2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)最新文献_第9页

Stress analysis and design optimization of a wafer-level CSP by FEM simulations and experiments 基于有限元模拟和实验的晶圆级CSP应力分析与设计优化

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927810

S. Rzepka, E. Hofer, J. Simon, E. Meusel, H. Reichl

引用次数: 23

Study on mobility of water and polymer chain in epoxy for microelectronic applications 微电子用环氧树脂中水和聚合物链的迁移性研究

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927710

S. Luo, J. Leisen, C. Wong

{"title":"Study on mobility of water and polymer chain in epoxy for microelectronic applications","authors":"S. Luo, J. Leisen, C. Wong","doi":"10.1109/ECTC.2001.927710","DOIUrl":"https://doi.org/10.1109/ECTC.2001.927710","url":null,"abstract":"This paper presents a study on mobility of water and polymer chain in epoxy materials. Solid state nuclear magnetic resonance (NMR) techniques (both /sup 1/H NMR and /sup 2/H NMR) were used to study the binding states of water within two epoxy formulations along with the possible plasticizing effects of moisture affecting the mobility of polymer chains. Absorbed water reduces the glass transition temperature of polymeric material. However, the presence of moisture has no significant effect on the polymer chain mobility at temperatures below the reduced glass transition temperature. Water in an epoxy in its rubbery state above the glass transition has a much higher mobility than in a polymer in its glassy state. The mobility of water absorbed by a polymer in its rubbery state is similar to that of pure water. The translational mobility of water within epoxies was studied by measuring the diffusion coefficient of water in epoxies through the water uptake. Higher rotational mobilities of water and polymer chains in the rubbery state lead to a significant increase of the water diffusion coefficient in the rubbery state polymer matrix as compared to a polymer in its glassy state.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122154556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Creep behavior of a molding compound and its effect on packaging process stresses 一种成型化合物的蠕变行为及其对包装过程应力的影响

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927907

M. S. Kiasat, G.Q. Zhang, L. Ernst, G. Wisse

{"title":"Creep behavior of a molding compound and its effect on packaging process stresses","authors":"M. S. Kiasat, G.Q. Zhang, L. Ernst, G. Wisse","doi":"10.1109/ECTC.2001.927907","DOIUrl":"https://doi.org/10.1109/ECTC.2001.927907","url":null,"abstract":"Critically high thermal stresses are induced in the constituents of an electronic package during packaging processes, due to the mismatch of the thermal expansion/contraction of the constituents. These stresses may cause cracks in the silicon die in some package configurations. The temperature-dependent creep behavior of an epoxy molding (packaging) compound is studied here in order to analyze the stresses induced in the packaging processes reliably. Isothermal one-day creep experiments are performed at different temperatures ranging from 24.5/spl deg/C to 175/spl deg/C (above the glass transition temperature of the compound). Significant creep behavior of the epoxy compound is observed even at room temperature. The tensile creep compliance and the increasing time-dependent Poisson's ratio of the material at different temperatures are successfully used to construct viscoelastic master curves for these material properties. It is observed that the shift factor of the compound cannot be fitted by the well-known WLF equation. Further, the viscoelastic model of the material is implemented in a finite element program and verified by means of the results of a creep test that is performed at a non-isothermal condition. Moreover, the effect of the creep behavior of the molding compound on the packaging process stress field and its evolution is investigated. Finally substantial cost saving is realized by package design optimization based on the reliable prediction of the packaging process stresses.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125488470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Improved VCSEL structures for 10 gigabit-Ethernet and next generation optical-integrated PC-boards 改进了用于10千兆以太网和下一代光集成pc板的VCSEL结构

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927657

F. Mederer, R. Jager, J. Joos, M. Kicherer, R. King, R. Michalzik, M. Riedl, H. Unold, K. Ebeling, S. Lehmacher, B. Wittmann, A. Neyer

引用次数: 9

High speed multichip modules using flip chip mount technology for 10 Gbps optical transmission systems 采用倒装芯片安装技术的高速多芯片模块，用于10gbps光传输系统

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927929

K. Takahashi, T. Ikeuchi, T. Tsuda, T. Chuzenji

引用次数: 2

Characterization of lead-free solders and under bump metallurgies for flip-chip package 倒装芯片封装用无铅焊料和凹凸冶金的特性

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927767

Jong-Kai Lin, A. de Silva, D. Frear, Yifan Guo, Jin-wook Jang, Li Li, D. Mitchell, B. Yeung, C. Zhang

引用次数: 48

Radiative coupling in BGA packaging for mixed-signal and high-speed digital 混合信号和高速数字BGA封装中的辐射耦合

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927775

W. Woods, E. Diaz-Alvarez, J. Krusius

引用次数: 3

The impact of split power planes on package performance 分离电源平面对封装性能的影响

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927963

J.R. Miller

{"title":"The impact of split power planes on package performance","authors":"J.R. Miller","doi":"10.1109/ECTC.2001.927963","DOIUrl":"https://doi.org/10.1109/ECTC.2001.927963","url":null,"abstract":"The purpose of this study is to assess the impact of the split power planes on package performance. A non-custom package with 16 power plane splits is studied from the perspective of plane noise, trace impedance and trace crosstalk. 2D and 3D simulations are performed on the package using selected sections of the package. The plane noise is found not to be significant when there is either low or high driver transient current demand. In the low current demand case, current is primarily confined to the region of the plane beneath the trace and the transient plane voltage is small. In the high current demand case, guidelines are given to minimize the impact of the split planes. Among these guidelines, a minimum trace to plane split distance should be maintained such that the effective inductance is not increased. 2D simulations are performed to examine the impact of the split plane on the signal trace impedance. Signal trace impedance is found to vary depending on its proximity to the plane split. The impact of the plane splits on the signal trace crosstalk is investigated. Capacitive coupling between traces is reduced by distancing the signal trace from the plane split. 3D simulations using a subsection of the multiple split plane package are performed. Plots showing the near end and far end crosstalk for five traces distributed about a plane split are included. Crosstalk is found not to increase for traces bordering the plane split as long as a minimum trace to plane split distance is maintained.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116460836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Impact of JEDEC test conditions on new-generation package reliability JEDEC测试条件对新一代封装可靠性的影响

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927701

L. Mercado, B. Chavez

{"title":"Impact of JEDEC test conditions on new-generation package reliability","authors":"L. Mercado, B. Chavez","doi":"10.1109/ECTC.2001.927701","DOIUrl":"https://doi.org/10.1109/ECTC.2001.927701","url":null,"abstract":"JEDEC Standard has been widely used in the electronic industry to qualify package performance under temperature and humidity conditions. Demands for high packaging density of low pin-count packages have driven the development of a new generation of packages to replace the Quad Flat Packages (QFP). Package size has been reduced drastically. Package reflow temperature has been considerably higher due to the application of lead-free solder. Consequently, the JEDEC standard testing on these packages needs to be re-evaluated. In this paper, moisture diffusion analysis, heat transfer analysis, as well as an interface fracture mechanics-based thermomechanical analysis have been conducted. The impact of different reflow profiles was investigated. Due to the smaller package size and higher reflow temperature, the new packages are more sensitive to the reflow parameters such as peak temperature and cooling rate. For the reliability testing of the new-generation packages, modification of the JEDEC standards may be necessary to ensure that these packages are not subjected to more stringent criteria than their previous counterparts.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131153033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Evaluation and optimization of package processing, design, and reliability through solder joint profile prediction 通过焊点轮廓预测对封装工艺、设计和可靠性进行评估和优化

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI: 10.1109/ECTC.2001.927906

B. Yeung, T. Lee

引用次数: 5