LTCC lamination process using PMMA fugitive material

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887555

S. Toškov, Nenad Krcic, G. Radosavljevic

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引用次数: 3

Abstract

Integrated cavities, screen-printed passive components and channels are common parts of 3D micro-fluidic devices fabricated in low temperature co-fired ceramics (LTCC) technology. However, realization of defect-free structures without cracks, sagging of cavities or channels is challenging and strongly influenced by quality of lamination and firing processing conditions. Lamination technique based on incorporation of polymethylmethycrylate (PMMA) sacrificial volume material (SVM) for implementation of large cavities inside LTCC module is presented in this paper. Optimized firing conditions for proper burnout of SVM have been described. Influence of lamination and firing processing conditions are demonstrated in fabrication of 3-dimensional micro-fluidic device. Tested structure contains screen printed interdigital capacitor (IDC) positioned inside large cavity with dimensions 0.23 +/- 0.01 × 5.6 × 11.2 [mm3] for thickness, width and length, respectively. Obtained results show advantages of PMMA incorporation in fabrication of defect-free structures in LTCC technology.

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LTCC层压工艺采用PMMA易失性材料

集成腔、丝网印刷无源元件和通道是低温共烧陶瓷(LTCC)技术制造的三维微流控器件的常见部件。然而，实现无裂纹、无空洞或无沟道下垂的无缺陷结构是具有挑战性的，并且受到层压质量和烧制工艺条件的强烈影响。提出了一种基于聚甲基丙烯酸甲酯(PMMA)牺牲体积材料(SVM)的层压技术，用于实现LTCC模块内的大空腔。描述了支持向量机适当燃尽的优化燃烧条件。研究了复合和烧成工艺条件对三维微流控器件制备的影响。测试结构包含丝网印刷数字间电容器(IDC)，位于大腔内，厚度、宽度和长度分别为0.23 +/- 0.01 × 5.6 × 11.2 [mm3]。结果表明，在LTCC技术中加入PMMA在制造无缺陷结构方面具有优势。

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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