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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology最新文献

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Investigation on physical and electrical behaviour of LTCC dielectric tapes LTCC介质带的物理和电学性能研究
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887600
G. Miskovic, Luka Vučković, Javier Fernández, H. Homolka, M. Unger, G. Radosavljevic
{"title":"Investigation on physical and electrical behaviour of LTCC dielectric tapes","authors":"G. Miskovic, Luka Vučković, Javier Fernández, H. Homolka, M. Unger, G. Radosavljevic","doi":"10.1109/ISSE.2014.6887600","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887600","url":null,"abstract":"Application of Low Temperature Co-Fired Ceramic (LTCC) technology is widely spread. Its presence is well established in component packaging, sensor applications, high frequency applications [1, 2], chemical reactors and bio-medical applications [3]. For successful realization and implementation of LTCC structures, characteristics and features of LTCC tapes as well as their behavior have to be known. Various investigations related to features of LTCC tapes have been already reported [4-6]. This investigation is focused on physical and electrical characterization of new Heraeus CT708 and Heraeus CT802 LTCC dielectric tapes. Surface roughness has been investigated and presented. Investigation was conducted on shrinkage and weight loss of LTCC tapes and their dependence of the substrate thickness. Circularly shaped LTCC specimens with various thicknesses have been manufactured. The relevant dimensions as well as weights of the specimens were measured before and after firing, results and conclusion are given. Report on electrical permittivity and its dependence on frequency is also presented in this paper. The capacitance method was used. Simple plate capacitors with circular electrodes were realized, where LTCC tapes are used as a dielectric material. Modulus of elasticity as well as flexural strength was investigated by a three-point bending test.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126407678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Analytic method for monitoring of cleaning process efficiency 清洗过程效率监测的分析方法
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887620
M. Bursik, V. Sítko, M. Reznicek, I. Szendiuch, J. Jankovský
{"title":"Analytic method for monitoring of cleaning process efficiency","authors":"M. Bursik, V. Sítko, M. Reznicek, I. Szendiuch, J. Jankovský","doi":"10.1109/ISSE.2014.6887620","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887620","url":null,"abstract":"This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency. Generally there are only few possibilities for cleaning evaluation, which are the optical control, chemical analyze and surface insulation resistance measurement. Because these methods are not applicable inside the equipment, new method was developed for the efficiency evaluation. This article presents new calibration principle, where the base is quantification of residual contamination by the optical analyze.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126538782","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Modeling and practical strategy for PWM control in heating applications 加热应用中PWM控制的建模与实用策略
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887616
E. Ceuca, A. Tulbure
{"title":"Modeling and practical strategy for PWM control in heating applications","authors":"E. Ceuca, A. Tulbure","doi":"10.1109/ISSE.2014.6887616","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887616","url":null,"abstract":"The paper presents the experimental case-study, concerning the behavior of the induction cooking system. The paper describes the experimental steps and tests to obtain a functional stand in order to understand and improve the design and achieve an optimal operation for converters involved in practical applications.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121789755","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Screen printed chipless RFID tags 丝网印刷无芯片RFID标签
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887581
T. Blecha
{"title":"Screen printed chipless RFID tags","authors":"T. Blecha","doi":"10.1109/ISSE.2014.6887581","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887581","url":null,"abstract":"Radio Frequency Identification (RFID) is the technology that is used in the daily life. A RFID system consists of RFID tags and readers including many electronic passive and active components. This article deals with design of chipless RFID tags that are screen printed on flexible substrates and do not need any electronic components for their function. There are also presented chipless RFID tag fundamentals and parameters that have an influence on their behavior in the frequency domain. However production of the screen printed chipless RFID tags is cheap and can be used in many applications.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"9 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131722675","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Galvanic plating for 3D-MID applications 3D-MID应用的电镀层
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887650
Timo Kordass, J. Franke
{"title":"Galvanic plating for 3D-MID applications","authors":"Timo Kordass, J. Franke","doi":"10.1109/ISSE.2014.6887650","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887650","url":null,"abstract":"This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for motorcycles it shows the challenges for the chemical standard plating in the serial processes in the first part. The second part illustrates the differences in the plating processes between the galvanic and the chemical precipitation. The advantages with major coating thickness for further developed applications are mentioned. It is also given the particular specifics need to be considered in the development for the galvanic process.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122309912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Stability of LTCC substrates in high frequency area after accelerated aging tests 加速老化试验后LTCC基板高频区的稳定性
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887597
Tibor Rovensky, A. Pietrikova, K. Ruman, I. Vehec
