采用倒装芯片安装技术的高速多芯片模块，用于10gbps光传输系统

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI:10.1109/ECTC.2001.927929

K. Takahashi, T. Ikeuchi, T. Tsuda, T. Chuzenji

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引用次数: 2

摘要

介绍了用于10gbps光传输系统的小型多芯片模块(mcm)。我们开发了三种mcm。mcm包括我们采用SiGe双极工艺新开发的lsi。每种MCM都由带有扁平引线框架的氧化铝基板、采用倒装封装技术安装的lsi、无源SMT组件和散热器组成。为了实现mcm的宽带特性，在mcm上的传输线采用接地共面波导设计。散热器通过导热硅酮化合物附着在每个LSI的背面，用于高效冷却。这些mcm已应用于我们的10gbps光收发模块在波分复用(WDM)系统中，并实现了1.6 Tbps (10gbps /spl次/160通道)的传输容量。

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High speed multichip modules using flip chip mount technology for 10 Gbps optical transmission systems

This Paper describes small-sized multichip modules (MCMs) for 10 Gbps optical transmission systems. We have developed three kinds of MCMs. MCMs include LSIs we have newly developed by employing SiGe bipolar process. Each kind of MCM is composed of an alumina substrate with flat lead frames, LSIs mounted by flip chip mount technology, passive SMT components, and a heat spreader. To achieve wide-band characteristics of MCMs, the grounded coplanar waveguide design is adopted for the transmission lines on MCMs. The heat spreader is attached to the backside of each LSI through thermally conductive silicone compound for highly effective cooling. These MCMs have been applied for our 10 Gbps optical transmitter and receiver modules in the wavelength division multiplexing (WDM) system, and achieved 1.6 Tbps (10 Gbps/spl times/160 channels) of transmission capacity.

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来源期刊

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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