Improved VCSEL structures for 10 gigabit-Ethernet and next generation optical-integrated PC-boards

Abstract

We have investigated direct optical interconnection between processor ICs on chip-to-chip level using VCSELs and 2-D 17 cm long, 120 /spl mu/m diameter step-index polymer optical fiber (POF) bundles. Their bandwidth-length-product of 2 GHz/spl middot/m makes them well suited for low-cost high-speed parallel optical interconnects on a board level. We have demonstrated 10 Gbit/s PRBS NRZ data transmission over four channels of a POF array.