2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)最新文献

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An e-Diagnostics framework with security considerations for semiconductor factories 半导体工厂的电子诊断框架与安全考虑
Min-Hsiung Hung, Rui-Wen Ho, F. Cheng
{"title":"An e-Diagnostics framework with security considerations for semiconductor factories","authors":"Min-Hsiung Hung, Rui-Wen Ho, F. Cheng","doi":"10.1109/SMTW.2004.1393711","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393711","url":null,"abstract":"In This work, new-generation software technologies and object-oriented technologies, such as Web services, XML signature, XML encryption, UML, etc., are used to develop an e-Diagnostics framework for semiconductor factories. The proposed framework can achieve the automaton of diagnostic processes and the integration of diagnostics information under a secure communication infrastructure. Specifically, several measures, such as single sign-on authentication and authorization, confirmation of data accuracy, assurance of information confidentiality, management of system users, and auditing of system operations, are designed to enhance the overall system security. The proposed framework can be applied to construct e-Diagnostics systems for the semiconductor industry.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127661100","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Process optimization by advanced process control with fault detection system for flash memory 采用先进的过程控制和故障检测系统对闪存进行工艺优化
T. Luoh, Changrui Liao, Li-Chung Yang, Ling-Wu Yang, Chi-Tung Huang, H. Shih, Kuang-Chao Chen, H. Chung, J. Ku, Chih-Yuan Lu
{"title":"Process optimization by advanced process control with fault detection system for flash memory","authors":"T. Luoh, Changrui Liao, Li-Chung Yang, Ling-Wu Yang, Chi-Tung Huang, H. Shih, Kuang-Chao Chen, H. Chung, J. Ku, Chih-Yuan Lu","doi":"10.1109/SMTW.2004.1393723","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393723","url":null,"abstract":"Plasma damaged 0.18 /spl mu/m flash memory device has been resolved by integrating advanced process control with fault detection and classification (APC FDC) system in ILD HDP PSG process. PSG plasma damage to device was detected by real-time monitoring APC control system with multivariate statistically calculation to detect out-of-control conditions within five minutes. The unhealthy recipe contents and the hardware healthy status are detected by integrating APC FDC system. After we analyzing the fault detection and classification function, APC system successfully predicts the same results as wafer acceptance test and wafer sort yield. Recipe and hardware are modified to eliminate the plasma damage according the analysis results.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133055669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Supply chain driven - advanced taget delivery system 供应链驱动-先进的目标交付系统
Yih-Yi Lee, N. Fan
{"title":"Supply chain driven - advanced taget delivery system","authors":"Yih-Yi Lee, N. Fan","doi":"10.1109/SMTW.2004.1393704","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393704","url":null,"abstract":"How to build up a system to translate the quantity & delivery demand of customer to the manufacturing control in foundry fab which provides complex delivery service is the key for customer orientation - supply chain driven. Advanced target delivery system (ATDS) is the mechanism to translate the quantity & delivery demand of customer to the manufacturing control for pushing lots with accurate delivery according to MPSI of PC for foundry fabs. Function for monitoring the delivery status and perforate auto-change lot priority is a great contribution for foundry fab to provide excellent customer service. Namely, ATDS provides fast and solid information to control each device shipment and enables manufacturing planner to change some system parameters to calculate out the capability of shipments. To sum up, ATDS is endowed with two-way, automaticity and accuracy to fit the demand of customers.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133530050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Machine grouping algorithm for stepper back-up and an empirical study 步进备份的机器分组算法及实证研究
Chia-Yu Hsu, Chen-Fu Chien, Yung-Chen Tsao, Cheng-Yi Li
{"title":"Machine grouping algorithm for stepper back-up and an empirical study","authors":"Chia-Yu Hsu, Chen-Fu Chien, Yung-Chen Tsao, Cheng-Yi Li","doi":"10.1109/SMTW.2004.1393757","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393757","url":null,"abstract":"Considering the limitations of the operation cost and the flexibility need of the manufacturing, the wafer was unable to expose in the same stepper from layer to layer in the real setting. In addition, the lithographic systems also require appreciate back-ups to avoid the yield loss as the equipment fault or shut-down for maintenance. This study aims to develop a machine group algorithm for the stepper and thus propose appropriate back-up based on the similarity of systematic overlay errors and residuals. The results are confirmed with judgments of domain experts and thus validated this approach","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133354293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Planning yields in recycling test wafers 计划回收测试晶圆的产量
Muh-Cherng Wu, C. Chien, K. Lu
{"title":"Planning yields in recycling test wafers","authors":"Muh-Cherng Wu, C. Chien, K. Lu","doi":"10.1109/SMTW.2004.1393750","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393750","url":null,"abstract":"This paper formulates a decision problem and proposes two solution methods for selecting the yield improvement alternatives in the test wafer recycle processes. The decision problem is to determine the yield improvement target for each recycle process in order to minimize the use of test wafers","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132474494","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Global CD uniformity improvement using dose modulation pattern correction of pattern density-dependent and position-dependent errors 使用剂量调制模式校正模式密度依赖和位置依赖误差来改善全局CD均匀性
Chia-Jen Chen, Hsin-Chang Lee, L. Yeh, Kai-Chung Liu, Ta-Cheng Lien, Yi-Chun Chuo, H. Hsieh, B. Lin
