Sn-Zn基无铅钎料合金替代Sn-Pb钎料的润湿和界面反应

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI:10.1109/AGEC.2005.1452341

M.N. Islam, Y. Chan

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引用次数: 5

摘要

由于铅的毒性，世界正在向电子设备和组件的“绿色产品”发展。本文研究了Sn-9Zn(共晶)和Sn-8Zn-3Bi(非共晶)两种类型的锡膏以及Sn-37Pb(共晶)焊料，以供参考。共晶焊膏和非共晶焊膏的Cu层溶解度和IMC随回流时间的变化表现出不同的特征。对于不同的焊料成分，IMC的形貌有很大的不同。在回流过程中，Sn-Zn钎料中IMC的生长速率高于SnPb钎料。在Sn-Zn基钎料中形成了/spl gamma/- Cu/sub - 5/Zn/sub - 8/、/spl beta/- cuzn和未知的Cu-Zn薄层等不同类型的IMC，而在Sn- pb钎料中在Cu/焊点界面形成了Cu/sub - 6/Sn/sub - 5/ IMC层。由于Sn- pb焊料中Sn的供应有限，回流10分钟后形成Cu/sub - 3/Sn IMC。与其他焊料相比，锡锌焊料的润湿性最低。随着锡锌焊料体系回流时间的延长，锌片的尺寸增大。在Sn-Zn-Bi钎料中，Bi对/spl β /-Sn基体中IMC的生长速率以及富zn相的尺寸和分布有显著影响。再流20分钟后，Sn-Zn基焊料中未发现Cu-Sn IMC。Cu-Zn IMC对Sn具有良好的扩散屏障作用。各类焊料对Cu的消耗顺序为Sn-Zn- bi >Sn-Zn>Sn-Pb。虽然Sn-Zn-Bi焊料对Cu层的溶解速率较高，且在界面处存在空隙，但在电子工业中可以替代传统的Sn-Pb焊料。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

The world is moving toward 'green products' for electronic devices and components due to the toxicity of Pb. In this paper two types of solder paste such as Sn-9Zn (eutectic) and Sn-8Zn-3Bi (noneutectic) have been investigated along with Sn-37Pb (eutectic) solder for reference. The variation of dissolution of Cu layer and IMC with reflow time shows different characteristics for eutectic and non-eutectic solder pastes. The morphologies of the IMC are quite different for different solder compositions. During as reflowed, the growth rate of IMC in the Sn-Zn based solder is higher than the SnPb solders. Different types of IMC such as /spl gamma/- Cu/sub 5/Zn/sub 8/, /spl beta/-CuZn and thin unknown Cu-Zn layer are formed in the Sn-Zn based solder but in case of Sn-Pb solder Cu/sub 6/Sn/sub 5/ IMC layer are formed at the interface of the Cu/solderjoint. Cu/sub 3/Sn IMC are formed after 10 minutes reflow due to the limited supply of Sn from the Sn-Pb solder. The wettability of Sn-Zn solder is found as least compared with the other solders. The size of Zn platelets is increased with an increase of reflow time for the Sn-Zn solder system. In the case of Sn-Zn-Bi solder, Bi offers significant effects on growth rate of IMC as well as size and distribution of Zn-rich phase in the /spl beta/-Sn matrix. No Cu-Sn IMC are found in the Sn-Zn based solder during 20 minutes reflow. Cu-Zn IMC act as a good diffusion barrier for Sn. The consumption of Cu by all types of solders are ranked as Sn-Zn-Bi>Sn-Zn>Sn-Pb. Although Sn-Zn-Bi solder has higher dissolution rate of Cu layer and some voids are found at the interface, it can be used as a replacement of conventional Sn-Pb solder in the electronic industry.

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Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.

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