Power and Thermal Management in VLSI Circuits

A. Mohab
{"title":"Power and Thermal Management in VLSI Circuits","authors":"A. Mohab","doi":"10.1109/THETA.2007.363398","DOIUrl":null,"url":null,"abstract":"The use of integrated circuits in high-performance computing, telecommunications, and consumer electronics has been growing at a booming pace. As more and more complex functions are required in various data processing devices, the need to integrate these functions in a small package is also increasing. The integration of a large number of functions on a single chip as well as the scaling of technology brings up enormous challenges that must be resolved by designers. As the silicon industry moves towards nanometer designs, one of the most important design challenges cited is the growing chip power consumption and its impact on the chip's thermal integrity. This phenomenon threats the life time of silicon technology and will hinder the proliferation of the microelectronics industry if not controlled","PeriodicalId":346940,"journal":{"name":"2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THETA.2007.363398","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The use of integrated circuits in high-performance computing, telecommunications, and consumer electronics has been growing at a booming pace. As more and more complex functions are required in various data processing devices, the need to integrate these functions in a small package is also increasing. The integration of a large number of functions on a single chip as well as the scaling of technology brings up enormous challenges that must be resolved by designers. As the silicon industry moves towards nanometer designs, one of the most important design challenges cited is the growing chip power consumption and its impact on the chip's thermal integrity. This phenomenon threats the life time of silicon technology and will hinder the proliferation of the microelectronics industry if not controlled
VLSI电路中的功率和热管理
集成电路在高性能计算、电信和消费电子产品中的应用一直在飞速发展。随着各种数据处理设备需要的功能越来越复杂,将这些功能集成到一个小封装中的需求也越来越大。在单个芯片上集成大量功能以及技术的规模化带来了巨大的挑战,这是设计师必须解决的问题。随着硅工业走向纳米设计,最重要的设计挑战之一是不断增长的芯片功耗及其对芯片热完整性的影响。这种现象威胁到硅技术的寿命,如果不加以控制,将阻碍微电子工业的扩散
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