{"title":"Stability of LTCC substrates in high frequency area after accelerated aging tests","authors":"Tibor Rovensky, A. Pietrikova, K. Ruman, I. Vehec","doi":"10.1109/ISSE.2014.6887597","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887597","url":null,"abstract":"Aim of this paper is to investigate influence of accelerated ageing on dielectric properties of Low Temperature Co-fired Ceramic (LTCC) substrates with microstrip structure. According to the previous work of Pietrikova et. al (2013), narrow-band notch filter from 2.4 GHz to 2.5 GHz, for minimalizing impact of Wi-Fi signal on UWB radar systems, was designed and fabricated using two different LTCC substrates' types (DuPont GreenTape 951 and DuPont GreenTape 9K7). All filters were exposed to temperature loads, measured before and after each part of accelerated aging tests. Two types of aging test were chosen: “HTOL” (High Temperature Operation Life) and temperature cycling test. LTCC substrates' stability were derived from the changes in frequency domain characteristic obtained from measurements by Vector Network Analyser (VNA) up to 12 GHz. Results shown that there is no significant difference in stability of DuPont GreenTape 951 and DuPont GreenTape 9K7 loaded by HF and thermal stress.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114924818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Development of a localised surface plasmon resonance sensor based on gold nanoparticles 基于金纳米粒子的局部表面等离子体共振传感器的研制
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887627
A. Bonyár, Balazs Wimmer, I. Csarnovics
{"title":"Development of a localised surface plasmon resonance sensor based on gold nanoparticles","authors":"A. Bonyár, Balazs Wimmer, I. Csarnovics","doi":"10.1109/ISSE.2014.6887627","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887627","url":null,"abstract":"A versatile optical sensor which utilizes localized surface plasmon resonance (LSPR) on gold nanoparticles (Au NPs) was developed and investigated. Gold nanoparticles in various size and distribution were generated by thermally annealing gold thin films (15-30 nm) which were sputtered on glass substrate. A measurement setup consisting of a microfluidic cell and an optical spectrophotometer was constructed to measure the surface plasmon resonance spectra of the gold nanoparticles in different media. The possible application of the nanoparticles as sensors (e.g. gas sensor, chemical sensor, biosensor) was investigated.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116258632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Optimizing solder joints on biodegradable PCBs with vapour phase soldering 用气相焊接优化可生物降解pcb的焊点
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887557
A. Géczy, L. Gál, I. Hajdu, B. Kovács, D. Nagy, M. Ruszinkó
{"title":"Optimizing solder joints on biodegradable PCBs with vapour phase soldering","authors":"A. Géczy, L. Gál, I. Hajdu, B. Kovács, D. Nagy, M. Ruszinkó","doi":"10.1109/ISSE.2014.6887557","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887557","url":null,"abstract":"The paper focuses on biodegradable Printed Circuit Boards (PCB) from the aspect of PCB fabrication technology and soldering. Different biodegradable Cellulose Acetate (CA) PCBs were used during the tests (one sided and two sided), and the possible application of pre-preg was also taken into account to improve pad adhesion on the base material. The surfaces of the boards were evaluated in order to obtain information about copper adhesion. FR4 test boards were also investigated as a reference, both for soldering and surface analyses. The soldering profile setup was focused on minimizing high temperatures on the heat-sensitive biopolymer substrates. The soldering profiles were created with a custom vapour phase soldering (VPS) device. The customized solder profile setting is conducted with an adaptive temperature-tracker sample holder. The boards and the solder joints were investigated with non-destructive optical microscopy, X-ray microscopy (deformation and joint analysis), and destructive shear tests. The results are promising for future application of biodegradable PCBs.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128562517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Challenges to the electronics packaging technologies for the volume integration of components in medical tools and instruments 电子封装技术在医疗工具和仪器的组件的体积集成的挑战
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887642
David Wagner, B. Schmidt, M. Detert
{"title":"Challenges to the electronics packaging technologies for the volume integration of components in medical tools and instruments","authors":"David Wagner, B. Schmidt, M. Detert","doi":"10.1109/ISSE.2014.6887642","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887642","url":null,"abstract":"The electronics packaging in microsystems technology for medical applications includes various tasks. The interdisciplinary approach is the most important basis for the success of a product. For the reliable operation of medical microsystems different factors must be considered. For example the functionalization of a catheter depends on different influence factors. The form factor takes the most important role. For a miniaturized and functional catheter tip, the diameter depends on the medical application. Other factors like the shape, reliability and also the cost must be considered. The paper shows the whole technology carrier of a medical product in relation to the field of electronics packaging. With the help of two examples the requirements for future products will be shown.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134425036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Electron beam brazing of copper and aluminium 电子束钎焊铜和铝
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887554
M. Steinhauser, G. Eckart, G. Lange
{"title":"Electron beam brazing of copper and aluminium","authors":"M. Steinhauser, G. Eckart, G. Lange","doi":"10.1109/ISSE.2014.6887554","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887554","url":null,"abstract":"This paper introduces a process used to produce stable and reliable Cu-Al joints with a high degree of freedom regarding component geometries. The process uses the accurate controllable energy input of the beam processes (electron- or laser beam) and the difference of the fusion temperature of the two materials. The paper shows the problems and the state of the art of joining copper and aluminium; exemplify the new solution approach and presenting the results of the metallographic and technologic tests of the produced joint.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122062563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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