{"title":"Global CD uniformity improvement using dose modulation pattern correction of pattern density-dependent and position-dependent errors","authors":"Chia-Jen Chen, Hsin-Chang Lee, L. Yeh, Kai-Chung Liu, Ta-Cheng Lien, Yi-Chun Chuo, H. Hsieh, B. Lin","doi":"10.1109/SMTW.2004.1393734","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393734","url":null,"abstract":"The specification of mask global CD uniformity (GCDU) is ever tightening. There is no exception at the 65-nm node. Some of the key contributors affecting GCD non-uniformity are pattern-density effects such as fagging effect from the e-beam writer and macro loading effect from the etcher. In addition, the contributions from position-dependent effects are significant, and these contributions included resist developing, baking, as well as aberrations of the wafer-imaging lens. It is challenging to quantify these effects and even more so to correct them to improve the GCDU. Correction of the fogging and etch loading effects had been reported by various authors. In addition to correction for these effects, we are reporting the position-dependent effects in this paper.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"516 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123090898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Key factor for new technology transfer on the R&D cycle-time system 研发周期时间系统中新技术转移的关键因素
C. Yu-Chih, K. L. Young, J.Y. Chou
{"title":"Key factor for new technology transfer on the R&D cycle-time system","authors":"C. Yu-Chih, K. L. Young, J.Y. Chou","doi":"10.1109/SMTW.2004.1393760","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393760","url":null,"abstract":"The new technology, process control and cycle time management in semiconductor manufacturing for the R&D (research and development department) is import and is a great challenge task, because of the numerous engineering holds, lot splits, and necessary experimental processes are executing continued. The other challenge is an R&D pilot line exist large variety of process technologies. Therefore, short cycle time for new technology or process to meet customer demand is difficult but must to achieve the mission of the goal. Forecast this goal, we had kicked off a cooperation plan which name is `R&D cycle time system' with R&D members cooperate to complete it. In this paper, we present the system that includes six effective factors that they can easy to find symptoms on a long cycle time, a process or a technology issue by layer, stage or step. We give they name of these six key handling factors as x-ratio RD,x-ratio FAB,x-ratio RD, x-ratio FAB,f-factor and R1-factor . These measurements can judge whether delivered a lot on time on a layer, a stage or step and the process and technology is stable or unstable on it. Specially, the measurement value of f-factor and f1-factor can suggest a process step of technology is maturity or not. They like the eyes on this complex and changeful process flow of the R&D, this system hope to be a useful tool for supporting R&D member to find out the process, technology and cycle time issues about this kind of a tough question","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116120900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On achieving large inductances for small on-chip inductors through providing pre-programmed multi-dipole cushioning for the spiral inductors via nano technology 利用纳米技术为螺旋电感提供预编程多偶极缓冲,实现小型片上电感的大电感
C. Liao, H.Y. Shao, Chien-Jung Liao, J. Hsu
{"title":"On achieving large inductances for small on-chip inductors through providing pre-programmed multi-dipole cushioning for the spiral inductors via nano technology","authors":"C. Liao, H.Y. Shao, Chien-Jung Liao, J. Hsu","doi":"10.1109/SMTW.2004.1393752","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393752","url":null,"abstract":"The verified success of proton bombardment treatment in both the device isolation and the inductor Q-improvement (C. P. Liao et al., 2003) (C. P. Liao et al., 1998) on already-manufactured mixed-mode IC wafers (prior to packaging) has also uncovered new phenomena, especially the explosive rises of inductance near certain frequency (or, frequencies) (C. P. Liao et al., 2003). A previously proposed theory identified the cause to be resonant interaction between the inductor EM wave and the proton-caused defect electric dipoles (C. P. Liao et al., 2003). Based on such understanding, this paper aims at providing a new possibility of greatly enhancing the effectiveness of on-chip inductors by cushioning them on multiple dipoles using nanotechnical means","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"12 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131902691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A tool portfolio elimination mechanism (TPEM) for a wafer fab 用于晶圆厂的工具组合消除机制(TPEM)
S. Chung, Ming-Hsiu Hsieh, Jui-Chun Liu
{"title":"A tool portfolio elimination mechanism (TPEM) for a wafer fab","authors":"S. Chung, Ming-Hsiu Hsieh, Jui-Chun Liu","doi":"10.1109/SMTW.2004.1393716","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393716","url":null,"abstract":"Wafer manufacturers usually face critical problems when making decisions regarding to the tool portfolio elimination, mainly due to the dramatic and frequent influences from their internal and external environments. This work is aimed to develop a mechanism, named tool portfolio elimination mechanism (TPEM), to evaluate the impacts on production performance and capital expenditure, and to determine which equipment is suitable for pruning. In TPEM, there are four stages to decide tool portfolio elimination according to the PDCA cycle. Meanwhile, the simulation results show that the fab production performance and cost are much improved by the TPEM algorithm. Especially, it can be applied and implemented to industry very quickly and easily.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123587656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Risk management in semiconductor industry 半导体行业的风险管理
Kochun Mou, Guang-Hann Chen
{"title":"Risk management in semiconductor industry","authors":"Kochun Mou, Guang-Hann Chen","doi":"10.1109/SMTW.2004.1393764","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393764","url":null,"abstract":"The importance of risk management in semiconductor industry is acknowledged by semiconductor industry. Risk management department should be independent to any other department and reports directly to top management (president) in the company. The organization of risk management should include (but not limit to) aspects of risk control, loss prevention, emergency response, insurance, industrial safety and health, environmental protection, medication, and security. Each section has its own tasks, however, they are not independent to one another. The tasks of each section and how they integrate each other are discussed in this study. Company would be impacted more or less when unexpected incident occurs. How company responds to the incident determine the severity of the impact. The role of risk management department in emergency response is also discussed in this study. The risk management system is tested and is operating in an existing semiconductor company and the performance is satisfactory.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126381898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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