Surface mount assembly failure statistics and failure free time

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI:10.1109/ECTC.1994.367548

J. Clech, D. Noctor, J. C. Manock, G.W. Lynott, F.E. Baders

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引用次数: 58

Abstract

This paper documents improved practices to analyze Surface Mount (SM) attachment failure statistics. These include the use of a failure free time metric obtained from three parameter Weibull analysis of solder joint fatigue data. Compared to two parameter Weibull and lognormal distributions, the three parameter Weibull consistently gives a better fit of early wear out failures across a large test database. The failure free time represents the minimum amount of time required for cracks to initiate and propagate through the weakest solder joints of a population. The failure free metric defines a warranty period during which thermo-mechanical fatigue failures of solder joints are not expected. The Comprehensive Surface Mount Reliability (CSMR) model has been extended by correlating failure free times scaled for the solder crack area to cyclic inelastic strain energy. The three parameter Weibull treatment of SM failure data provides more accurate reliability projections, potentially qualifying component assemblies that would be rated marginal or unacceptable based on more conservative two parameter Weibull or log-normal analysis.<>

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表面安装组件故障统计和故障无时间

本文记录了分析表面贴装(SM)附件失效统计的改进做法。其中包括使用从焊点疲劳数据的三参数威布尔分析中获得的无失效时间度量。与双参数威布尔分布和对数正态分布相比，三参数威布尔分布始终能够更好地拟合大型测试数据库中的早期磨损故障。无失效时间是指裂纹通过最弱的焊点产生和扩展所需的最短时间。无故障度量标准定义了一个保修期，在此期间焊点不会出现热机械疲劳故障。通过将焊接裂纹区域的无失效时间与循环非弹性应变能相关联，扩展了综合表面贴装可靠性模型。SM故障数据的三参数威布尔处理提供了更准确的可靠性预测，潜在的合格组件将根据更保守的两参数威布尔或对数正态分析被评为边缘或不可接受。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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1994 Proceedings. 44th Electronic Components and Technology Conference

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