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Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)最新文献

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Design for the Environment at Texas Instruments' Defense Systems and Electronics Group 德州仪器国防系统和电子集团的环境设计
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514948
D.A. Ufford
{"title":"Design for the Environment at Texas Instruments' Defense Systems and Electronics Group","authors":"D.A. Ufford","doi":"10.1109/ISEE.1995.514948","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514948","url":null,"abstract":"Texas Instruments' Defense Systems and Electronics Group (TI-DSEG) is executing a Design for the Environment (DFE) initiative in order to institutionalize the systematic consideration of life cycle environmental concerns and decision-making in its product development and management process. This initiative is part of TI-DSEG's continuing commitment to proactive, \"source reduction\" practices as the most effective method of pollution prevention.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"182 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121021747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The design of new, Pb-free solder alloys with improved properties 新型无铅钎料合金的设计，性能得到改善
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514970
M. Mccormack, S. Jin, G. Kammlott
{"title":"The design of new, Pb-free solder alloys with improved properties","authors":"M. Mccormack, S. Jin, G. Kammlott","doi":"10.1109/ISEE.1995.514970","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514970","url":null,"abstract":"The goal of the research presented in this paper is to identify Pb-free alloys with melting temperatures close to or lower than that of the near-eutectic 40Pb-60Sn solder (melting point of 183/spl deg/C), and that with the best mechanical properties. We have obtained substantially improved mechanical properties through manipulation of alloy microstructures. The following three alloys with superior mechanical properties are discussed: i) Sn-3.5%Ag-1%Zn-0.5%Cu with a melting point of /spl sim/216/spl deg/C, ii) Sn-8%Zn-5%In-(0.1-0.5%)Ag with a melting point of /spl sim/187/spl deg/C, and iii) 54.5%Bi-45%Sn-0.5%Ag with a melting point of /spl sim/140/spl deg/C.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121635397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Considering remanufacture and other end-of-life options in selection of fastening and joining methods 在选择紧固和连接方法时考虑再制造和其他寿命终止选项
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514953
L. Shu, W. Flowers
{"title":"Considering remanufacture and other end-of-life options in selection of fastening and joining methods","authors":"L. Shu, W. Flowers","doi":"10.1109/ISEE.1995.514953","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514953","url":null,"abstract":"This paper emphasizes remanufacturing as an end-of-life option and the effects of fastening and joining methods on remanufacture. Three case studies describe examples of fastening and joining that facilitate assembly and recycling but impede remanufacturing. To illustrate the impact of fastening choices on remanufacture relative to other life-cycle concerns, the development of a computer tool that estimates the effects of fastening and joining choices on manufacture, assembly, maintenance, remanufacture and recycling is in progress. The current implementation of the tool is described and used to compare the fastening methods that are used in the case studies with alternative fastening methods. These comparisons suggest that elements of fastening methods that are prone to failure be made separable from the remainder of the part.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131144762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 52
Globalization of and "Guiding Principles" for environmental legislation and public policy development 环境立法和公共政策发展的全球化和“指导原则”
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514979
C. Bast, C. Johnson, T. Korpalski, J. Vanderstraeten
{"title":"Globalization of and \"Guiding Principles\" for environmental legislation and public policy development","authors":"C. Bast, C. Johnson, T. Korpalski, J. Vanderstraeten","doi":"10.1109/ISEE.1995.514979","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514979","url":null,"abstract":"This paper outlines: (1) governments' increasing use of \"market-driven\" environmental policies directed at the entire product \"life-cycle\" and their much more far-reaching, worldwide business effects, (2) why, as a result, multinational companies like Hewlett-Packard need to contribute to the shaping of environmental public policy in their major worldwide markets, and, (3) some suggested guiding principles for assuring the effectiveness of these emerging policies from the perspectives of all stakeholders, including government, environmental advocacy groups and affected businesses.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134464283","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Process design and optimization for environmentally conscious printed circuit board assemblies 环保印刷电路板组件的工艺设计和优化
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514957
G. Rupp, S. Graham
{"title":"Process design and optimization for environmentally conscious printed circuit board assemblies","authors":"G. Rupp, S. Graham","doi":"10.1109/ISEE.1995.514957","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514957","url":null,"abstract":"This paper discusses an engineering approach to the qualification of water based flux as a substitute for conventional alcohol based volatile organic compound (VOC) flux and utilization of \"No-Clean\" soldering material, virtually eliminating saponified waste water effluent and VOC emissions typically associated with surface mount technology (SMT) printed circuit board assembly (PCBA). The information and experiences are provided through a discussion of critical equipment, material requirements and evaluations, as well as the selection methodology and criteria.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115029548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Developing an integrated environmental performance measurement system 建立综合的环境绩效测量系统
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514945
K. Weitz, K.S. Corbet
