Sn-3.0Ag-0.5Cu钎料无铅焊接组织的冷却速率研究

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI:10.1109/AGEC.2005.1452335

Q. Hu, Z. Lee, Zhilong Zhao, Da-le Lee

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引用次数: 9

摘要

与传统的Sn-Pb钎料相比，Sn-3.0Ag-0.5Cu无铅钎料的微观结构更为复杂。冷却速率对二次枝晶臂尺寸和IMC形貌有显著影响，进而影响焊点的力学行为。本文研究了风冷、强制风冷和水冷三种不同冷却速率下焊点的组织和形貌。Ag/sub - 3/Sn在水冷时形貌呈球状，在空冷时形貌呈针状。水冷时，接头的内嵌层为相对平面的Cu/sub 6/Sn/sub 5/层;空冷时，接头内嵌层为球状的Cu/sub 6/Sn/sub 5/层。

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Study of cooling rate on lead-free soldering microstructure of Sn-3.0Ag-0.5Cu solder

Compared to traditional Sn-Pb solder, the microstructure of lead free solder Sn-3.0Ag-0.5Cu is more complex. The cooling rate significantly affects the secondary dendrite arm size and the IMC morphology, which influence the solder joint mechanical behavior. In this paper, the solder joint microstructure and morphology of three different cooling rates: air cooling, forced air cooling and water cooling were studied. The morphology of the Ag/sub 3/Sn was relatively spherical under water cooling, and had a needle-like morphology under air cooling. The IMC of the joint was a relatively planar Cu/sub 6/Sn/sub 5/ layer under water cooling while a nodular Cu/sub 6/Sn/sub 5/ layer was formed under air cooling.

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来源期刊

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.

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