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2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application最新文献

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Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach 印刷电路板的热传导：中尺度建模方法
2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application Pub Date : 2007-05-21 DOI: 10.1109/THETA.2007.363407
W. Nakayama
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引用次数: 5
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