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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology最新文献

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Study of influence of thermal capacity and flux activity on the solderability 热容量和助焊剂活性对可焊性影响的研究
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887589
K. Dušek, M. Placek, D. Bušek, K. Dvorakova, A. Rudajevová
{"title":"Study of influence of thermal capacity and flux activity on the solderability","authors":"K. Dušek, M. Placek, D. Bušek, K. Dvorakova, A. Rudajevová","doi":"10.1109/ISSE.2014.6887589","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887589","url":null,"abstract":"During the surface mount technological process the assembled PCB is exposed to heat when molten solder alloy wets the surfaces and creates future solder joints. The PCB with all components should ideally be exposed to the same temperature profile during the soldering process. The temperatures differ throughout the PCB due to different thermal capacities of used materials and components even though the temperature profile is stable. The aim of the study was to assess the solderability of the copper material with different thermal capacity and to consider the effect of different types of fluxes. The measurement was done by wetting balance method, where the wetting force is measured as a function of time during which the test specimen is immersed into, remains immersed and then it is pulled out from the solder bath. In our experiments we used copper wire of four different diameters (0.7 mm, 1 mm, 1.5 mm), three types of solders - one lead (Sn63Pb37) and two lead free (Sn99Cu1, Sn97Cu3) solders and three types of fluxes.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128779667","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics 微电子中银在常规和可生物降解衬底上的电化学迁移
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887604
B. Medgyes, I. Hajdu, R. Berényi, L. Gál, M. Ruszinkó, G. Harsányi
{"title":"Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics","authors":"B. Medgyes, I. Hajdu, R. Berényi, L. Gál, M. Ruszinkó, G. Harsányi","doi":"10.1109/ISSE.2014.6887604","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887604","url":null,"abstract":"Water drop (WD) test and a contact angle measurement method were used to investigate the electrochemical migration (ECM) behavior on different microelectronic substrates with silver conductor lines in all cases. Environment friendly substrates were also investigated in this study as possible candidates of the conventional ones. ECM is kind of short failure phenomenon, which can lead to series defect in case of operating microcircuits, when moisture appears on/in a conductor-dielectric-conductor system. The results show that the novel biodegradable substrate patterns can have a significant higher ECM risk comparing to the conventional ones. The main causes can be the different wetting behavior and the different conductor line accuracy of the technological processes.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126502031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Packaging technologies for (Ultra-)thin sensor applications in active magnetic bearings 主动磁轴承(超)薄传感器应用的封装技术
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887577
D. Ernst, M. Melzer, D. Makarov, F. Bahr, W. Hofmann, O. Schmidt, T. Zerna
{"title":"Packaging technologies for (Ultra-)thin sensor applications in active magnetic bearings","authors":"D. Ernst, M. Melzer, D. Makarov, F. Bahr, W. Hofmann, O. Schmidt, T. Zerna","doi":"10.1109/ISSE.2014.6887577","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887577","url":null,"abstract":"We realized ultra-thin and flexible magnetic field sensors based on the Hall Effect in 2 μm thick Bismuth films prepared on commercial flexible double-layer polyimide PCB with a total thickness of 150 μm. These sensors could be potentially applied in active magnetic bearing (AMB) systems. Therefore, here we address reliability aspects of flexible Hall sensors with emphasis on the proper choice of adhesive to mount the sensor to a stator of the AMB. The thermal shock tests in the standard automotive temperature range of -40°C to 165°C as well as the vibration test of the sensor mounted to the stator has proven the sensor's stability.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126537980","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Fabrication of electrochemical sensor in Low Temperature Co-fired Ceramics 低温共烧陶瓷电化学传感器的制备
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887567
Michal Štekovič, J. Šandera
{"title":"Fabrication of electrochemical sensor in Low Temperature Co-fired Ceramics","authors":"Michal Štekovič, J. Šandera","doi":"10.1109/ISSE.2014.6887567","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887567","url":null,"abstract":"Thick film voltammetric systems for electrochemical analysis in-situ are characterized by small size, low cost and variability of a used materials [1]. A conventional alumina ceramics substrate allows a creation of only planar electrode system. Low Temperature Co-fired Ceramics (LTCC) enables to create three dimensional structure, while maintaining the similar advantageous properties of alumina ceramics, such as low surface roughness, chemical indifference, good thermal stability. This article is focused on design and fabrication of electrochemical sensor in LTCC technology. The sensor consists of two parts. A base of the sensor contains heater. The second part contains a three-electrode system for electrochemical analysis. The design of the electrodes enables to measure a small quantity of an analyte.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116862894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Mechanical testing of PCB using computer simulations 利用计算机模拟对PCB进行力学测试
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI: 10.1109/ISSE.2014.6887610
B. Psota, A. Otáhal, I. Szendiuch
{"title":"Mechanical testing of PCB using computer simulations","authors":"B. Psota, A. Otáhal, I. Szendiuch","doi":"10.1109/ISSE.2014.6887610","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887610","url":null,"abstract":"This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114928569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Heat dissipation based on LTCC-HTCC heterostructure 基于LTCC-HTCC异质结构的散热研究
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-01 DOI: 10.1109/ISSE.2014.6887552
Michal Jurcisin, S. Slosarcik, S. Kardoš
{"title":"Heat dissipation based on LTCC-HTCC heterostructure","authors":"Michal Jurcisin, S. Slosarcik, S. Kardoš","doi":"10.1109/ISSE.2014.6887552","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887552","url":null,"abstract":"Articles deals with technology of realization of LTCC-HTCC heterostructure based on different thermal conductivity of substrates as well as with fabrication process of inner channels on the interface of heterostructure. In the practical part the results of measurements on realized samples for the purpose of use in field of heat dissipation from electronic microstructures are presented.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116821023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Automatic traffic monitoring system 自动交通监控系统
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-01 DOI: 10.1109/ISSE.2014.6887618
I. Costea, P. Tanasa, I. Barbu, I. Cojocaru, N. Dumitru
{"title":"Automatic traffic monitoring system","authors":"I. Costea, P. Tanasa, I. Barbu, I. Cojocaru, N. Dumitru","doi":"10.1109/ISSE.2014.6887618","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887618","url":null,"abstract":"The surveillance of incidents that may occur in traffic presented in this paper show the recording of an accident on a highway or national road, therefore it uses the e-call system for reporting data. Therefore as time is of the essence the recorded data will be stored in a “cloud” system and all active officers on duty will be notified and will be able to respond. The data stored in the “cloud” will help on the matter of prevention of future accidents by creating a visual response by using a graphical rendition summarized into a chart.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115966587","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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