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2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)最新文献

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Supply chain risk management 供应链风险管理
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393749
John T. Jeng
{"title":"Supply chain risk management","authors":"John T. Jeng","doi":"10.1109/SMTW.2004.1393749","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393749","url":null,"abstract":"TSMC's risk management department (RM) initiated the first phase of its Supply Chain Risk Management Project in 2003, which included a risk assessment of the company's single-source raw material suppliers. RM worked jointly with the procurement department on this project to assess potential supply chain risks from single-source suppliers located in throughout the world. Suppliers participated in the risk assessment by providing survey responses on key risk issues, which were then evaluated based on key supply risk factors that could interrupt company operations, such as geographic, contingency planning, factory, replacement, and supply/demand. This work provides an overview of the methodology used for this project, and the techniques applied to conduct the risk assessment.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"222 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116026439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 360
Unified framework for facility condition monitoring, detection, and diagnostics 用于设施状态监测、检测和诊断的统一框架
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393712
Huei-Shyang You, Tzu-Chi Wang, Wen-Yao Chang, Chih-Wei Lai, Ming-Wei Lee, Kei-wei Zuo
{"title":"Unified framework for facility condition monitoring, detection, and diagnostics","authors":"Huei-Shyang You, Tzu-Chi Wang, Wen-Yao Chang, Chih-Wei Lai, Ming-Wei Lee, Kei-wei Zuo","doi":"10.1109/SMTW.2004.1393712","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393712","url":null,"abstract":"The advanced facility monitoring and diagnosis system provide a comprehensive solution to most of the possible problems in manufacturing. This article proposes an advanced facility monitoring and diagnosis system framework - APCSuite-ECMXpert, which consists of equipment condition monitoring system (ECMS), and advanced process control toolkit - APCSuite. The methodologies applied on facility condition monitoring and the application cases for monitoring the facility equipments in semiconductor plant are illustrated in This work.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126091845","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
In-line inspection on thickness of sputtered HfO/sub 2/ and Hf metal ultra-thin films by spectroscopic ellipsometry 光谱椭偏法在线检测溅射HfO/ sub2 /和Hf金属超薄膜厚度
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393742
Y. Chuo, D. Shu, L. Lee, W. Hsieh, M. Tsai, A. Wang, S. Hung, P. Tzeng, Y. Chou
{"title":"In-line inspection on thickness of sputtered HfO/sub 2/ and Hf metal ultra-thin films by spectroscopic ellipsometry","authors":"Y. Chuo, D. Shu, L. Lee, W. Hsieh, M. Tsai, A. Wang, S. Hung, P. Tzeng, Y. Chou","doi":"10.1109/SMTW.2004.1393742","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393742","url":null,"abstract":"HfO2-based dielectrics are most promising high k materials to substitute SiO2 for the MOS gate dielectric. To guarantee the deposition process under well control, an in-line inspection to characterize the thickness and uniformity of both HfO2 and Hf metal ultra-thin films must be established. In this work, we proposed an in-line, non-destructive optical method to measure thickness of both films, and this method has potential to be inducted into production control. Upon spectroscopic ellipsometry (SE), reactive DC sputtered HfO2 and Hf metal ultra-thin films with featured-thickness of 40 Aring or larger were well analyzed, and accuracy of wafer mapping measurement fell in 3 Aring","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"10 12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133173302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Considerations for cleanroom control in different climatic regions 不同气候区洁净室控制的注意事项
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393718
Chun-Hung Tsai, Kung-Yao Chung, Chun-Mine Wang
{"title":"Considerations for cleanroom control in different climatic regions","authors":"Chun-Hung Tsai, Kung-Yao Chung, Chun-Mine Wang","doi":"10.1109/SMTW.2004.1393718","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393718","url":null,"abstract":"The cleanroom control systems should be designed according to different climatic regions. This work investigates how the climatic difference affects the design of the make-up-air unit, MAU, which controls temperature and humidity in a cleanroom. We recommend suitable designs for different climatic regions around the world. We also establish a database for MAU design of different climatic regions.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"398 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133480070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Wafer by wafer control in CMP system with metrology delay 具有计量延迟的CMP系统的逐片控制
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393759
Gow-Bin Wang, E-Hon Lin, Huei-Shyang You, Ming-Wei Lee, Fu-Kuan Hsiao, Chih-Wei Lai
{"title":"Wafer by wafer control in CMP system with metrology delay","authors":"Gow-Bin Wang, E-Hon Lin, Huei-Shyang You, Ming-Wei Lee, Fu-Kuan Hsiao, Chih-Wei Lai","doi":"10.1109/SMTW.2004.1393759","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393759","url":null,"abstract":"Chemical mechanical planarization(CMP) has become part of important processing module in semiconductor manufacturing due to the shallow trench isolation technique. It is known that many different sources of variations are commonly found in CMP process. Hence the run-to-run control scheme which can specify how the recipe for the process should be updated is appropriate for CMP process control. This work tries to treat the issue of practical application of run-to-run control with metrology delay for CMP system. The module characteristics and real operating conditions of CMP processes are first studied and demonstrated by CMP data collected from fab. By considering the effects of metrology delay, the process model and parameters of the observer are properly modified to improve the performance of the double EWMA controller. To sum up, based on the collected CMP data, the process capability index Cpk can be enhanced several times by use of the proposed run-to-run control approach","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"104 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116195540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Strategy and benefit analysis of water saving in 8" semiconductor fab 8"半导体晶圆厂节水策略及效益分析
