在300mm FAB测试晶圆控制系统

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI:10.1109/SMTW.2004.1393710

Jer-Wei Hsu, Hsi-Lo Lo, Cheng-Chung Pan, Yi-Ming Chen, T. Hsieh

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引用次数: 4

摘要

测试晶圆片用于晶圆制造，以监测设备的稳定性和产品质量。任何短缺都会导致设备产能的损失和生产的转移。相反，为了避免短缺而制备更多的测试晶圆需要花费更多的成本，占用更多的存储空间，降低转移效率。考虑到晶圆成本和晶圆厂的生产效率，300mm晶圆厂有效的测试晶圆控制系统显得尤为重要。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Test wafer control system in 300 mm FAB

Test wafers are used in wafer fabrication to monitor equipment stability and product quality. Any shortage causes the loss of equipment capacity and production move. On the contrary, to prepare more test wafers to avoid shortage spends more cost, occupies more storage space, and lowers transfer efficiency. Considering the wafer cost and FAB productivity, an efficient control system of test wafer in 300 mm FAB is much more important than formerly.

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来源期刊

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)

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