Optimizing solder joints on biodegradable PCBs with vapour phase soldering

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887557

A. Géczy, L. Gál, I. Hajdu, B. Kovács, D. Nagy, M. Ruszinkó

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引用次数: 4

Abstract

The paper focuses on biodegradable Printed Circuit Boards (PCB) from the aspect of PCB fabrication technology and soldering. Different biodegradable Cellulose Acetate (CA) PCBs were used during the tests (one sided and two sided), and the possible application of pre-preg was also taken into account to improve pad adhesion on the base material. The surfaces of the boards were evaluated in order to obtain information about copper adhesion. FR4 test boards were also investigated as a reference, both for soldering and surface analyses. The soldering profile setup was focused on minimizing high temperatures on the heat-sensitive biopolymer substrates. The soldering profiles were created with a custom vapour phase soldering (VPS) device. The customized solder profile setting is conducted with an adaptive temperature-tracker sample holder. The boards and the solder joints were investigated with non-destructive optical microscopy, X-ray microscopy (deformation and joint analysis), and destructive shear tests. The results are promising for future application of biodegradable PCBs.

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用气相焊接优化可生物降解pcb的焊点

本文主要从PCB的制作工艺和焊接两方面对生物可降解印刷电路板进行了研究。在测试过程中使用了不同的可生物降解的醋酸纤维素(CA) pcb(单面和双面)，并考虑了预浸料的可能应用，以提高衬垫在基材上的附着力。为了获得铜的粘附性信息，对板面进行了评估。还研究了FR4测试板作为参考，用于焊接和表面分析。焊接配置文件设置的重点是尽量减少高温对热敏性生物聚合物基板。焊接轮廓是用定制的气相焊接(VPS)设备创建的。定制的焊料配置文件设置是进行自适应温度跟踪样品持有人。采用非破坏性光学显微镜、x射线显微镜(变形和接头分析)和破坏性剪切试验对电路板和焊点进行了研究。研究结果对生物可降解多氯联苯的应用前景广阔。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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