{"title":"On the large-signal robustness of SiGe HBT LNAs for high-frequency wireless applications","authors":"T. Thrivikraman, A. Madan, J. Cressler","doi":"10.1109/SMIC.2010.5422968","DOIUrl":"https://doi.org/10.1109/SMIC.2010.5422968","url":null,"abstract":"We present measured results and analysis from high-power testing of three different X-band SiGe HBT LNAs. The custom measurement setup allowed high RF power (up to 32 dBm) to be applied to the input of the LNAs for 400 sec. During the stressing, the bias current was monitored and the pre/post-stress dc and ac characteristics were measured. The results indicate that, in the three LNAs tested, catastrophic failures can occur at these high powers, while at lower input power (less than 30 dBm), the LNA gain is degraded. Analysis shows that during the stressing, the collector current density inside the transistors increases enough to damage the device, in a manner similar to that experienced during mixed-mode reliability stress.","PeriodicalId":404957,"journal":{"name":"2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116125985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A V-band 90-nm CMOS low-noise amplifier with modified CPW transmission lines for UWB systems","authors":"I. Haroun, J. Wight, C. Plett, A. Fathy, Y. Hsu","doi":"10.1109/RWS.2010.5434106","DOIUrl":"https://doi.org/10.1109/RWS.2010.5434106","url":null,"abstract":"A V-band low-noise, high gain, high linearity single-stage amplifier has been developed in a 90-nm CMOS technology. The design utilized modified co-planar waveguide transmission lines for the input/output matching networks, to avoid lines' width and spacing constraints and to sustain small chip area and low cost fabrication. The developed amplifier exhibited a low noise figure of 4.1 dB, and a gain higher than 10 dB in the frequency range of 57–58 GHz. Additionally, the amplifier has linear characteristics and its measured third-order intercept (IIP3) point is greater than 3 dBm. The proposed design is well suited for millimeter-wave (mmW) front-ends in ultra-wideband (UWB) radio-over-fiber (RoF) systems for high data-rate communications.","PeriodicalId":404957,"journal":{"name":"2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128797515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Moon, D. Curtis, M. Hu, D. Wong, P. Campbell, G. Jernigan, J. Tedesco, B. Vanmil, R. Myers-Ward, C. Eddy, D. Gaskill, J. Robinson, M. Fanton, P. Asbeck
{"title":"Development toward wafer-scale graphene RF electronics","authors":"J. Moon, D. Curtis, M. Hu, D. Wong, P. Campbell, G. Jernigan, J. Tedesco, B. Vanmil, R. Myers-Ward, C. Eddy, D. Gaskill, J. Robinson, M. Fanton, P. Asbeck","doi":"10.1109/SMIC.2010.5422991","DOIUrl":"https://doi.org/10.1109/SMIC.2010.5422991","url":null,"abstract":"We will present recent development of graphene FET technology on a wafer scale, including epitaxial graphene growth, device fabrication and characterization. The epitaxial growth of graphene on 2-inch wafers were fabricated via graphitization of Si-face SiC(0001) substrates. The sheet electron carrier density of these layers were typically 10<sup>-13</sup> /cm<sup>2</sup> at room temperature and had mobility of ~ 1500 cm<sup>2</sup> V<sup>-1</sup>S<sup>-1</sup> or higher. Graphene FETs were fabricated with source and drain non-alloyed ohmic metal schemes. Metal gates were used on top of atomic-layer-deposited high-k (Al<sub>2</sub>O<sub>3</sub>) gate dielectric layer. DC and RF performance of the world's first epitaxial graphene RF FETs is presented.","PeriodicalId":404957,"journal":{"name":"2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121532808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}