2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application最新文献_第3页

Theoretical Study of Laminar Pulsating Flow in a Pipe 管道层流脉动流动的理论研究

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363443

H. Mostafa, K. Abd_elsalam, A.M. Torki

引用次数: 6

Numerical Study of Heat Transfer in Pulsating Turbulent Air Flow 脉动湍流气流传热的数值研究

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363411

E. Elshafei, M. Safwat Mohamed, H. Mansour, M. Sakr

引用次数: 15

Compact Thermal Models: A Global Approach 紧凑热模型:一个全球性的方法

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363405

S. Mohamed-Nabil, S. Hossam

{"title":"Compact Thermal Models: A Global Approach","authors":"S. Mohamed-Nabil, S. Hossam","doi":"10.1109/THETA.2007.363405","DOIUrl":"https://doi.org/10.1109/THETA.2007.363405","url":null,"abstract":"Construction and usage of compact thermal models (CTM) for the thermal analysis as well as the design of cooling devices for electronic systems are reviewed. These models have many advantages over the so called detailed models, mainly being a convenient and simple quantitative description of the modeled object, when constructional details are either unavailable or too detailed to be of use at the desired level of analysis. However, CTMs have manifested some deficiencies in many cases, in particular MCM and stacked dies. The opposite approach, detailed modeling, is more reliable, although extremely heavy. A new approach is proposed that solves this dilemma by bridging the gap between compact and detailed models. While retaining all advantages of CTM's, i.e. having a limited number of degrees of freedom and not requiring detailed constructional details, it can attain any required precision level depending on the degree of complexity adopted. It gives reliable results covering all operating conditions including MCM and stacked dies. Moreover, it gives access to data on surface temperature gradients that were never obtained before by compact models and are highly important for reliability issues","PeriodicalId":346940,"journal":{"name":"2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121747674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Power and Thermal Management in VLSI Circuits VLSI电路中的功率和热管理

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363398

A. Mohab

引用次数: 0

Collector Pressure Losses in Micro Heat Exchangers 微型热交换器的集热器压力损失

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363402

T. Stevens, F. Rogiers, S. Delport, P. Vleugels, J. Peirs, M. Baelmans

引用次数: 3

Si Via Interconnection Technique with Thermal Budget Design 硅通孔互连技术与热预算设计

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363432

Jinwoo Jeong, Eunsung Lee, H. Kim, C. Moon, K. Chun

引用次数: 0

Graceful Operation of Disk Drives under Thermal Emergencies 磁盘驱动器在热紧急情况下的安全操作

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363414

Youngjae Kim, Jeonghwan Choi, S. Gurumurthi, A. Sivasubramaniam

{"title":"Graceful Operation of Disk Drives under Thermal Emergencies","authors":"Youngjae Kim, Jeonghwan Choi, S. Gurumurthi, A. Sivasubramaniam","doi":"10.1109/THETA.2007.363414","DOIUrl":"https://doi.org/10.1109/THETA.2007.363414","url":null,"abstract":"Thermal-aware design of disk-drives is an important concern because high temperatures can cause reliability problems. Hence, dynamic thermal management (DTM) has been proposed to operate the disk at the average case, rather than the worst case by modulating the activities to avoid thermal emergencies at run time while pushing the performance. A delay-based approach to adjust the disk seek activities is one DTM solution for normal disk-drives. Even if it could overcome thermal emergencies without stopping disk activity, it suffers from long delays when servicing the requests. This paper investigates the possibility of using a multi-speed disk-drive which dynamically modulates the rotational speed of the platter (called DRPM) for implementing DTM, Using a detailed performance and thermal simulator of storage system the authors evaluate DTM policies and observe that the DRPM technique is the best to avoid thermal emergencies. However, the authors find that the time taker, to transition between different rotational speeds of the disk is critical to the effectiveness of this DTM technique","PeriodicalId":346940,"journal":{"name":"2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123337483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Proposal of a Temperature-Difference Sensor Based on Short-Circuit Current Measurement of a Single Thermocouple 基于单个热电偶短路电流测量的温差传感器的设计

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363433

M. Kimura, Seung S. Lee

引用次数: 3

3-D Finite Element Analysis of Transient Heat Transfer and Thermal Stress in a Crowned Mandibular First Molar Tooth 冠状下颌第一磨牙瞬态传热和热应力的三维有限元分析

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363426

I. Motawea, A. Alshorbagy, R. Ibrahim, H. Sallam

{"title":"3-D Finite Element Analysis of Transient Heat Transfer and Thermal Stress in a Crowned Mandibular First Molar Tooth","authors":"I. Motawea, A. Alshorbagy, R. Ibrahim, H. Sallam","doi":"10.1109/THETA.2007.363426","DOIUrl":"https://doi.org/10.1109/THETA.2007.363426","url":null,"abstract":"A three-dimensional transient thermoelastic finite element model was developed to simulate a crowned mandibular first molar tooth under thermal loading as a result of hot liquid intake in the mouth. The effect of crown materials and cement types on thermal stress distribution in a crowned tooth was studied. A single layer crown (Empress) and a double layer crown (In-Ceram) were used as model materials, representing the two extremes in strength of contemporary materials compared to porcelain fused to metal crowns. Resin, glass ionomer, and zinc phosphate cements were evaluated, representing the upper and lower limits of modulus of elasticity currently available. The temperature changes as a result of hot liquid intake were calculated. Then, the thermal stress distributions due to the temperature changes were obtained. The hot liquid was of temperature 60 degC in all prepared cases. The distribution of temperature and stress were plotted and analyzed for all cases. A comparison between different cases was made to achieve the most suitable crown and cement materials","PeriodicalId":346940,"journal":{"name":"2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115203207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Experimental and Theoretical Analysis on Enhanced Flat Miniature Heat Pipes with Axial Capillary Grooves and Screen Meshes 带轴向毛细槽和筛网的加强型平板微型热管的实验与理论分析

2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363404

S. Maalej, M. Zaghdoudi

{"title":"Experimental and Theoretical Analysis on Enhanced Flat Miniature Heat Pipes with Axial Capillary Grooves and Screen Meshes","authors":"S. Maalej, M. Zaghdoudi","doi":"10.1109/THETA.2007.363404","DOIUrl":"https://doi.org/10.1109/THETA.2007.363404","url":null,"abstract":"Combined experimental and analytical studies are realized in order to verify the flat mini heat pipe (FMHP) concept for cooling high power dissipation electronic components, and determine the potential advantages of constructing arrays of mini channels as an integrated part of a heat pipe. A mixed capillary system, which is composed of screen meshes and mini-channels, is used in order to manufacture the FMHP. In the experimental study, different FMHP prototypes are manufactured and tested. The number of screen meshes is kept the same for the different tested configurations; however different meshing sizes are used. The heat transfer improvement, obtained by comparing the heat pipe thermal resistance to the heat conduction thermal resistance of a copper plate having the same dimensions as the tested heat pipes, is demonstrated for the different prototypes. The heat transfer enhancement depends on the input heat flux rate, the screen mesh porosity, and the FMHP orientation in respect to gravity. In the analytical study, a model of MHP with mixed capillary structure is developed. The comparison between the analytical and experimental results shows a good agreement in predicting both the maximum capillary limit and the FMHP thermal resistance","PeriodicalId":346940,"journal":{"name":"2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125639096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10