环保印刷电路板组件的工艺设计和优化

G. Rupp, S. Graham
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引用次数: 3

摘要

本文讨论了一种工程方法,以确定水基焊剂作为传统醇基挥发性有机化合物(VOC)焊剂的替代品,并利用“无清洁”焊接材料,几乎消除了与表面贴装技术(SMT)印刷电路板组装(PCBA)相关的皂化废水排放和VOC排放。通过对关键设备、材料要求和评价以及选择方法和标准的讨论提供信息和经验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Process design and optimization for environmentally conscious printed circuit board assemblies
This paper discusses an engineering approach to the qualification of water based flux as a substitute for conventional alcohol based volatile organic compound (VOC) flux and utilization of "No-Clean" soldering material, virtually eliminating saponified waste water effluent and VOC emissions typically associated with surface mount technology (SMT) printed circuit board assembly (PCBA). The information and experiences are provided through a discussion of critical equipment, material requirements and evaluations, as well as the selection methodology and criteria.
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