Dirckinck-Holmfeld

引用次数: 6

A reflow soldering retro-design system for rework station based on Q-factor 基于q因子的返工站回流焊返修设计系统

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452315

X. Sheng, H. Ding, Y. Yin, Y.P. Wu

引用次数: 0

Assessment of long-term reliability in lead-free assemblies 无铅组件的长期可靠性评估

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452334

S. Ganesan, Ji Wu, M. Pecht, R. Lee, J. Lo, Yun Fu, Yonghong Li, Ming Xu

引用次数: 10

Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder Sn-Zn基无铅钎料合金替代Sn-Pb钎料的润湿和界面反应

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452341

M.N. Islam, Y. Chan

{"title":"Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder","authors":"M.N. Islam, Y. Chan","doi":"10.1109/AGEC.2005.1452341","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452341","url":null,"abstract":"The world is moving toward 'green products' for electronic devices and components due to the toxicity of Pb. In this paper two types of solder paste such as Sn-9Zn (eutectic) and Sn-8Zn-3Bi (noneutectic) have been investigated along with Sn-37Pb (eutectic) solder for reference. The variation of dissolution of Cu layer and IMC with reflow time shows different characteristics for eutectic and non-eutectic solder pastes. The morphologies of the IMC are quite different for different solder compositions. During as reflowed, the growth rate of IMC in the Sn-Zn based solder is higher than the SnPb solders. Different types of IMC such as /spl gamma/- Cu/sub 5/Zn/sub 8/, /spl beta/-CuZn and thin unknown Cu-Zn layer are formed in the Sn-Zn based solder but in case of Sn-Pb solder Cu/sub 6/Sn/sub 5/ IMC layer are formed at the interface of the Cu/solderjoint. Cu/sub 3/Sn IMC are formed after 10 minutes reflow due to the limited supply of Sn from the Sn-Pb solder. The wettability of Sn-Zn solder is found as least compared with the other solders. The size of Zn platelets is increased with an increase of reflow time for the Sn-Zn solder system. In the case of Sn-Zn-Bi solder, Bi offers significant effects on growth rate of IMC as well as size and distribution of Zn-rich phase in the /spl beta/-Sn matrix. No Cu-Sn IMC are found in the Sn-Zn based solder during 20 minutes reflow. Cu-Zn IMC act as a good diffusion barrier for Sn. The consumption of Cu by all types of solders are ranked as Sn-Zn-Bi>Sn-Zn>Sn-Pb. Although Sn-Zn-Bi solder has higher dissolution rate of Cu layer and some voids are found at the interface, it can be used as a replacement of conventional Sn-Pb solder in the electronic industry.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130227528","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

New challenges in design and understanding of chip-on-glass (COG) for LCD packaging by FEA 用有限元法分析LCD封装中玻璃晶片(COG)设计和理解的新挑战

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452321

B. Xie, H. Ding

引用次数: 5

Quantitative reliability estimation of surface mount solder joints for reflow optimization 用于回流优化的表面贴装焊点定量可靠性估计

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452338

B. Tao, Yiping Wu, H. Ding, Y. Xiong

{"title":"Quantitative reliability estimation of surface mount solder joints for reflow optimization","authors":"B. Tao, Yiping Wu, H. Ding, Y. Xiong","doi":"10.1109/AGEC.2005.1452338","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452338","url":null,"abstract":"A novel method of reliability analysis on the thermal fatigue failure of surface mount solder joints, based on the heating factor Q/sub /spl eta//, is introduced, by which quantitative reliability estimation and prediction of solder joints suffering from cyclic thermal shock can be carried out. Based on the published data of thermal fatigue lifetime, two explicit functions are deduced in a unified form, which reveal the effect of the heating factor on the MTTF and reliability of solder joints intuitionistically. Numerical analysis and calculation are performed. The results show that the MTTF of solder joints firstly decreases quickly with an increment of Q/sub /spl eta// and then slowly approximates to a constant value when Q/sub /spl eta///spl ges/1500s/spl deg/C. The reliability of solder joints R(t) against thermal shock cycle t degrades in an analogical fashion for different heating factors, and the larger the heating factor, the less thermal shock cycles that the solder joints can endure. The presented method provides a useful and applicable way for computer-based online solutions to achieve numerical calculation and control for quantitative reliability estimation during reflow process optimization.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123829009","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0