Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.最新文献_第2页

State of the art in material declarations: compliance management and usability for eco-design 材料声明的最新技术:生态设计的合规管理和可用性

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452309

K. Schischke, H. Griese, J. Mueller, I. Stobbe

{"title":"State of the art in material declarations: compliance management and usability for eco-design","authors":"K. Schischke, H. Griese, J. Mueller, I. Stobbe","doi":"10.1109/AGEC.2005.1452309","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452309","url":null,"abstract":"Substance bans, recycling quotas, green products are some topics which affect the supply chain of the electronics industry currently. Keys for compliance are material declarations. This paper gives an overview on harmonization and standardization efforts world wide. The International Material Data System IMDS is relevant for the automotive sector, but is also a benchmark for the whole electronics industry. EIA, EICTA, and JGPSSI jointly elaborate a materials declaration guideline. In parallel national industry associations develop declaration schemes, such as the Umbrella Specifications in Germany. Standardization activities comprise e.g. the German DIN 19220. Even more, some OEM developed own requirements for material declarations. The philosophy behind all these activities is explained, as well as contradictions. The range of declarations spans from 100% declarations to simple lead free markings. But even lead free marking is not that simple: different logos and approaches for lead free are under development to guarantee compliance with the European RoHS legislation. Material declarations are useful to fulfill customer requirements and to prove legal compliance, but could also be used for \"eco-design\". Material content of an electronic product is just one aspect for eco-design, but an important one. The paper describes how the different approaches for material declarations can support an eco-design policy and where they might hinder eco-design. Within the technical product design process early consideration of component compositions can add a new ecological perspective to the traditional design process, preparing for coming EU legislation on eco-design. An outlook is given of how to integrate environment-related material aspects within the design process.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127688366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Experimental and modeling analysis on moisture induced failures in flip-chip-on- flex interconnections with anisotropic conductive film 具有各向异性导电膜的倒装片-柔性互连中水分失效的实验与建模分析

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452340

C. Yin, H. Lu, C. Bailey, Y. Chan

{"title":"Experimental and modeling analysis on moisture induced failures in flip-chip-on- flex interconnections with anisotropic conductive film","authors":"C. Yin, H. Lu, C. Bailey, Y. Chan","doi":"10.1109/AGEC.2005.1452340","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452340","url":null,"abstract":"This paper reports the investigations into the moisture induced failures in flip-chip-on-flex interconnections with anisotropic conductive films (ACF). Both experimental and modeling methods were applied. In the experiments, the contact resistance was used as a quality indicator and was measured continuously during the accelerated tests (autoclave tests). The temperature, relative humidity and the pressure were set at 121/spl deg/C, 100%RH, 1atm respectively. The contact resistance of the ACF joints increased during the tests and nearly 25% of the joints were found to be open after 168 hours' testing time. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. It is believed that the swelling effect of the adhesive and the water penetration along the adhesive/flex interface are the main causes of this contact degradation. Another finding from the experimental work was that the ACF interconnections that had undergone the reflow treatment were more sensitive to the moisture and showed worse reliability during the tests. For a better understanding of the experimental results, 3D finite element (FE) models were built and a macro-micro modeling method was used to determine the moisture diffusion and moisture-induced stresses inside the ACF joints. Modeling results are consistent with the findings in the experimental work.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123282858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Regression models for parameters related to Bayesian reliability inference procedures 回归模型中有关参数的贝叶斯可靠性推理程序

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452339

Peng Wang, T. Jin, H. Liao, Jiachen Liu

{"title":"Regression models for parameters related to Bayesian reliability inference procedures","authors":"Peng Wang, T. Jin, H. Liao, Jiachen Liu","doi":"10.1109/AGEC.2005.1452339","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452339","url":null,"abstract":"This paper proposes a regression model for estimating Bayesian parameters related to reliability point and interval estimations. It is demonstrated that, using these regression models, reliability predictions can be made efficiently based on limited available testing data. Reliability estimation using traditional approaches generally considers electronic system failure rates as fixed but unknown constants, which can be estimated from sample test data taken randomly from the population. Prior knowledge is not used. Bayesian reliability inference, on the other hand, considers the failure rates as random, not fixed, quantities. Bayesian methods allow the incorporation of one's prior knowledge into the estimating process. Combining one's prior knowledge and limited testing results, reliability can be estimated more effectively. However, Bayesian reliability analysis has not been extensively applied in industry. One major reason is the complexity of the procedure and the computational intensity involved. In this paper, empirical regression models are developed to estimate the parameters related to Bayesian reliability point and interval estimation procedures.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"272 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115902173","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Portable X-ray fluorescence analyzer for the first level screening of materials for prohibited substances 便携式x射线荧光分析仪，用于对违禁物质进行一级筛选

