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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology最新文献

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Capacitive sensor for quantity detection of known liquid present in distilled water 用于蒸馏水中已知液体数量检测的电容式传感器
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887640
N. Blaz, A. Maric, S. Toškov, G. Miskovic, G. Radosavljevic, L. Zivanov
{"title":"Capacitive sensor for quantity detection of known liquid present in distilled water","authors":"N. Blaz, A. Maric, S. Toškov, G. Miskovic, G. Radosavljevic, L. Zivanov","doi":"10.1109/ISSE.2014.6887640","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887640","url":null,"abstract":"In this paper the possibility of detection presents of various liquids in distilled water by employing the interdigital capacitor was investigated. Quantity detection principle of known liquid in distilled water is based on immerging the interdigital capacitor in distilled water and observing changes of its capacity with quantity increment of known liquid. Experimental measurement were done with interdigital capacitor fabricated in LTCC technology immerged in distillated water with various quantity of known liquids. Good results were achieved. It was concluded that it is possible to detect changes of 0.1 ml of known liquid in 100 ml of distilled water.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130466832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Optimal parameters determination for nanostructure-enhanced surface acoustic waves sensor 纳米结构增强表面声波传感器最优参数的确定
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887638
O. Bogdan, A. Orlov, G. Pashkevich, V. Ulianova, Y. Yakimenko, A. Zazerin
{"title":"Optimal parameters determination for nanostructure-enhanced surface acoustic waves sensor","authors":"O. Bogdan, A. Orlov, G. Pashkevich, V. Ulianova, Y. Yakimenko, A. Zazerin","doi":"10.1109/ISSE.2014.6887638","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887638","url":null,"abstract":"Various modifications of the ZnO nanostructures based sensitive element for the two-port surface acoustic wave sensor (SAW) design were considered. The influence of morphometric parameters (diameter and length) of ZnO nanostructures on output SAW sensor characteristics was investigated by finite element simulation method. Obtained versatile flexible multiparameter model allowed the evaluation of performance parameters. The optimal parameters for nanostructure-enhanced SAW sensor design could be estimated by the proposed approach.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123322235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electroluminescent structures with nanomaterials for direct printing of interactive packages and labels 电致发光结构与纳米材料的直接印刷互动包装和标签
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887624
G. Wróblewski, M. Słoma, D. Janczak, A. Mlozniak, M. Jakubowska
{"title":"Electroluminescent structures with nanomaterials for direct printing of interactive packages and labels","authors":"G. Wróblewski, M. Słoma, D. Janczak, A. Mlozniak, M. Jakubowska","doi":"10.1109/ISSE.2014.6887624","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887624","url":null,"abstract":"Packages and labels are necessary for every product on the market and are present among us for many years. Packages have to include every year more and more information, gain new functionalities and characterize with attractive design what can be achieved thankfully to printed electronics. Printed electronic structures made on labels (called smart labels) that were afterwards stick on packages can be found in literature, however there is still a lack in technologies and materials allowing direct printing of electronics on packages during packaging operations. This work presents a low cost method of producing electroluminescent displays directly on products packages without vacuum, cleanroom or other rigorous production conditions. Elaborated spray coating technology is suitable for mass production and can be easily implemented in production lines. Set of materials based on diverse functional fillers in polymer resins was developed to obtain desired coating functionalities. Conductive layers were done using carbon nano-tubes (CNT), graphene nano-platelets (GNP) and nano-silver (nAg). For dielectric layers we used barium titanate (BaTiO3) nano-powders and as luminophores copper doped zinc sulfide (ZnS:Cu). Presented structures were done on various types of packages - aluminum cans, cardboard boxes and polypropylene bottles.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115402337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Biomedical signals analysis techniques using the signal processor TMS320C6211B 生物医学信号分析技术采用信号处理器TMS320C6211B
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887617
I. Costea, C. Dumitrescu, N. Dumitru, B. Soare
{"title":"Biomedical signals analysis techniques using the signal processor TMS320C6211B","authors":"I. Costea, C. Dumitrescu, N. Dumitru, B. Soare","doi":"10.1109/ISSE.2014.6887617","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887617","url":null,"abstract":"The present paper presents the technological solution dedicated to the implementation of the K-complex detection algorithm, from the EEG medical signals, with the help of the TMS320C6211B signal processor, produced by Texas Instruments. This application is based on the host-target system architecture, where the target is the DSK (Digital Starter Kit), which performs realtime processing and is transmitted from the software host on the processing computer. The host software is written in G, Labview programming language, and has the objective of achieving an automated detector for the K complex, derived from the sleep electroencephalogram. The K complex detection automatization must establish a verification criterion and a prediction criterion.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126529079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Influence of coil design on sensing performance of pressure sensor with polyimide membrane 线圈设计对聚酰亚胺膜压力传感器传感性能的影响
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887637
M. Kisić, N. Blaz, A. Maric, G. Radosavljevic, L. Zivanov, M. Damnjanović
{"title":"Influence of coil design on sensing performance of pressure sensor with polyimide membrane","authors":"M. Kisić, N. Blaz, A. Maric, G. Radosavljevic, L. Zivanov, M. Damnjanović","doi":"10.1109/ISSE.2014.6887637","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887637","url":null,"abstract":"The objective of this research is to study various coil designs and to propose the pattern that can improve the performance of the pressure sensor. Wireless pressure sensor, based on polyimide foil, is designed, fabricated and tested. The proposed sensor is realised in heterogonous integration process and consists of PCB (Printed Circuit Board) coil, spacer and polyimide membrane with attached LTCC (Low Temperature Co-fired Ceramic) ferrite. Pressure variations are wirelessly detected in system antenna-sensor resonant frequency, by a phase-dip technique. The distance between the coil and the ferrite varies with an applied external pressure and consequently membrane deflection, so the inductance of the coil increases and the resonant frequency of the system decreases. The effect of coil designs with different number of turns is examined and sensor performances are compared. Experimental measurements are determined and confirmed by analytical calculations and simulated results.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122642512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
