3D-MID应用的电镀层

Timo Kordass, J. Franke
{"title":"3D-MID应用的电镀层","authors":"Timo Kordass, J. Franke","doi":"10.1109/ISSE.2014.6887650","DOIUrl":null,"url":null,"abstract":"This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for motorcycles it shows the challenges for the chemical standard plating in the serial processes in the first part. The second part illustrates the differences in the plating processes between the galvanic and the chemical precipitation. The advantages with major coating thickness for further developed applications are mentioned. It is also given the particular specifics need to be considered in the development for the galvanic process.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Galvanic plating for 3D-MID applications\",\"authors\":\"Timo Kordass, J. Franke\",\"doi\":\"10.1109/ISSE.2014.6887650\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for motorcycles it shows the challenges for the chemical standard plating in the serial processes in the first part. The second part illustrates the differences in the plating processes between the galvanic and the chemical precipitation. The advantages with major coating thickness for further developed applications are mentioned. It is also given the particular specifics need to be considered in the development for the galvanic process.\",\"PeriodicalId\":375711,\"journal\":{\"name\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2014.6887650\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887650","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

本文概述了3d - mid电镀的优点。首先阐述了激光直接结构加工的过程。在摩托车系列应用的示例中,它显示了第一部分中系列工艺中化学标准电镀的挑战。第二部分阐述了电法和化学沉淀法在电镀工艺上的区别。指出了主要涂层厚度的优点,为进一步开发应用提供了条件。它还给出了在电法开发过程中需要考虑的具体问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Galvanic plating for 3D-MID applications
This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for motorcycles it shows the challenges for the chemical standard plating in the serial processes in the first part. The second part illustrates the differences in the plating processes between the galvanic and the chemical precipitation. The advantages with major coating thickness for further developed applications are mentioned. It is also given the particular specifics need to be considered in the development for the galvanic process.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信