倒装片键合机的机械设计与优化

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI:10.1109/AGEC.2005.1452325

Zhouyi Chen, Yin Yuehong, Guo Xinming, L. Zhongqin, Ding Han

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引用次数: 0

摘要

介绍了基于计算机辅助静力分析的倒装片键合机机械设计与优化的一般流程。详细介绍了一种龙门式FC键合器结构的设计。变形模拟和静力分析结果证明了FC粘结剂的力学结构。满足预先确定的需求。

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Mechanical design and optimization of flip chip bonder

A general process based on computer aided static analysis for flip chip bonder mechanical design and optimization is presented. The design of a gantry-form FC bonder structure is introduced in detail. The results of the deformation simulation and static analysis proved that the mechanical structure of FC bonder. fulfilled the pre-determined requirements.

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Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.

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