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452307

S. Piorek

{"title":"Portable X-ray fluorescence analyzer for the first level screening of materials for prohibited substances","authors":"S. Piorek","doi":"10.1109/AGEC.2005.1452307","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452307","url":null,"abstract":"We introduce a small, lightweight (@ 1.5 kg), ergonomically designed, hand-held XRF analyzer configured for in-situ analysis and screening of plastics for regulated elements. We show that the analyzer can achieve minimum detection limits way below a regulatory threshold level of 100 mg/kg for such elements as lead or cadmium. We also show that the portable XRF analyzer can be used for rapid screening of plastics and resins for presence of brominated flame retardants. While it is true that the XRF method cannot distinguish trivalent from hexavalent chromium, it will nevertheless report the total chromium concentration, which is useful and conclusive information if the reported concentration is below the threshold level. Similarly, XRF can only measure bromine concentration as an element regardless whether from the banned or permitted bromine compound. However, the very fact that the instrument can assert the absence of bromine may be sufficient to avoid more labor intensive and costly tests specific for bromine. The subject instrument can also analyze alloys. We show that its performance in analysis of lead in \"lead-free\" tin solder allows for effective control and prevention of the problem of \"tin whiskering\".","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"158 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123668446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

A methodical planning to enhance reutilisation potential in product design 有条理的计划，以提高产品设计的再利用潜力

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452316

K. Xing, L. Luong, K. Abhary

引用次数: 1

The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering Sn-Ag-Cu/Cu界面金属间化合物层在焊接过程中的生长行为

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452322

D.Q. Yu, J.H. Wang, L. Wang

引用次数: 1

Lessons learnt from lead-free soldering implementation - real example 从无铅焊接实施中学到的经验教训-真实的例子

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452314

W. Cheng, H. Wu

引用次数: 0

Electromigration in Pb-free bumps with different UBM thickness 不同UBM厚度无铅凸点的电迁移

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452323

Z. Jinsong, Wu Yiping, Wu Feng-shun, An Bing

{"title":"Electromigration in Pb-free bumps with different UBM thickness","authors":"Z. Jinsong, Wu Yiping, Wu Feng-shun, An Bing","doi":"10.1109/AGEC.2005.1452323","DOIUrl":"https://doi.org/10.1109/AGEC.2005.1452323","url":null,"abstract":"A study of a dummy flip-chip package was conducted to evaluate electromigration failure of different Pb-free bumps with different UBM (under bump metallization) thickness. The applied current density was 2.3/spl times/10/sup 4/ A/cm/sup 2/, and the operating temperatures were 180/spl deg/C and 160/spl deg/C. The UBM consisted of Cu and Ni electroplate with thickness of 20 /spl mu/m and 10 /spl mu/m (or 5 /spl mu/m), respectively. Pb-free solder bumps, SnAg and SnAgCu alloys, were utilized to perform the experiment. An SnPb eutectic solder bump was also tested in contrast to the different Pb-free solder bumps. Electromigration failure was observed only at the solder bump/UBM interface with electron current flow from the chip to the substrate. Mass IMC (intermetallic compound) dissolution and void nucleation near the cathode were observed during current stressing. Failure took place in the region of the UBM and UBM/bump interface in the form of solder cracking or delamination. Otherwise, in different Pb-free bumps, Ni followed by Cu migration along the electron wind direction was observed. Pb-free solder bumps had a longer failure time than that of SnPb bumps at high temperatures. Effects of current crowding and IMC polarity are key factors of flip-chip interconnects' electromigration behavior.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"20 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130408451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly 硬盘磁头组件无铅焊点机械冲击建模与试验

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452343

Chen Hongtao, Wang Chunqing, Li Mingyua

引用次数: 2

Eco-design and beyond - key requirements for a global sustainable development 生态设计和超越是全球可持续发展的关键要求

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI: 10.1109/AGEC.2005.1452313

H. Griese, L. Stobbe, H. Reichl, A. Stevels

引用次数: 17