2006 25th International Conference on Thermoelectrics最新文献_第4页

Development of a thermoelectric icemaker device built in a refrigerator 冰箱内热电制冰机装置的研制

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331219

J. Vián, A. Rodríguez, D. Astrain, L. Aldave, J. Barberena, I.P. Urdiain

引用次数: 0

Integrated Thermoelectric Generator and Application to Self-Powered Heating Systems 集成热电发电机及其在自供电加热系统中的应用

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331332

K. Qiu, A. Hayden

{"title":"Integrated Thermoelectric Generator and Application to Self-Powered Heating Systems","authors":"K. Qiu, A. Hayden","doi":"10.1109/ICT.2006.331332","DOIUrl":"https://doi.org/10.1109/ICT.2006.331332","url":null,"abstract":"Self-powered space and water heating systems operate entirely on fuel combustion with no need for externally generated electricity. Excess power can be used to charge batteries or be fed into the household grid to provide electricity for other electrical loads. Self-powered heating systems have the potential for high overall energy efficiency and can be more reliable in providing heat during extreme weather conditions. They are also attractive for remote communities where connection to the grid is not cost effective. To realize this concept, we must develop a reliable, low maintenance and cost-effective means to generate electricity and integrate it into fuel-fired heating units. In the present work, we investigated combustion-heated thermoelectric generation and its application to self-powered heating systems. A thermoelectric module with a power generation capacity of 550 W was integrated into a gas-fired furnace. The tin-telluride-based thermoelectric module has a radial configuration. The effects of heat transfer conditions were studied in order to maximize electric power output. The performance of the thermoelectric device was examined at various operating conditions. We have shown that the technology is attractive and offers the potential for practical applications","PeriodicalId":346555,"journal":{"name":"2006 25th International Conference on Thermoelectrics","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131619634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Mathematic Simulation on Power Generation by Roll Cake Type of Thermoelectric Cylinders 卷饼式热电筒发电的数学模拟

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331375

R. Suzuki, D. Tanaka

引用次数: 2

Assessment of TEC Thermal and Reliability Requirements for Thermoelectrically Enhanced Heat Sinks for CPU Cooling Applications CPU冷却用热电增强散热器的TEC散热和可靠性要求评估

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331363

Jim Bierschenk, M. Gilley

{"title":"Assessment of TEC Thermal and Reliability Requirements for Thermoelectrically Enhanced Heat Sinks for CPU Cooling Applications","authors":"Jim Bierschenk, M. Gilley","doi":"10.1109/ICT.2006.331363","DOIUrl":"https://doi.org/10.1109/ICT.2006.331363","url":null,"abstract":"The microelectronics industry is reaching the limits of traditional air cooling for many applications, particularly for gaming computers and high-end workstations. The continuing trends toward smaller die and higher heat dissipation lead to higher watt densities and large thermal interface losses. This forces the thermal designer to utilize more and more efficient heat sinks because a significant portion of the die to ambient DeltaT is consumed by interface and spreading losses. The use of thermoelectrics, operating at COPs between 2 and 4, can be an effective means of enhancing or augmenting the thermal performance of air-cooled heat sinks and has been documented at recent thermal management conferences. These publications have focused on the potential improvement in heat sink thermal performance possible from TE enhanced heat sinks for CPU cooling applications. Little work has been published discussing the requirements of the TECs necessary to achieve these performance improvements. This paper will review recent publications detailing the thermal performance improvements possible utilizing thermoelectrically enhanced heat sinks and will address the TEC design and performance criteria. Reliability requirements for CPU applications will also be discussed along a reliability assessment of TECs operating in typical CPU cooling environments","PeriodicalId":346555,"journal":{"name":"2006 25th International Conference on Thermoelectrics","volume":"309 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133258792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15

P-type thermoelectric properties of sintered (NiyCo1-y)xFe3-xO4 with spinel structure 尖晶石结构烧结(NiyCo1-y)xFe3-xO4的p型热电性能

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331228

K. Yamamoto, K. Machida, Y. Oikawa, C. Kim, H. Ozaki

引用次数: 0

Thermoelectric oxides: important role of the transition metal spin states 热电氧化物:过渡金属自旋态的重要作用

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331260

A. Maignan, S. Hébert, D. Pelloquin, C. Martin, V. Pralong, V. Caignaert, Y. Klein

引用次数: 2

Fabrication of 500°C Class Thermoelectric Module and Evaluation of its High Temperature Stability 500°C级热电模块的制备及其高温稳定性评价

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331223

Y. Hori, T. Ito

引用次数: 7

Effect of carrier doping on the thermal conductivity of MNiSn based half-Heusler alloy 载流子掺杂对MNiSn基半heusler合金导热性能的影响

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331295

H. Muta, T. Kanemitsu, K. Kurosaki, S. Yamanaka

引用次数: 4

Thermoelectric Properties of Sb-doped Mg2Si0.5Sn0.5 sb掺杂Mg2Si0.5Sn0.5的热电性能

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331283

Y. Isoda, T. Nagai, H. Fujiu, Y. Imai, Y. Shinohara

{"title":"Thermoelectric Properties of Sb-doped Mg2Si0.5Sn0.5","authors":"Y. Isoda, T. Nagai, H. Fujiu, Y. Imai, Y. Shinohara","doi":"10.1109/ICT.2006.331283","DOIUrl":"https://doi.org/10.1109/ICT.2006.331283","url":null,"abstract":"Mg2Si1-xSnx systems, an ecologically friendly semiconductor, are the perspective material for thermoelectric generators at temperatures range from 500 to 800K. The single phase of this system at the compositions range of 0.4 < x < 0.6 has not been reported until now. The single phase of Mg2Si0.5Sn0.5 has been successfully obtained by a Liquid-Solid reaction method and Hot-pressing method. The minimum value of thermal conductivity was identified at around x=0.5. The high thermoelectric performance can be attained by the controlling of carrier concentration for Mg2Si0.5Sn0.5 . In this present work, the thermoelectric properties for the single-phase of Sb-doped Mg2Si0.5Sn0.5 were investigated. Seebeck coefficient alpha, electrical resistivity p and thermal conductivity k were measured from room temperature to 850K. The sign of alpha showed negative for all samples and has been n-type conduction. The temperature dependency of alpha for non-and 5000ppmSb-doped samples increased up to the maximum value of -440muVK -1 at 440K and -328muVK-1 at 578K, respectively. The alpha of 7500ppmSb sample were increased linearly with temperature. For non- and 5000ppmSb-sample, the temperature dependency of the p showed semiconducting properties. On the other hand, the sample of 7500ppmSb or more showed metallic behavior. The difference of this behavior is result of the conduction mechanism changed by the increase of carrier concentration. The carrier component of thermal conductivity was increased, while the phonon component of thermal conductivity was decreased slightly with carrier concentration. The dimensionless figure of merit was showed markedly enhanced the maximum value of ZT=1.2 for Sb doped 7500ppm at 620K","PeriodicalId":346555,"journal":{"name":"2006 25th International Conference on Thermoelectrics","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124100412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Thermoelectric property of Cu2O thin film deposited by Reactive Ion Plating method 反应离子镀法制备Cu2O薄膜的热电性能

2006 25th International Conference on Thermoelectrics Pub Date : 2006-08-01 DOI: 10.1109/ICT.2006.331276

H. Uchiyama, Y. Hasegawa, H. Morita, A. Kurokouchi, K. Wada, T. Komine

引用次数: 5