1994 Proceedings. 44th Electronic Components and Technology Conference最新文献_第7页

Reliable Au-Sn flip chip bonding on flexible prints 可靠的金-锡倒装芯片粘接柔性印刷品

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367522

A.F.J. Baggerman, M.J. Batenburg

引用次数: 28

Shrinkage matched cofireable thick film resistors for LTCC LTCC用收缩匹配共燃厚膜电阻器

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367611

S. Vesudevan, A. Shaikh

{"title":"Shrinkage matched cofireable thick film resistors for LTCC","authors":"S. Vesudevan, A. Shaikh","doi":"10.1109/ECTC.1994.367611","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367611","url":null,"abstract":"One of the major advantages of low temperature cofired ceramic (LTCC) technology is the ability to integrate passive components such as resistors, capacitors and inductors into a monolithic package. Due to materials interaction during processing, it is challenging to develop cofirable resistor, capacitor and inductor materials. This paper describes the development of compatible thick film resistors for Ferro's A6 tape system. The shrinkage behavior of the thick film resistors was matched to that of the tape material during firing. This shrinkage matching resulted in a distortion-free fired LTCC package with buried resistors. The resistor formulations were developed with sheet resistance in decade values starting from 10 /spl Omega///spl square/ up to 100 K/spl Omega///spl square/. The electrical properties of the resistors such as sheet resistance, TCR values, ESD stability and voltage handling were studied and found to be good. The microstructure development of the resistor during firing was studied using the scanning electron microscope (SEM). The electrical properties of the buried resistors such as sheet resistance, TCR, drift on ESD, and voltage handling capacity were studied for different buried levels of the resistor from the surface. The effect of firing time and temperatures and package design on the electrical properties of the resistors at different layers was also studied.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134013212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Environmental stress screening experiment using the Taguchi method 采用田口法进行环境应力筛选实验

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367501

D.E. Pachucki

{"title":"Environmental stress screening experiment using the Taguchi method","authors":"D.E. Pachucki","doi":"10.1109/ECTC.1994.367501","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367501","url":null,"abstract":"Sun Microsystems has strived to be a leader in the workstation market. To maintain and advance in this leadership role, manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are being pursued. The application of environmental stress screening is a method of achieving these improvements This experiment identifies the significance or relevancy of the selected stress screens for application in the PWA production process by using a statistically significant controlled method. The design of experiments statistical approach (analysis of variance), is applied, combined with the Taguchi two-level, seven-factor design method. This experiment concentrated on three stresses, (temperature cycling, random vibration, power cycling) and two diagnostic levels (a prom- based power-on self test-POST, and a functional test suite-Sundiag). Note that this is not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining is not included so as to reduce the complexity of the experiment-treatment factors and interactions.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132970720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Controlled collapse chip connection (C4)-an enabling technology 可控折叠芯片连接(C4)-使能技术

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367660

K. DeHaven, J. Dietz

引用次数: 64

Surface mount assembly failure statistics and failure free time 表面安装组件故障统计和故障无时间

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367548

J. Clech, D. Noctor, J. C. Manock, G.W. Lynott, F.E. Baders

{"title":"Surface mount assembly failure statistics and failure free time","authors":"J. Clech, D. Noctor, J. C. Manock, G.W. Lynott, F.E. Baders","doi":"10.1109/ECTC.1994.367548","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367548","url":null,"abstract":"This paper documents improved practices to analyze Surface Mount (SM) attachment failure statistics. These include the use of a failure free time metric obtained from three parameter Weibull analysis of solder joint fatigue data. Compared to two parameter Weibull and lognormal distributions, the three parameter Weibull consistently gives a better fit of early wear out failures across a large test database. The failure free time represents the minimum amount of time required for cracks to initiate and propagate through the weakest solder joints of a population. The failure free metric defines a warranty period during which thermo-mechanical fatigue failures of solder joints are not expected. The Comprehensive Surface Mount Reliability (CSMR) model has been extended by correlating failure free times scaled for the solder crack area to cyclic inelastic strain energy. The three parameter Weibull treatment of SM failure data provides more accurate reliability projections, potentially qualifying component assemblies that would be rated marginal or unacceptable based on more conservative two parameter Weibull or log-normal analysis.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132032713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 58

Wafer-level calibration of stress sensing test chips 应力传感测试芯片的晶圆级校准

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367498

J. Suhling, R. A. Cordes, Y. Kang, R. Jaeger

引用次数: 27

Transfer laminate circuit process for fine pitch wiring technology 传递层压电路工艺用于细间距布线技术

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367581

Y. Tsubomatsu, Y. Yoshidomi, H. Ohhata, T. Yamazaki, N. Fukutomi

引用次数: 5

So many electrons, so little time [Low Inductance Capacitor Arrays] 如此多的电子，如此少的时间[低电感电容器阵列]

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367626

J. Galvagni, S. Randall, P. Roughan, A. Templeton

引用次数: 1

Predicting printability of WSPs through rheological characterization 通过流变特性预测wsp的可印刷性

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367492

B. Carpenter, K. Pearsall, R. Raines

引用次数: 5

Role of materials evolution in VLSI plastic packages in improving reflow soldering performance VLSI塑料封装中材料演变对改善回流焊性能的作用

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367633

G. Lewis, G. Ganesan, H. Berg

引用次数: 13