Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.最新文献

Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints 金属间化合物对Sn-Cu无铅焊点性能的影响

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452342

M.N. Islam, Y. Chan, M. O. Alam

{"title":"Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints","authors":"M.N. Islam, Y. Chan, M. O. Alam","doi":"10.1109/AGEC.2005.1452342","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452342","url":null,"abstract":"The environmentally conscious manufacturer is moving toward 'green products' for electronic devices and components. In this paper we investigate the interfacial reactions of Sn0.7Cu solder on electrolytic Ni layer for extended times reflow. It is found that during as-reflowed, the formation of Cu-rich Sn-Cu-Ni ternary intermetallic compounds (TIMC) at the interface of Sn0.7Cu solder with electrolytic Ni is much quicker, resulting in the entrapment of some Pb (which is present (about 0.02wt%) as impurity in the Sn-Cu solder) rich phase in the TIMC. During extended time of reflow, high (>30at %), medium (30-15at %) and low (<15at %) Cu TIMC are formed at the interface. Cu-rich TIMC have higher growth rate and consume more Ni layer. Less than 3 micron of the electrolytic Ni layer was consumed during molten reaction by the higher Sn-containing Sn0.7Cu solder in 180 minutes at 250/spl deg/C. The shear strength of Sn0.7Cu solder joint is stable from 1.982-1.861 kgf during extended time reflow. Cu prevents the resettlement of Au at the interface. The shear strength does not depend on the thickness of intermetallic compounds (IMC) and reflow time. Ni/Sn-Cu solder system has higher strength and can be used during prolonged reflow.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126326152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Transition to lead free soldering - a great change for a better understanding of materials and processes and green electronics 过渡到无铅焊接-一个伟大的变化，更好地理解材料和工艺和绿色电子

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452312

J. Mueller, H. Griese, K. Schischke, L. Stobbe

{"title":"Transition to lead free soldering - a great change for a better understanding of materials and processes and green electronics","authors":"J. Mueller, H. Griese, K. Schischke, L. Stobbe","doi":"10.1109/AGEC.2005.1452312","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452312","url":null,"abstract":"The lead ban in electronics - enforced by environmental concerns and legal reality by 2006 through RoHS directive has initiated a broad rethinking towards eco/sup 2/-efficiency (economical and ecological) of interconnection technology its materials and processes. The implementation of lead free soldering however is not a drop-in process. In order to secure the production of high quality and reliable lead free products with low environmental burdens by 2006 there are still various technological issues to be solved. This paper gives an overview of environmental (e.g. toxicity and energy demand) and technological issues (e.g. higher thermal stress, whisker formation) deriving from the implementation of lead free soldering processes. It is shown which technological innovations have been initiated through a better understanding of interconnection materials and processes. Substitution of lead in the interconnection system is just the first step to green electronics. The next step is the wise selection of an alternative system and technology based on a profound understanding of the ecological and economical facts.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114827415","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

A study of mechanical and rheological behavior of recycled spray painted parts 再生喷漆件的力学和流变特性研究

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452329

R. Petitt, J.W. Boldt, M. Poh

{"title":"A study of mechanical and rheological behavior of recycled spray painted parts","authors":"R. Petitt, J.W. Boldt, M. Poh","doi":"10.1109/AGEC.2005.1452329","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452329","url":null,"abstract":"Environmentally sustainable development is not an option, but an imperative. Product discard is a growing pollution problem, as more electronics join the waste stream. As the world's raw materials dwindle from consumer demand, there is an urgency to work towards waste minimization. Plastic materials stand out as the single largest material component for which recycling solutions have not been developed. One of the greatest challenges for increasing the use of recycled plastics in new products is dealing with painted plastic parts. Paint is used as a decorative finish to enhance the appearance and aesthetics of many products. Painted enclosure parts represent a significant portion of the content of a product. Currently, most painted plastic parts are considered to be non-recyclable, due to the degradation of physical properties or cosmetic contamination when the parts are reground without removing the paint. Typically, these parts are either incinerated for energy recovery, sent as a mixed fraction to smelters for metals recovery or landfilled. The paper explores the possibility of improving painted reground plastic performance through the use of compatible paint coatings that are miscible with the base resin when reground, resulting in minimal physical property degradation and enhancing the value of this feedstream for reuse in new products.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125898643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Micro-BGA package reliability and optimization of reflow soldering profile 微bga封装可靠性及回流焊轮廓优化

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452333

Jing Gao, Yiping Wu, H. Ding

引用次数: 5

Mechanical design and optimization of flip chip bonder 倒装片键合机的机械设计与优化

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452325

Zhouyi Chen, Yin Yuehong, Guo Xinming, L. Zhongqin, Ding Han

引用次数: 0

Interfacial characteristics of Sn3.5Ag solder on copper after Nd:YAG laser surface irradiation Nd:YAG激光表面辐照后铜表面Sn3.5Ag焊料的界面特性

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452345

Lei Wang, Chunqing Wang, Zhenqing Zhao, Yi Huang

引用次数: 0

Minimize system failure rate considering variations of electronic components lifetime data [PCB design for reliability] 考虑到电子元件寿命数据的变化，最大限度地降低系统故障率[可靠性的PCB设计]

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452332

T. Jin, Z. Xiong, Peng Wang

{"title":"Minimize system failure rate considering variations of electronic components lifetime data [PCB design for reliability]","authors":"T. Jin, Z. Xiong, Peng Wang","doi":"10.1109/AGEC.2005.1452332","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452332","url":null,"abstract":"Thermal and electrical stresses are important factors in affecting the lifetime of microelectronic devices. For a PCB consisting of thousands of microelectronic devices, stresses are usually neither constant nor evenly distributed. Stresses often vary in different subcircuits due to the difference of power consumption and electrical derating. The variations of the stresses create uncertainties in estimating reliability metrics such as the system failure rate and MTBF. This paper proposes an optimal design procedure to minimize the system failure rate by reducing the variations of device stresses. The system failure rate is treated as a stochastic number. The distribution of the failure rate is approximated by the normal distribution, based on the central limit theorem. The objective is to select the best devices from multiple component choices such that the system failure rate is minimized while the cost budget and the six-sigma criteria are still satisfied. This is a non-linear integer-programming problem and a genetic algorithm is used to search for the optimal solution. Finally, an PCB is used to illustrate the optimization procedure.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129141910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

LCA case study for copier using the matrix-based LCA software and JLCA database 使用基于矩阵的LCA软件和JLCA数据库对复印机进行LCA案例研究

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452330

W. Lu, S. Sakai, S. Izumi

引用次数: 2

Study of cooling rate on lead-free soldering microstructure of Sn-3.0Ag-0.5Cu solder Sn-3.0Ag-0.5Cu钎料无铅焊接组织的冷却速率研究

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452335

Q. Hu, Z. Lee, Zhilong Zhao, Da-le Lee

引用次数: 9

Mechanical properties of a lead-free solder alloys 一种无铅焊料合金的机械性能

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452326

F. Zhu, Zhiyong Wang, R. Guan, Honghai Zhang

引用次数: 17