{"title":"Developing an integrated environmental performance measurement system","authors":"K. Weitz, K.S. Corbet","doi":"10.1109/ISEE.1995.514945","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514945","url":null,"abstract":"Developing a system to measure corporate environmental performance is a challenge that demands time and careful consideration. As with quality management, however, devoting resources to managing environmental improvement is almost always cost effective. This is particularly the case when nonquantifiable measures are included in the measurement taxonomy. Although no manager may be able to measure absolutely the impact of public image, reduced potential liabilities, or policy agenda-setting, neither will any one deny their real and consequential value to the company.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116668063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Economic input/output analysis to aid life cycle assessment of electronics products 经济投入/产出分析，以协助电子产品生命周期评估
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514989
E. Cobas, Chris Hendrickson, L. Lave, F. McMichael
{"title":"Economic input/output analysis to aid life cycle assessment of electronics products","authors":"E. Cobas, Chris Hendrickson, L. Lave, F. McMichael","doi":"10.1109/ISEE.1995.514989","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514989","url":null,"abstract":"Economic input/output (EIO) analysis is a well established modelling framework for tracing the flows of inputs and outputs throughout an economy. It can aid life cycle analysis by providing a comprehensive framework for analyzing environmental costs, thereby eliminating the ad hoc boundary assumptions required in conventional life cycle analysis. We illustrate use of the EIO method with applications to electronics manufacture, including Household Refrigerators and Freezers (SIG 3632), Computers and Office Equipment (SIG 357), and Household Audio and Video Equipment (SIG 3651). The EIO provides an estimate of all direct and indirect pollution discharges associated with manufacture of these products. Our EIO model is based upon the Department of Commerce 480/spl times/480 commodity sector data and a variety of environmental impact indices, including the toxic release inventory (TRI) and energy use.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115525885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 32
New high conductivity lead (Pb)-free conducting adhesives 新型高导电性无铅导电胶
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514971
S.K. Kang, T. Graham, S. Purushothaman, J. Roldan, R. Saraf
{"title":"New high conductivity lead (Pb)-free conducting adhesives","authors":"S.K. Kang, T. Graham, S. Purushothaman, J. Roldan, R. Saraf","doi":"10.1109/ISEE.1995.514971","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514971","url":null,"abstract":"Solder interconnection technology is currently in need of alternatives to address environmental issues associated with lead (Pb) abatement, and elimination of fluxes and flux cleaning solvents, and technical challenges related to extending to fine pitch assembly. Electrically conducting adhesive technology is one of the alternatives being actively considered in this context. The most common conductive adhesive used today is an epoxy resin filled with fine silver particles. Silver particles provide electrical conduction, while epoxy provides adhesive bonding of the components to a substrate. This material has several limitations such as low electrical conductivity, low joint strength, increase in contact resistance upon thermal cycling, and silver migration. In order to overcome these limitations, a new formulation is proposed based on alternative Pb-free conducting filler powders and tailored polymer resins. This new material provides a metallurgical bonding as well as polymer adhesive bonding leading to an increase in joint strength and in electrical conductivity. Several potential applications of these adhesive materials such as glass-to-board connection in LCD packaging, SMT package assembly to PCB, and direct chip attachment to a high density card are discussed.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123447154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Government/industry cooperation in promoting the life-cycle product planning in Southeast Asian countries 政府/行业合作促进东南亚国家产品生命周期规划
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514941
R. A. Blelloch
{"title":"Government/industry cooperation in promoting the life-cycle product planning in Southeast Asian countries","authors":"R. A. Blelloch","doi":"10.1109/ISEE.1995.514941","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514941","url":null,"abstract":"Through the United States-Asia Environmental Partnership (US-AEP) and its ASEAN Environmental Improvement Project (ELF) element, the US Government can assist the US electronics industry to promote the use of life-cycle product planning among its suppliers in Southeast Asia. This paper provides some background and some ideas on how cooperation could develop.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"145 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123824798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation and qualification of environmentally conscious manufacturing processes for commercial and military applications 对商业和军事应用的具有环保意识的制造过程进行评价和鉴定
Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514975
D.J. Anderson, R. Cranwell, R. Iman, P.D. Van Buren
{"title":"Evaluation and qualification of environmentally conscious manufacturing processes for commercial and military applications","authors":"D.J. Anderson, R. Cranwell, R. Iman, P.D. Van Buren","doi":"10.1109/ISEE.1995.514975","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514975","url":null,"abstract":"Environmental regulations are encouraging the development of new environmentally conscious manufacturing (ECM) processes. However, the quality and reliability of these processes and hardware produced must be understood prior to implementing these new technologies in factories. Furthermore, military hardware fabrication is governed by standards and specifications that frequently mandate the use of older, less environmentally friendly processes or materials, or prohibit the use of new ECM processes without advance military approval. Sandia National Laboratories, with industrial and military partners, have developed methodologies for evaluating and qualifying new ECM processes for military and commercial applications, and have piloted these methodologies in qualifying new, low-residue soldering technologies and materials.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129671707","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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