Process design and optimization for environmentally conscious printed circuit board assemblies

Abstract

This paper discusses an engineering approach to the qualification of water based flux as a substitute for conventional alcohol based volatile organic compound (VOC) flux and utilization of "No-Clean" soldering material, virtually eliminating saponified waste water effluent and VOC emissions typically associated with surface mount technology (SMT) printed circuit board assembly (PCBA). The information and experiences are provided through a discussion of critical equipment, material requirements and evaluations, as well as the selection methodology and criteria.