基于LTCC-HTCC异质结构的散热研究

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-01 DOI:10.1109/ISSE.2014.6887552

Michal Jurcisin, S. Slosarcik, S. Kardoš

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引用次数: 1

摘要

文章介绍了基于不同导热系数的LTCC-HTCC异质结构的实现技术，以及异质结构界面上内通道的制备工艺。在实际应用中，给出了用于电子微结构散热研究的实现样品的测量结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Heat dissipation based on LTCC-HTCC heterostructure

Articles deals with technology of realization of LTCC-HTCC heterostructure based on different thermal conductivity of substrates as well as with fabrication process of inner channels on the interface of heterostructure. In the practical part the results of measurements on realized samples for the purpose of use in field of heat dissipation from electronic microstructures are presented.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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