{"title":"Techno-economic analysis of competing IC packaging protocols","authors":"T. Hannibal, M. Al Capote","doi":"10.1109/IEMT.2002.1032794","DOIUrl":"https://doi.org/10.1109/IEMT.2002.1032794","url":null,"abstract":"Comparing alternative packaging technologies is a complex task, involving prioritization of cost, performance, and business strategy issues. This paper focuses on one portion of the decision-making equation - cost. Using a tool for assessing the manufacturing costs of electronic packaging, cost outlook scenarios for three advanced packaging technologies are analyzed and compared. The technologies are flip-chip-on-board (FCOB), wafer-scale chip-scale packaging (WSCSP), and a new wafer-scale-applied underfill technology called wafer pre-encapsulation. Using Technical Cost Modeling the paper tracks and examines the costs for the three implementations, starting from wafer-level through IC packaging to board placement. Manufacturing cost sensitivity is examined for a variety of manufacturing conditions and results are presented.","PeriodicalId":340284,"journal":{"name":"27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123737699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Balasubramanian, J. Arbulich, J. Craik, K. Srihari
{"title":"Decision support for test and debug areas in RF manufacturing","authors":"S. Balasubramanian, J. Arbulich, J. Craik, K. Srihari","doi":"10.1109/IEMT.2002.1032740","DOIUrl":"https://doi.org/10.1109/IEMT.2002.1032740","url":null,"abstract":"The last few years have seen the rapid growth of products in the wireless segment. Electronic manufacturing services (EMS) providers have evolved to offer testing and box build services to their customers. Data management is vital in the test, debug and rework areas. Technicians who debug the board provide feedback vital for process and even design improvements. The DebugTech system was developed to provide the technicians and engineers with a real-time software based decision support system. The supplementary objectives included knowledge sharing, elimination of paper travelers, making available real-time test data to technicians and engineers. A 'script' (TestAnalyzer) was written to extract data directly from the test server and this data was logged into a database at regular intervals. At the time of debug, this information was displayed to the operators who would then proceed to debug the assembly and log the defects into the database. This information was summarized in a 'defect tree' that was used by the technicians as a decision support feature for faster debugging. The TestAnalyzer and DebugTech systems helped in the elimination of paper travellers, improving productivity and second pass yield at the test stations.","PeriodicalId":340284,"journal":{"name":"27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128250600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}