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393717
Caixia Liao, Y. Chang, D. Yang, B. Jiang
{"title":"Strategy and benefit analysis of water saving in 8\" semiconductor fab","authors":"Caixia Liao, Y. Chang, D. Yang, B. Jiang","doi":"10.1109/SMTW.2004.1393717","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393717","url":null,"abstract":"This article was introduced the example of water saving in 8-inches semiconductor plant of UMC-8E plant. The technology and strategy was established by the water character, which included the recovery source, POU demand, environmental impact and running cost. We select the RO as a main unit in recovery system of waste water because the condition of environment and cost can be matched. The process recovery rate can be exceeded 85% after this saving strategy was practiced. This accomplishment was hard to achieve for the old plant, so we obtained the honor of water saving in 2002.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114850516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Automatically form batch via real time dispatcher for furnace operation in 300 mm fab 通过实时调度器自动形成批量，用于300mm工厂的炉操作
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393707
De-Lung Wu, Hsi-Lo Lo, Cheng-Chung Pan, Yu-Ting Chang, Chin-Lang Peng
{"title":"Automatically form batch via real time dispatcher for furnace operation in 300 mm fab","authors":"De-Lung Wu, Hsi-Lo Lo, Cheng-Chung Pan, Yu-Ting Chang, Chin-Lang Peng","doi":"10.1109/SMTW.2004.1393707","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393707","url":null,"abstract":"Nowadays, the automation is the fundamental element of a 300 mm Fab. FOUP transportation, lot dispatching and data processing and other production requirements are integrated by the system. On the other hand, dispatching is getting more and more important due to the complicated process routing and reentry process flow in semiconductor Fab. It is important to optimize the batching size in furnace area, since most of furnace EQP are designed to accommodate up to 100 wafers in 300 mm Fab. In order to fully utilize the furnace, some waiting time is allowed to maximize the batch size. Beside, the furnace dispatching must consider the other issue, such as queue time limit. The pre-clean start time or form batch time must be well controlled to prevent product from queue time over and to keep machine from idle. This work describes an auto forming batch system for furnace operation, which is implemented in the real time dispatching system of PSC FAB 12A. The auto form batch rate is raised up to 85% form Q3 2003 to now. And finally, it has been proved that the auto form batch dispatching system not only improve furnace utilization but also reduces the cycle time between wet and furnace operation. Headings of This work are as follows: (1) introduction, (2) RTD system structure for furnace batch dispatching, (3) batch forming time model and furnace dispatching, (4) result and discussion, and (5) future direction and conclusion.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"25 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134554976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Test wafer control system in 300 mm FAB 在300mm FAB测试晶圆控制系统
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393710
Jer-Wei Hsu, Hsi-Lo Lo, Cheng-Chung Pan, Yi-Ming Chen, T. Hsieh
{"title":"Test wafer control system in 300 mm FAB","authors":"Jer-Wei Hsu, Hsi-Lo Lo, Cheng-Chung Pan, Yi-Ming Chen, T. Hsieh","doi":"10.1109/SMTW.2004.1393710","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393710","url":null,"abstract":"Test wafers are used in wafer fabrication to monitor equipment stability and product quality. Any shortage causes the loss of equipment capacity and production move. On the contrary, to prepare more test wafers to avoid shortage spends more cost, occupies more storage space, and lowers transfer efficiency. Considering the wafer cost and FAB productivity, an efficient control system of test wafer in 300 mm FAB is much more important than formerly.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124219562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
SPC precaution system 程控预防系统
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393761
M.F. Chen, M. Huang
{"title":"SPC precaution system","authors":"M.F. Chen, M. Huang","doi":"10.1109/SMTW.2004.1393761","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393761","url":null,"abstract":"Every module setup lot of charts to monitor off-line process data. Most of charts are sensitive to inline process data. Although each of charts had set control limit and specification to warn the process while trending up or down, there are still have risk to cause product fail due to narrow process window. It's very difficult and impossible to take care of all charts on manufacturing to find which of them are not stable. The paper shows a new methodology to take care of all of chart on manufacturing. The engineers only have to group the charts having the same process property (ex, resist THK, CD, Overlay, ETH, Etch-Rate, etc...) on system. This system will automatic create report and send the warning messages to engineer through the e-mail. It is very helpful for the module to find out which are the worst or getting worse charts. Engineer can take action early before the chart going worst and all of abnormal event can be prevented in advance. This new methodology not only increased the stability of production line, but also saved lot of manpower to handle abnormal event","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129739636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Alarm performance retention via Web-base diagnostic platform 通过基于web的诊断平台保留告警性能
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393751
Yi-Chun Chang, Ming-Wei Lee, Kewei Zuo, Tzxy-Chyi Wang, Huei-Shyang You
{"title":"Alarm performance retention via Web-base diagnostic platform","authors":"Yi-Chun Chang, Ming-Wei Lee, Kewei Zuo, Tzxy-Chyi Wang, Huei-Shyang You","doi":"10.1109/SMTW.2004.1393751","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393751","url":null,"abstract":"A framework for improving alarm performance is proposed and a more detailed flowchart is also described in this paper. Alarm systems are complicated and the improvement requires long-term efforts. The proposed procedure has reduced unnecessary alarms effectively. The architecture of an Internet service is also proposed","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127625496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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