LTCC lamination process using PMMA fugitive material LTCC层压工艺采用PMMA易失性材料
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887555
S. Toškov, Nenad Krcic, G. Radosavljevic
{"title":"LTCC lamination process using PMMA fugitive material","authors":"S. Toškov, Nenad Krcic, G. Radosavljevic","doi":"10.1109/ISSE.2014.6887555","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887555","url":null,"abstract":"Integrated cavities, screen-printed passive components and channels are common parts of 3D micro-fluidic devices fabricated in low temperature co-fired ceramics (LTCC) technology. However, realization of defect-free structures without cracks, sagging of cavities or channels is challenging and strongly influenced by quality of lamination and firing processing conditions. Lamination technique based on incorporation of polymethylmethycrylate (PMMA) sacrificial volume material (SVM) for implementation of large cavities inside LTCC module is presented in this paper. Optimized firing conditions for proper burnout of SVM have been described. Influence of lamination and firing processing conditions are demonstrated in fabrication of 3-dimensional micro-fluidic device. Tested structure contains screen printed interdigital capacitor (IDC) positioned inside large cavity with dimensions 0.23 +/- 0.01 × 5.6 × 11.2 [mm3] for thickness, width and length, respectively. Obtained results show advantages of PMMA incorporation in fabrication of defect-free structures in LTCC technology.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130305263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Thermographic control of organic solar cells 有机太阳能电池的热成像控制
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887606
A. Andonova, I. Zhivkov, Y. Georgiev, G. Angelov, J. Honová, M. Weiter
{"title":"Thermographic control of organic solar cells","authors":"A. Andonova, I. Zhivkov, Y. Georgiev, G. Angelov, J. Honová, M. Weiter","doi":"10.1109/ISSE.2014.6887606","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887606","url":null,"abstract":"This paper presents the results from research on the application of Infrared Thermography (IRT) for sub-surface defect evaluation in organic solar cells (OSC). The research was carried out with the three types of test samples: OSC without defects, with unknown and with known types of defects and evaluated localized defects. Passive as well as active thermography for the sub-surface defect detection of selected test OSC modules is applied. An identification of sub-surface defects, connected with the inhomogeneity of the active film thickness, dislocation of the masks during the sample preparation, leakage currents between neighbor electrodes, and structural defects was carried out. The results show a successful application of IRT for fault detection and localization during fabrication process and during the diagnostic control of such modules.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124545773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Implementation of SPC methodology to service processes 在服务流程中实施SPC方法
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887612
J. Šimota, J. Tupa
{"title":"Implementation of SPC methodology to service processes","authors":"J. Šimota, J. Tupa","doi":"10.1109/ISSE.2014.6887612","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887612","url":null,"abstract":"This paper deals with the application of SPC methodology to service processes. SPC methodology is an important tool in industry because it helps find variability in processes. Any variability is undesirable because it causes deviation from the target value. Service processes are different in the specific ways and SPC methodology is suitable tool for measuring, controlling and eliminating of variation. It is demonstrated and verified on the case study.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121981608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Lead/lead-free solder alloys shear tests correlations with structure at different temperatures 铅/无铅焊料合金在不同温度下剪切测试与结构的相关性
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887603
M. Branzei, B. Mihailescu, I. Pencea
{"title":"Lead/lead-free solder alloys shear tests correlations with structure at different temperatures","authors":"M. Branzei, B. Mihailescu, I. Pencea","doi":"10.1109/ISSE.2014.6887603","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887603","url":null,"abstract":"The new RoHS 2 Directive [1] touch up the research work for replacement the lead soldering materials with lead-free types, without compromising functionality and reliability. At least two of the three solder joints functionalities, mechanical and thermal one, are determined by the microstructure morphology and stability. As consequence, any material must accomplish dedicated procedures for qualification to be used for these domains of applications characterized by a large range of working temperatures and high mechanical stress level. According to \"Homologous temperature\" (TH) concept, the working temperature for a solder alloy could be expressed as a fraction of its melting temperature measured in Kelvin degrees and must not be over 0.5 value [2]. Shear tests performed at different temperatures are correlated with the microstructure morphology and stability investigates by X-ray Diffraction Analysis.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126725835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Solving an EMC/EMI problem occurred inside a complex programmable logic device 解决一个复杂的可编程逻辑器件内部发生的EMC/EMI问题
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887631
D. Vuza, M. Vlădescu
{"title":"Solving an EMC/EMI problem occurred inside a complex programmable logic device","authors":"D. Vuza, M. Vlădescu","doi":"10.1109/ISSE.2014.6887631","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887631","url":null,"abstract":"During the development of an electronic module using a complex programmable logic device (CPLD) and a micro-controller, we noticed an abnormal behavior of the CPLD manifested as an unexpected reset of a counter. We identified a synchronous perturbation and an asynchronous perturbation as being responsible for the disturbance, both of them being related to the change in the state of a large number of data lines. We devised and tested methods for eliminating both perturbations, the application of which helped in achieving the intended behavior of the device.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127188391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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