用于晶圆厂的工具组合消除机制(TPEM)

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI:10.1109/SMTW.2004.1393716

S. Chung, Ming-Hsiu Hsieh, Jui-Chun Liu

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引用次数: 2

摘要

晶圆片制造商在做出关于工具组合淘汰的决策时，通常会面临关键问题，主要是由于其内部和外部环境的巨大和频繁的影响。这项工作的目的是建立一种机制，称为工具组合消除机制(TPEM)，以评估对生产性能和资本支出的影响，并确定哪些设备适合修剪。在TPEM中，根据PDCA循环，有四个阶段来决定工具组合的消除。仿真结果表明，TPEM算法大大提高了晶圆厂的生产性能和成本。特别是，它可以非常快速和容易地应用到工业中。

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A tool portfolio elimination mechanism (TPEM) for a wafer fab

Wafer manufacturers usually face critical problems when making decisions regarding to the tool portfolio elimination, mainly due to the dramatic and frequent influences from their internal and external environments. This work is aimed to develop a mechanism, named tool portfolio elimination mechanism (TPEM), to evaluate the impacts on production performance and capital expenditure, and to determine which equipment is suitable for pruning. In TPEM, there are four stages to decide tool portfolio elimination according to the PDCA cycle. Meanwhile, the simulation results show that the fab production performance and cost are much improved by the TPEM algorithm. Especially, it can be applied and implemented to industry very quickly and easily.

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2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)

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