27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium最新文献

筛选
英文 中文
Techno-economic analysis of competing IC packaging protocols 竞争IC封装协议的技术经济分析
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI: 10.1109/IEMT.2002.1032794
T. Hannibal, M. Al Capote
{"title":"Techno-economic analysis of competing IC packaging protocols","authors":"T. Hannibal, M. Al Capote","doi":"10.1109/IEMT.2002.1032794","DOIUrl":"https://doi.org/10.1109/IEMT.2002.1032794","url":null,"abstract":"Comparing alternative packaging technologies is a complex task, involving prioritization of cost, performance, and business strategy issues. This paper focuses on one portion of the decision-making equation - cost. Using a tool for assessing the manufacturing costs of electronic packaging, cost outlook scenarios for three advanced packaging technologies are analyzed and compared. The technologies are flip-chip-on-board (FCOB), wafer-scale chip-scale packaging (WSCSP), and a new wafer-scale-applied underfill technology called wafer pre-encapsulation. Using Technical Cost Modeling the paper tracks and examines the costs for the three implementations, starting from wafer-level through IC packaging to board placement. Manufacturing cost sensitivity is examined for a variety of manufacturing conditions and results are presented.","PeriodicalId":340284,"journal":{"name":"27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123737699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Decision support for test and debug areas in RF manufacturing 为射频制造测试和调试提供决策支持
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI: 10.1109/IEMT.2002.1032740
S. Balasubramanian, J. Arbulich, J. Craik, K. Srihari
{"title":"Decision support for test and debug areas in RF manufacturing","authors":"S. Balasubramanian, J. Arbulich, J. Craik, K. Srihari","doi":"10.1109/IEMT.2002.1032740","DOIUrl":"https://doi.org/10.1109/IEMT.2002.1032740","url":null,"abstract":"The last few years have seen the rapid growth of products in the wireless segment. Electronic manufacturing services (EMS) providers have evolved to offer testing and box build services to their customers. Data management is vital in the test, debug and rework areas. Technicians who debug the board provide feedback vital for process and even design improvements. The DebugTech system was developed to provide the technicians and engineers with a real-time software based decision support system. The supplementary objectives included knowledge sharing, elimination of paper travelers, making available real-time test data to technicians and engineers. A 'script' (TestAnalyzer) was written to extract data directly from the test server and this data was logged into a database at regular intervals. At the time of debug, this information was displayed to the operators who would then proceed to debug the assembly and log the defects into the database. This information was summarized in a 'defect tree' that was used by the technicians as a decision support feature for faster debugging. The TestAnalyzer and DebugTech systems helped in the elimination of paper travellers, improving productivity and second pass yield at the test stations.","PeriodicalId":340284,"journal":{"name":"27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128250600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信