Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176最新文献_第7页

Experimental evaluation of anodic bonding process using Taguchi method for maximum interfacial fracture toughness 用田口法评价阳极结合过程中最大界面断裂韧性

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659775

J. Go, Young‐Ho Cho

{"title":"Experimental evaluation of anodic bonding process using Taguchi method for maximum interfacial fracture toughness","authors":"J. Go, Young‐Ho Cho","doi":"10.1109/MEMSYS.1998.659775","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659775","url":null,"abstract":"Anodic bonding quality has been quantitatively evaluated in terms of interfacial fracture toughness. In the theoretical analysis, the interfacial fracture toughness at the interface of an anodically bonded two dissimilar material layers has been analyzed and related with energy release rate. The energy release rate at an anodically bonded silicon-to-glass interface has been investigated for 81 different bonding conditions: three conditions for each of the four parameters, including bonding load, bonding temperature, anodic potential and bonding time. Taguchi method has been used to reduce the number of experiments required for the bonding quality evaluation, thus resulting in 9 experiment cases out of 81 possible cases. Interfacial fracture toughness has been measured from the specially designed blade test specimen, where an 80 /spl mu/m-thick aluminum blade is pre-inserted and bonded between the 535 /spl mu/m-thick silicon plate and the 517 /spl mu/m-thick Pyrex #7740 glass. The process condition, resulting in the maximum energy release rate, has been found. The influence of bonding process conditions on the interfacial fracture toughness has been quantified and discussed. It is found that the bonding temperature is the most dominant factor influencing the anodic bonding strength. Other process parameters, such as bonding load, anodic potential and bonding time, contribute weakly to the bonding strength, although they influence the speed and area of anodic bonding.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116057227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

A new basic technology for magnetic micro-actuators 磁性微执行器的一种新的基础技术

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659744

E. Fullin, J. Gobet, H. Tilmans, J. Bergqvist

引用次数: 45

Ideal adiabatic structure LiTaO/sub 3/ pyroelectric microsensor fabricated by sandblasting technique 喷砂技术制备的理想绝热结构LiTaO/ sub3 /热释电微传感器

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659771

T. Matsushima, H. Yagyu, Y. Matsumura, M. Ikari, K. Horiuchi

引用次数: 7

Portable micro liquid dosing system 便携式微液加药系统

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659813

R. Rossberg, H. Sandmaier, S. Buttgenbach

引用次数: 3

Capacitive sensing type surface micromachined silicon accelerometer with a stiffness tuning capability 具有刚度调谐能力的电容式表面微机械硅加速度计

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659832

I. Park, C.W. Lee, H. Jang, Y. Oh, B. Ha

{"title":"Capacitive sensing type surface micromachined silicon accelerometer with a stiffness tuning capability","authors":"I. Park, C.W. Lee, H. Jang, Y. Oh, B. Ha","doi":"10.1109/MEMSYS.1998.659832","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659832","url":null,"abstract":"A novel concept surface micromachined silicon accelerometer which has a stiffness tuning capability to improve the sensor resolution is developed. The stiffness of the sensor structure is reduced by providing an electrostatic negative stiffness. By adopting the stiffness tuning, the initially stiff structure guarantees the stability of the fabrication and the reduced stiffness only along the sensing direction produces the improved resolution. In particular, one of the improved structure of this accelerometer is a branched comb-finger that senses the relative position between the mass and the electrode itself. Maintaining the same capacitance variation, it is able to achieve a larger initial gap between the mass and the electrode which fences the clash problem. The accelerometer has an active size of 650/spl times/530 /spl mu/m/sup 2/, a thickness of polysilicon structure of 7 /spl mu/m, and a proof mass of about 1 /spl mu/g. Experimental results shows that the equivalent noise level of the accelerometer is improved by 30 dB through the stiffness tuning. The accelerometer has a bandwidth of 350 Hz, a linearity of 0.3% FS, and a sensing range of 50 g.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128555086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 23

Fabrication and surface modification process for micro gas bearing 微型气体轴承的制造及表面改性工艺

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659769

H. Ota, K. Matsukawa, M. Takeda, T. Ohara, H. Narumiya

{"title":"Fabrication and surface modification process for micro gas bearing","authors":"H. Ota, K. Matsukawa, M. Takeda, T. Ohara, H. Narumiya","doi":"10.1109/MEMSYS.1998.659769","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659769","url":null,"abstract":"A hydrodynamic gas bearing able to reduce power losses is selected, and the possibility of reducing its size is examined. The first consideration is how laser-assisted etching can be employed to form spiral grooves on the cylindrical shaft. In a hydrodynamic gas bearing, the shaft and bearing come into contact with each other when the actuator is started and stopped. It is thus necessary to reduce the frictional torque during starting and to ensure a satisfactory level of wear resistance. Next, the grooved shaft surface is modified by ion mixing. Its sliding characteristics are investigated to assess the reduction in friction and improvement in wear resistance. This reveals that it is possible to form a spiral grove 6 /spl mu/m in width and 2 /spl mu/m in depth on a 0.5-mm-diameter shaft, It is also established that, by forming a CrN film on the shaft, it is possible to achieve a friction coefficient of approx. 0.2, representing a satisfactory wear resistance. It is thus concluded that the hydrodynamic gas bearing selected can be used as a micro-actuator component.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"550 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117051031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Polymer actuator driven by ion current at low voltage, applied to catheter system 低电压离子驱动聚合物作动器，应用于导管系统

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659745

S. Sewa, K. Onishi, K. Asaka, N. Fujiwara, K. Oguro

引用次数: 48

High precision electrostatic actuator with novel electrode design 高精度静电致动器，新型电极设计

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659791

A. Yamamoto, T. Nino, T. Higuchi

引用次数: 4

Annular shutter mirror for a digital video disk pick-up module 环形快门镜用于数字视频磁盘拾取模块

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659802

J.I. Bu, J. Hwang, J.B. Lee, G. Kim, K.Y. Yang, S. Noh

引用次数: 3

Silicon micromachined mass filter for a low power, low cost quadrupole mass spectrometer 用于低功耗、低成本四极质谱仪的硅微机械质量过滤器

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659797

J.J. Tullstall, S. Taylor, R. Syms, T. Tate, M.M. Ahmad

引用次数: 12