1994 Proceedings. 44th Electronic Components and Technology Conference最新文献_第6页

Use of interconnect resistance as a reliability tool 使用互连电阻作为可靠性工具

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367553

J. Constable

引用次数: 9

Fatigue investigation of lap shear solder joints using resistance spectroscopy 用电阻谱法研究搭接剪切焊点的疲劳

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367552

C. Lizzul, J. Constable, G. Westby

引用次数: 11

An automated pick-place laser soldering process for electronics assembly 用于电子装配的自动拾取激光焊接工艺

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367496

P. Beckett, A. R. Fleming, R. J. Foster, J. M. Gilbert, A. V. Polijanczuk, D. G. Whitehead

引用次数: 2

Automated fiber pigtailing technology 自动化光纤尾纤技术

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367506

O. Strand, M. Lowry, S. Lu, D. C. Nelson, D. Nikkel, M. Pocha, K. Young

{"title":"Automated fiber pigtailing technology","authors":"O. Strand, M. Lowry, S. Lu, D. C. Nelson, D. Nikkel, M. Pocha, K. Young","doi":"10.1109/ECTC.1994.367506","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367506","url":null,"abstract":"The high cost of optoelectronic (OE) devices is due mainly to the labor-intensive packaging process. Manually pigtailing such devices as single-mode laser diodes and modulators is very time consuming with poor quality control. The Photonics Program and the Engineering Research Division at LLNL are addressing several issues associated with automatically packaging OE devices. A fully automated system must include high-precision fiber alignment, fiber attachment techniques, in-situ quality control, and parts handling and feeding. This paper will present on-going work at LLNL in the areas of automated fiber alignment and fiber attachment. For the fiber alignment, we are building an automated fiber pigtailing machine (AFPM) which combines computer vision and object recognition algorithms with active feedback to perform sub-micron alignments of single-mode fibers to modulators and laser diodes. We expect to perform sub-micron alignments in less than five minutes with this technology. For fiber attachment, we are building various geometries of silicon microbenches which include onboard heaters to solder metal-coated fibers and other components in place; these designs are completely compatible with an automated process of OE packaging.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128823059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM 基于铜聚酰亚胺MCM的320gb /s高速ATM交换系统硬件技术

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367582

N. Yamanaka, K. Endo, K. Genda, H. Fukuda, T. Kishimoto, S. Sasaki

引用次数: 49

Thermal conductivity of molding compounds for plastic packaging 塑料包装用成型化合物的导热性

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367636

P. Bujard, G. Kuhnlein, S. Ino, T. Shiobara

引用次数: 105

New type LOC adhesive tapes 新型LOC胶带

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367536

Y. Okugawa, T. Yoshida, T. Suzuki, H. Nakayoshi

{"title":"New type LOC adhesive tapes","authors":"Y. Okugawa, T. Yoshida, T. Suzuki, H. Nakayoshi","doi":"10.1109/ECTC.1994.367536","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367536","url":null,"abstract":"A new technology of the plastic package is offered in volume production of 16 Mb DRAM. This new package, called the LOC (Lead On Chip) structured package, is characterized by directly bonding the lead frame to the surface of the chip with a adhesive tape. This technology requires some new type packaging materials. Adhesive tape is the key material used in the LOC structure package. We developed the polyimide siloxane as the adhesive for the LOC adhesive tape. The polyimide siloxane has several advantages for use in the LOC adhesive tape, namely, small amount of outgassing volatiles, low content of ionic impurities, low moisture absorption and significant bendability. Moreover, the glass transition temperature of polyimide siloxane adhesive can be controlled over a wide range from 100 to 220/spl deg/C by controlling the content of the component especially the silicone. The single layer adhesive tape which had no base film and was constructed only of the polyimide siloxane was manufactured by the casting method. This single layer structure can enhance the advantage of adhesive polyimide siloxane and reduce the problems due to the interface of adhesive and base film. Actually, the single layer structured LOC tape has the outstanding advantage of low moisture absorption, so can solve the problem of delamination which occurs at the various interfaces of LOC tape and the other materials in the DRAM package.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"259 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116220929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

A small coaxial laser module for the Gb/s transmission-speed range 一个小型同轴激光模块，用于Gb/s传输速度范围

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367574

H. van Tongeren, J.W. Kokkelink, H. Tjassens

引用次数: 6

A formulation to optimize stress testing 优化压力测试的配方

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367502

H. Chan

{"title":"A formulation to optimize stress testing","authors":"H. Chan","doi":"10.1109/ECTC.1994.367502","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367502","url":null,"abstract":"Although hard-defects may be detectable in factory tests, weak products may exhibit failures or degrade only under certain stress conditions. Without stress testing, these weak products may often be shipped to customers causing early failures in the field. A candidate product for stress testing needs to get more business benefits to more than pay off the cost of stress testing. A business measure of the success of the stress testing program is the net benefit, which is the total benefit minus the total cost of the program. The optimum stress testing program maximizes this net benefit. A given unit of a product has a probability of encountering a maximum stress X during its product life. It also has a probability of possessing a product yield strength Y, which is the maximum stress the unit can survive without failure. While the strength distribution depends on the design and manufacture processes, the distribution of the maximum stress is determined by the customers' environment. A convenient picture is to construct the contour map of the joint probability distribution of X and Y. In this contour map, a unit falling in the YX region will not result in field failure. The effects of stress testing at a given maximum stress level, X/sup ST/, are shown by a dividing line on the product strength into stress test failure and stress test pass. The units in the contour map are then divided into four regions by the Y=X line and the X/sup ST/ line. The cost and benefits may now be evaluated for each region. Now the value of X/sup ST/ is a free parameter that determines the relative size of each region. The second free parameter is the fraction of units going through stress testing. These two parameters may be adjusted to maximize the net benefit of the stress testing program.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"14 7","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120904360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

EDQUAD-an enhanced performance plastic package edquad -一种增强性能的塑料包装

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367650

M. Karnezos, S. Chang, N. Chidambaram, C. Tak, Ah San Kyu, E. Combs

引用次数: 1