优化无铅焊料的波峰焊工艺

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI:10.1109/AGEC.2005.1452331

S. Stoyanov, C. Bailey, N. Saxena, S. Adams

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引用次数: 0

摘要

氮气现在用于波峰焊锡机，以帮助降低锡槽表面形成的杂质量。本文详细介绍了利用计算流体动力学来帮助理解波峰焊锡机中氮的流动情况，并预测焊锡槽周围氮和氧的浓度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Optimising the wave soldering process for lead free solders

Nitrogen is now used in wave soldering machines to help lower the amount of dross that can be formed on the solder bath surface. The paper provides details on the use of computational fluid dynamics in helping understand the flow profiles of nitrogen in a wave soldering machine and to predict the concentration of nitrogen and oxygen around the solder bath.

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Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.

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