EDQUAD-an enhanced performance plastic package

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI:10.1109/ECTC.1994.367650

M. Karnezos, S. Chang, N. Chidambaram, C. Tak, Ah San Kyu, E. Combs

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引用次数: 1

Abstract

EDQUAD represents a new family of packages designed for applications that require enhanced thermal and electrical performance not provided by the standard plastic packages. It includes standard Metric QFP, 1.4 mm thick TQFP and PLCC packages ranging from 7 mm-40 mm bodies and leadcounts in the 20-304 range. The packages are designed with an integral heatspreader exposed to air, used as a ground plane as well. The die is attached directly to the heatspreader to minimize the thermal resistance. The power and ground pads of the die can be wire bonded directly on separate internal rings to minimize the inductance. Measurements on a 28/spl times/28 mm, 208 lead EDQUAD show that the power dissipation is doubled to over 4 Watt/chip compared to an equivalent plastic QFP and, with an external heatsink attached, the package can dissipate up to 10 Watt/chip for most applications. The lead impedance can be controlled to 50 Ohm and the inductance of ground/power connections is significantly reduced. The package reliability meets the commonly accepted standards.<>

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edquad -一种增强性能的塑料包装

EDQUAD代表了一个新的包装系列，专为标准塑料包装无法提供的需要增强热和电气性能的应用而设计。它包括标准公制QFP, 1.4 mm厚TQFP和PLCC封装，从7 mm-40 mm的主体和引线数在20-304范围内。这些封装设计了一个暴露在空气中的整体散热器，也用作接地面。模具是直接连接到散热器，以尽量减少热阻。模具的电源和接地垫可以直接在单独的内部环上进行钢丝粘合，以尽量减少电感。对28/spl倍/28 mm, 208引脚EDQUAD的测量表明，与等效的塑料QFP相比，功耗增加了一倍，超过4瓦特/芯片，并且在附加外部散热器的情况下，该封装可以在大多数应用中消耗高达10瓦特/芯片。引线阻抗可控制在50欧姆，接地/电源连接电感显著降低。封装可靠性符合通用标准

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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1994 Proceedings. 44th Electronic Components and Technology Conference

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